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公开(公告)号:US12145852B2
公开(公告)日:2024-11-19
申请号:US17293112
申请日:2019-11-13
Applicant: NIPPON STEEL Chemical & Material Co., Ltd.
Inventor: Katsumasa Yagi , Dota Saito , Mutsuhito Tanaka , Masanori Ae , Hiroyuki Deai
Abstract: The purpose of the present invention is to provide: silica particles of which the maximum particle diameter can be minimized and which can achieve proper fluidability that cannot be achieved by the conventional techniques; and silica spherical particles which, when used as a filler for a heat-dissipating sheet, can achieve excellent heat conductivity and flexibility. Silica spherical particles characterized in that, when particles each having a size of 5 μm or more and imaged by an optical measurement are observed, the particle diameter of each of the particles, which is determined from the image, satisfies the following requirements. Requirements: D99≤29 μm, and 10 μm≤Dmode
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公开(公告)号:US20240266313A1
公开(公告)日:2024-08-08
申请号:US18685871
申请日:2022-10-18
Inventor: Tomohiro UNO , Tetsuya OYAMADA , Daizo ODA , Motoki ETO
IPC: H01L23/00 , G01N23/203 , G01N23/2276
CPC classification number: H01L24/45 , H01L24/43 , G01N23/203 , G01N23/2276 , G01N2223/601 , G01N2223/602 , G01N2223/611 , H01L2224/4321 , H01L2224/437 , H01L2224/43825 , H01L2224/43848 , H01L2224/45147 , H01L2224/45541 , H01L2224/45644 , H01L2224/45655 , H01L2224/45664 , H01L2924/01005 , H01L2924/01012 , H01L2924/01015 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01034 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01052 , H01L2924/3512 , H01L2924/365
Abstract: A bonding wire includes a core material of Cu or Cu alloy, and a coating layer containing a conductive metal other than Cu on a surface of the core material. In a concentration profile in a depth direction of the wire obtained, an average value of sum of a Pd concentration CPd (atomic %) and an Ni concentration CNi (atomic %) for measurement points in the coating layer is 50 atomic % or more, an average value of a ratio of CPd to CNi for measurement points in the coating layer is from 0.2 to 20 and a thickness of the coating layer is from 20 nm to 180 nm. An Au concentration CAu at a surface of the wire is from 10 atomic % to 85 atomic %. An average size of crystal grains in a circumferential direction of the wire is from 35 nm to 200 nm.
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公开(公告)号:US20240254607A1
公开(公告)日:2024-08-01
申请号:US18561574
申请日:2022-05-16
Applicant: NIPPON STEEL Chemical & Material Co., Ltd.
Inventor: Shouhei KAWAI , Hiroto UNNO , Jun NAKATSUKA
IPC: C22C38/52 , B22F3/15 , B22F3/17 , B22F3/24 , B22F9/08 , C22C38/00 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/22 , C22C38/28 , C22C38/50
CPC classification number: C22C38/52 , B22F3/15 , B22F3/17 , B22F3/24 , B22F9/082 , C22C38/001 , C22C38/002 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/22 , C22C38/28 , C22C38/50 , B22F2003/248 , B22F2009/0824 , B22F2301/35 , B22F2998/10 , B22F2999/00
Abstract: Stainless steel foil with a flattening film reducing the number of pits present on the stainless steel foil surface and free of cracks occurring at the flattening film, that is, stainless steel foil with a flattening film, comprising the stainless steel foil having a composition comprising stainless steel constituents and having a balance comprised of Fe and impurities, inclusions having particle diameter 2.00 μm or more comprising Al2O3:30 mass % or less and MgO:10 mass % or less with respect to a total mass of the particle diameter 2.00 μm or more inclusions, among the particle diameter 2.00 μm or more inclusions, the number of inclusions having particle diameter more than 5.00 μm present on the surface being 20/cm2 or less, and having a sheet thickness of 5.0 μm or more and 100.0 μm or less and the flattening film having a film thickness of 0.3 μm or more and 5.0 μm or less on at least one surface of the stainless steel foil.
