公开(公告)号：US20050147360A1

公开(公告)日：2005-07-07

申请号：US10922440

申请日：2004-08-19

申请人： Kyu-Sub Kwak ,  Young-Min Lee ,  June-Hyeon Ahn

发明人： Kyu-Sub Kwak ,  Young-Min Lee ,  June-Hyeon Ahn

IPC分类号： G02B6/42 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/0683 ,  H01S5/183 ,  G02B6/36

CPC分类号： H01S5/0683 ,  G02B6/4206 ,  H01S5/02284 ,  H01S5/0264 ,  H01S5/183 ,  H01S5/423

摘要： A vertical cavity surface emitting laser (VCSEL) module includes a substrate provided with an etched region formed on a lower surface thereof, a plurality of layers, for photoproduction, laminated on an upper surface of the substrate, and a VCSEL for emitting the light upwards and downwards, wherein the VCSEL module monitors the output of the VCSEL by detecting the light emitted downwards from the VCSEL.

摘要翻译： 垂直腔表面发射激光器（VCSEL）模块包括：衬底，其设置有形成在其下表面上的蚀刻区域，多个层，用于光生产，层压在衬底的上表面上;以及VCSEL，用于向上发射光 并且向下，其中VCSEL模块通过检测从VCSEL向下发射的光来监视VCSEL的输出。

公开(公告)号：US20070035323A1

公开(公告)日：2007-02-15

申请号：US11432064

申请日：2006-05-11

申请人： June-Hyeon Ahn ,  Young-Min Lee ,  Ho-Seong Seo ,  Kyu-Sub Kwak

发明人： June-Hyeon Ahn ,  Young-Min Lee ,  Ho-Seong Seo ,  Kyu-Sub Kwak

IPC分类号： G01R31/26

CPC分类号： H05K3/3442 ,  H05K1/145 ,  H05K2201/10454 ,  H05K2201/10492 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic circuit module and its fabricating method are provided. The electronic circuit module includes a first board and a second board having printed circuit patterns formed on the respective surfaces, and an electronic device disposed between the first board and the second board and having electrodes connected to the first board and the second board through a soldering process.

摘要翻译： 提供电子电路模块及其制造方法。 电子电路模块包括：第一板和第二板，其具有形成在各个表面上的印刷电路图案;以及电子装置，其设置在第一板和第二板之间，并具有通过焊接连接到第一板和第二板的电极 处理。

公开(公告)号：US07160038B2

公开(公告)日：2007-01-09

申请号：US10922440

申请日：2004-08-19

申请人： Kyu-Sub Kwak ,  Young-Min Lee ,  June-Hyeon Ahn

发明人： Kyu-Sub Kwak ,  Young-Min Lee ,  June-Hyeon Ahn

IPC分类号： G02B6/36 ,  H01S5/00

CPC分类号： H01S5/0683 ,  G02B6/4206 ,  H01S5/02284 ,  H01S5/0264 ,  H01S5/183 ,  H01S5/423

摘要： A vertical cavity surface emitting laser (VCSEL) module includes a substrate provided with an etched region formed on a lower surface thereof, a plurality of layers, for photoproduction, laminated on an upper surface of the substrate, and a VCSEL for emitting the light upwards and downwards, wherein the VCSEL module monitors the output of the VCSEL by detecting the light emitted downwards from the VCSEL.

摘要翻译： 垂直腔表面发射激光器（VCSEL）模块包括：衬底，其设置有形成在其下表面上的蚀刻区域，多个层，用于光生产，层压在衬底的上表面上;以及VCSEL，用于向上发射光 并且向下，其中VCSEL模块通过检测从VCSEL向下发射的光来监视VCSEL的输出。

公开(公告)号：US06952514B2

公开(公告)日：2005-10-04

申请号：US10683373

申请日：2003-10-10

申请人： Young-Min Lee ,  June-Hyeon Ahn ,  Kyu-Sub Kwak

发明人： Young-Min Lee ,  June-Hyeon Ahn ,  Kyu-Sub Kwak

IPC分类号： G02B6/34 ,  G02B6/42 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/183