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公开(公告)号:US12037427B2
公开(公告)日:2024-07-16
申请号:US17277074
申请日:2019-09-26
Applicant: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Inventor: Masanao Kawabe , Tadashi Kuratomi , Shinichi Iwashita
IPC: C08F212/08 , B60C1/00 , C08F2/06 , C08F2/44 , C08F8/42 , C08F210/14 , C08F212/02 , C08F212/12 , C08F212/32 , C08F212/34 , C08F212/36 , C08F232/08 , C08F236/10 , C08F255/08 , C08F257/00 , C08F257/02 , C08F277/00 , C08F289/00 , C08K3/013 , C08K3/22 , C08L25/04 , C08L51/00 , C08L51/06 , C08K3/04 , C08K3/36
CPC classification number: C08F212/08 , B60C1/00 , C08F2/06 , C08F2/44 , C08F8/42 , C08F210/14 , C08F212/02 , C08F212/12 , C08F212/32 , C08F212/34 , C08F212/36 , C08F232/08 , C08F236/10 , C08F255/08 , C08F257/00 , C08F257/02 , C08F277/00 , C08F289/00 , C08K3/013 , C08K3/22 , C08L25/04 , C08L51/003 , C08L51/06 , C08K3/04 , C08K2003/2296 , C08K3/36 , Y02T10/86 , C08F232/08 , C08F212/36 , C08F212/12 , C08F257/02 , C08F236/10 , C08F212/08 , C08F210/14 , C08F212/36 , C08F212/12 , C08F212/08 , C08F255/08 , C08F236/10 , C08F212/08 , C08F277/00 , C08F236/10 , C08F212/08 , C08L51/003 , C08L91/00 , C08K3/04 , C08K3/06 , C08K3/22 , C08K3/36 , C08K5/09 , C08L51/06 , C08L91/00 , C08K3/04 , C08K3/22 , C08K5/09 , C08K3/06 , C08K3/36 , C08K3/04 , C08L51/06 , C08K3/36 , C08L51/06 , C08F210/14 , C08F212/08 , C08F212/36 , C08F212/12 , C08F2500/02 , C08F2500/32 , C08K3/22 , C08L51/06 , C08F212/36 , C08F232/08 , C08F212/08 , C08F212/36 , C08F210/14 , C08F212/32 , C08F212/36 , C08F212/12 , C08F212/32 , C08F4/14 , C08F212/12 , C08F4/14 , C08F212/36 , C08F4/14 , C08F212/08 , C08F4/14 , C08F289/00 , C08F236/06 , C08F212/08 , C08F257/02 , C08F236/06 , C08F212/08 , C08F212/08 , C08F210/14 , C08F212/36 , C08F212/12 , C08F210/14 , C08F4/14 , C08F255/08 , C08F236/06 , C08F212/08 , C08F232/08 , C08F212/12 , C08F212/36 , C08F212/08 , C08F212/36 , C08F212/12
Abstract: Provided is a polyfunctional vinyl aromatic copolymer having reactivity and solubility that can be used for manufacturing a copolymer rubber and a copolymer rubber material having processability, strength and homogeneity obtained therefrom. The polyfunctional vinyl aromatic copolymer includes: 0.5 mol % or more and 40 mol % or less of a structural unit (a) derived from a divinyl aromatic compound and 60 mol % or more and 99.5 mol % or less of a structural unit (b) derived from a monovinyl aromatic compound, in which at least some of the structural units (a) are a crosslinked structural unit (a2) represented by the following Formula (2) and a vinyl-group-containing structural unit (a1) represented by the following Formula (1):
in the formulas, R1's independently represent an aromatic hydrocarbon group having 6 to 30 carbon atoms.-
公开(公告)号:US20240237523A1
公开(公告)日:2024-07-11
申请号:US18286724
申请日:2022-05-27
Applicant: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Inventor: Yuji IKENAGA , Takahiro KAI , Kentaro HAYASHI , Mitsuru SAKAI , Yuya SHIMAMOTO
IPC: H10K85/60 , C07D209/86 , C09K11/06 , H10K50/12 , H10K71/16 , H10K101/00
CPC classification number: H10K85/6572 , C07D209/86 , C09K11/06 , H10K71/16 , C09K2211/1018 , H10K50/12 , H10K2101/90
Abstract: To provide a practically useful organic EL device having a low driving voltage and also having a high efficiency and a long lifetime, and a deuteride suitable therefor. A deuteride of a compound represented by the following general formula (1), in which a rate of deuteration of hydrogen atoms on aromatic rings in Ar1 and Ar2 in a compound represented by the following general formula (1) is 40% or more, wherein Ar1 and Ar2 each independently represent a substituted or unsubstituted aromatic hydrocarbon group having 6 to 30 carbon atoms, or a substituted or unsubstituted linked aromatic group in which two to five of these aromatic rings are linked to each other, and aromatic hydrocarbon groups in the case of these aromatic rings linked are the same as or different from each other.