CPC分类号： G02B6/12007 ,  G02B6/29368 ,  G02B6/4224 ,  G02B6/4238 ,  G02B6/4246

摘要： A coupling structure for coupling an optical waveguide and an optical device is provided. The coupling structure enables to precisely align the optical waveguide and the optical device so that an optical-alignment error can be reduced within a range of a few μm. The coupling structure includes a first substrate, at least one optical waveguide formed on the first substrate to transmit an optical signal, optical alignment dummy waveguides symmetrically aligned on the first substrate about the optical waveguide, a second substrate bonded to the first substrate, at least one optical device mounted on a bottom surface of the second substrate and optically connected to the optical waveguide, and optical-alignment patterns formed at the bottom surface of the second substrate corresponding to the optical alignment dummy waveguides, wherein an optical alignment for the optical waveguide and the optical device is achieved by aligning the optical alignment dummy waveguides with the optical-alignment patterns.

摘要翻译： 提供了用于耦合光波导和光学装置的耦合结构。 耦合结构使得能够精确地对准光波导和光学装置，使得可以在几个微米的范围内减少光学对准误差。 耦合结构包括第一衬底，形成在第一衬底上以传输光信号的至少一个光波导，围绕光波导对称地对准在第一衬底上的光学对准虚拟波导，至少结合到第一衬底的第二衬底 安装在所述第二基板的底表面上并光学连接到所述光波导的一个光学装置以及形成在所述第二基板的与所述光学对准虚拟波导对应的所述第二基板的底表面处的光学对准图案，其中所述光波导 并且通过使光学对准虚拟波导与光学对准图案对准来实现光学装置。

公开(公告)号：US07245644B2

公开(公告)日：2007-07-17

申请号：US10716653

申请日：2003-11-19

申请人： Byung-Kwon Kang ,  Shi-Yun Cho ,  In Kim ,  Do-Young Rhee ,  Tae-Il Kim ,  Dong-Hoon Jang ,  Seung-Won Lee ,  Duk-Ho Jeon ,  June-Hyeon Ahn ,  Young-Min Lee ,  Jong-Ryeol Kim

发明人： Byung-Kwon Kang ,  Shi-Yun Cho ,  In Kim ,  Do-Young Rhee ,  Tae-Il Kim ,  Dong-Hoon Jang ,  Seung-Won Lee ,  Duk-Ho Jeon ,  June-Hyeon Ahn ,  Young-Min Lee ,  Jong-Ryeol Kim

IPC分类号： H01S5/00

CPC分类号： H01S5/026 ,  H01S5/0265

摘要： A semiconductor monolithic integrated optical transmitter including a plurality of active layers formed on a semiconductor substrate is disclosed, which comprises: a distributed feedback laser diode including a grating for reflecting light with a predetermined wavelength and a first active layer for oscillating received light from the grating; an electro-absorption modulator including a second active layer for receiving light from the first active layer, wherein the received light intensity is modulated through a change of absorbency in accordance with an applied voltage; an optical amplifier including a third active layer for amplifying received light from the second active layer; a first optical attenuator between the first active layer and the second active layer; and a second optical attenuator between the second active layer and the third active layer.

摘要翻译： 公开了一种包括形成在半导体衬底上的多个有源层的半导体单片集成光发射器，其包括：分布反馈激光二极管，包括用于反射具有预定波长的光的光栅和用于振荡来自光栅的接收光的第一有源层 ; 一种电吸收调制器，包括用于接收来自第一有源层的光的第二有源层，其中根据施加的电压通过吸收变化改变接收的光强度; 光放大器，包括用于放大来自第二有源层的接收光的第三有源层; 第一有源层和第二有源层之间的第一光衰减器; 以及在第二有源层和第三有源层之间的第二光衰减器。

公开(公告)号：US20080237894A1

公开(公告)日：2008-10-02

申请号：US12054562

申请日：2008-03-25

申请人： Ki-Hyun KIM ,  Jin Yu ,  Young-Min Lee ,  June-Hyeon Ahn ,  Ho-Seong Seo ,  Youn-Ho Choi ,  Yong Jung ,  Taek-Yeong Lee ,  Young-Kun Jee

发明人： Ki-Hyun KIM ,  Jin Yu ,  Young-Min Lee ,  June-Hyeon Ahn ,  Ho-Seong Seo ,  Youn-Ho Choi ,  Yong Jung ,  Taek-Yeong Lee ,  Young-Kun Jee

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L23/3735 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/3512

摘要： Disclosed are an integrated circuit chip package and a method of connecting an integrated circuit chip and an attachment subject to each other while interposing an adhesive therebetween. The connection between integrated circuit chip and the attachment subject stress often leads to component failure and the addition of an interface layer with a similar thermal expansion coefficient improves reliability. The method may include applying the adhesive on the attachment subject, forming an interface layer between the integrated circuit chip and the adhesive wherein the interface layer has a thermal expansion coefficient similar to a thermal expansion coefficient of the integrated circuit chip. By connecting an integrated circuit chip and the attachment subject to each other by an adhesive via the interface layer, the generation of delamination is minimized and reliability is improved.

摘要翻译： 公开了一种集成电路芯片封装以及将集成电路芯片和附着物相互连接的方法，同时在其间插入粘合剂。 集成电路芯片与附件对象应力之间的连接常常导致元件故障，并且添加具有相似热膨胀系数的界面层可提高可靠性。 该方法可以包括将粘合剂施加到附着对象上，在集成电路芯片和粘合剂之间形成界面层，其中界面层具有类似于集成电路芯片的热膨胀系数的热膨胀系数。 通过经由界面层通过粘合剂将集成电路芯片和附着物彼此连接，使分层的产生最小化并提高可靠性。

公开(公告)号：US20050006654A1

公开(公告)日：2005-01-13

申请号：US10716653

申请日：2003-11-19

申请人： Byung-Kwon Kang ,  Shi-Yun Cho ,  In Kim ,  Do-Young Rhee ,  Tae-Il Kim ,  Dong-Hoon Jang ,  Seung-Won Lee ,  Duk-Ho Jeon ,  June-Hyeon Ahn ,  Young-Min Lee ,  Jong-Ryeol Kim

发明人： Byung-Kwon Kang ,  Shi-Yun Cho ,  In Kim ,  Do-Young Rhee ,  Tae-Il Kim ,  Dong-Hoon Jang ,  Seung-Won Lee ,  Duk-Ho Jeon ,  June-Hyeon Ahn ,  Young-Min Lee ,  Jong-Ryeol Kim

IPC分类号： G02B6/12 ,  H01L33/00 ,  H01S5/026

CPC分类号： H01S5/026 ,  H01S5/0265

摘要： A semiconductor monolithic integrated optical transmitter including a plurality of active layers formed on a semiconductor substrate is disclosed, which comprises: a distributed feedback laser diode including a grating for reflecting light with a predetermined wavelength and a first active layer for oscillating received light from the grating; an electro-absorption modulator including a second active layer for receiving light from the first active layer, wherein the received light intensity is modulated through a change of absorbency in accordance with an applied voltage; an optical amplifier including a third active layer for amplifying received light from the second active layer; a first optical attenuator between the first active layer and the second active layer; and a second optical attenuator between the second active layer and the third active layer.

摘要翻译： 公开了一种包括形成在半导体衬底上的多个有源层的半导体单片集成光发射器，其包括：分布反馈激光二极管，包括用于反射具有预定波长的光的光栅和用于振荡来自光栅的接收光的第一有源层 ; 一种电吸收调制器，包括用于接收来自第一有源层的光的第二有源层，其中根据施加的电压通过吸收变化改变接收的光强度; 光放大器，包括用于放大来自第二有源层的接收光的第三有源层; 第一有源层和第二有源层之间的第一光衰减器; 以及在第二有源层和第三有源层之间的第二光衰减器。

公开(公告)号：US20080029871A1

公开(公告)日：2008-02-07

申请号：US11672634

申请日：2007-02-08

申请人： Hong-Kweun KIM ,  June-Hyeon Ahn ,  Ki-Hyun Kim ,  Seok-Myong Kang ,  Youn-Ho Choi

发明人： Hong-Kweun KIM ,  June-Hyeon Ahn ,  Ki-Hyun Kim ,  Seok-Myong Kang ,  Youn-Ho Choi

IPC分类号： H01L23/52 ,  H05K1/00

CPC分类号： H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/49109 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Disclosed is an interposer including a polyhedral body having first and second surfaces facing each other, a plurality of electric terminals formed on the first surface; and a plurality of vias extending through the first and second surfaces. In addition, a semiconductor package includes a printed circuit board having a plurality of electric contacts formed on an upper surface and an interposer having first and second surfaces facing each other, vias extending through the first and second surfaces, and first electric terminals formed on the first surface. The interposer is seated on the printed circuit board so that the vias correspond to the electric contacts.

摘要翻译： 公开了一种包括具有彼此面对的第一和第二表面的多面体的插入件，形成在第一表面上的多个电端子; 以及延伸穿过第一和第二表面的多个通孔。 此外，半导体封装包括具有形成在上表面上的多个电触头的印刷电路板和具有彼此面对的第一和第二表面的插入件，并且延伸穿过第一和第二表面的通孔以及形成在第一和第二表面上的第一电端子 第一表面。 插入器位于印刷电路板上，使得通孔对应于电触点。

公开(公告)号：US20080123309A1

公开(公告)日：2008-05-29

申请号：US11944650

申请日：2007-11-26

申请人： Seok-Myong KANG ,  Hong-Kweun Kim ,  June-Hyeon Ahn ,  Ki-Hyun Kim ,  Youn-Ho Choi

发明人： Seok-Myong KANG ,  Hong-Kweun Kim ,  June-Hyeon Ahn ,  Ki-Hyun Kim ,  Youn-Ho Choi

IPC分类号： H05K1/18

CPC分类号： H05K1/183 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/46 ,  H05K3/4697 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A main board suitable for slim configurations is disclosed. The main board includes a multi-layer Printed Circuit Board (PCB) in which at least one recess is formed, a first integrated circuit placed in the recess, and a molding that covers the first integrated circuit and the bottom of the recess. The main board further comprising a cover over said recess, said cover being a second integrated circuit or a second PC board, which may further having attached an integrated circuit positioned within the recess.

摘要翻译： 公开了适用于细长结构的主板。 主板包括多层印刷电路板（PCB），其中形成有至少一个凹部，放置在凹槽中的第一集成电路以及覆盖第一集成电路和凹部底部的模制件。 所述主板还包括在所述凹部上的盖，所述盖是第二集成电路或第二PC板，其可以进一步具有连接在所述凹部内的集成电路。

公开(公告)号：US07755909B2

公开(公告)日：2010-07-13

申请号：US11944650

申请日：2007-11-26

申请人： Seok-Myong Kang ,  Hong-Kweun Kim ,  June-Hyeon Ahn ,  Ki-Hyun Kim ,  Youn-Ho Choi

发明人： Seok-Myong Kang ,  Hong-Kweun Kim ,  June-Hyeon Ahn ,  Ki-Hyun Kim ,  Youn-Ho Choi

IPC分类号： H05K1/18

CPC分类号： H05K1/183 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/46 ,  H05K3/4697 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A main board suitable for slim configurations is disclosed. The main board includes a multi-layer Printed Circuit Board (PCB) in which at least one recess is formed, a first integrated circuit placed in the recess, and a molding that covers the first integrated circuit and the bottom of the recess. The main board further comprising a cover over said recess, said cover being a second integrated circuit or a second PC board, which may further having attached an integrated circuit positioned within the recess.

摘要翻译： 公开了适用于细长结构的主板。 主板包括多层印刷电路板（PCB），其中形成有至少一个凹部，放置在凹槽中的第一集成电路以及覆盖第一集成电路和凹部底部的模制件。 所述主板还包括在所述凹部上的盖，所述盖是第二集成电路或第二PC板，其可以进一步具有连接在所述凹部内的集成电路。