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公开(公告)号:US20240170680A1
公开(公告)日:2024-05-23
申请号:US18284421
申请日:2022-03-29
Applicant: NIPPON STEEL Chemical & Material Co., Ltd.
Inventor: Takuya OGURA , Tatsuo NAGATA , Naoki FUJIMOTO , Nobumasa KOSUGI
CPC classification number: H01M4/667 , C25D3/12 , C25D5/605 , H01M4/662 , H01M2004/021 , H01M4/0452
Abstract: The steel foil for a current collector according to the present disclosure includes a base material, and a Ni plating layer formed on the surface of the base material. When an arithmetic average roughness of the surface of the Ni plating layer is defined as “Ra”, a mean distance between peaks formed on the surface of the Ni plating layer and identified by line roughness analysis is defined as “D”, and a mean radius of curvature of peaks formed on the surface of the Ni plating layer and identified by surface roughness analysis is defined as “r”, Ra×D is 0.060 to 0.400 μm2 and r is 0.010 to 0.500 μm.
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公开(公告)号:US20240110262A1
公开(公告)日:2024-04-04
申请号:US18275599
申请日:2022-01-31
Inventor: Tomohiro UNO , Yuya SUTO , Tetsuya OYAMADA , Daizo ODA , Yuto KURIHARA , Motoki ETO
IPC: C22C21/14 , C22C1/02 , C22C21/00 , C22C21/02 , C22C21/08 , C22C21/16 , C22F1/043 , C22F1/047 , C22F1/057 , H01L23/00
CPC classification number: C22C21/14 , C22C1/026 , C22C21/00 , C22C21/02 , C22C21/08 , C22C21/16 , C22F1/043 , C22F1/047 , C22F1/057 , H01L24/45 , H01L2224/45124
Abstract: There is provided an Al wiring material which can achieve sufficient bond reliability of bonded parts in a high-temperature environment at the time when a semiconductor device operates. The Al wiring material containing one or more of Pd and Pt so as to satisfy
3≤x1a≤90 or 10≤x1b≤250, and
3≤(x1a+x1b)≤300,
where x1a and x1b are respectively a content of Pd [mass ppm] and a content of Pt [mass ppm],
with the balance comprising Al, and
an average crystal grain diameter on a cross-section perpendicular to a longitudinal direction of the Al wiring material is 3 to 35 μm.-
公开(公告)号:US11891122B2
公开(公告)日:2024-02-06
申请号:US17569087
申请日:2022-01-05
Inventor: Chikara Kawamura , Tetsuya Sugiyama
CPC classification number: B62D29/043 , B60R19/18 , B62D25/025 , B62D25/04 , B60R2019/1853 , B62D21/152
Abstract: Provided is a frame which is made of a fiber reinforced composite and has an increased bending strength by suppressing occurrence of buckling. The frame which is made of a fiber reinforced composite includes: a compressive wall part where a compressive stress occurs in a longitudinal direction of the frame when the frame receives a bending load in a normal direction perpendicularly intersecting the longitudinal direction; and a side wall part extending in the normal direction and defining one of corners with the compressive wall part. The compressive wall part includes a longitudinal alignment layer having reinforcement fibers aligned in the longitudinal direction. The side wall part has a surface section composed of a normal directional alignment layer having reinforcement fibers aligned in a direction different from the longitudinal direction, and serving as a differential alignment layer.
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公开(公告)号:US11827739B2
公开(公告)日:2023-11-28
申请号:US17440006
申请日:2020-03-25
Applicant: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Inventor: Tsugutoshi Wasano , Kazuo Ishihara , Kazuhiko Nakahara
CPC classification number: C08G59/04 , C08G61/10 , C08G2261/124 , C08G2261/1424 , C08G2261/312 , C08G2261/314 , C08G2261/78
Abstract: There are provided a naphthol resin and an epoxy resin that impart characteristics such as high heat resistance, a low dielectric loss tangent, and a low coefficient of thermal expansion (CTE), and an epoxy resin composition including the naphthol resin or the epoxy resin as an essential component, and cured products thereof. A naphthol resin which is represented by the following formula:
where R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents the number of repetitions and is a number of 2 to 10, and in which, in terms of area ratio in GPC measurement, a ratio of components for which n=6 or more is 15% or more, and a ratio of components for which n=1 in GPC is 30% or less, and a hydroxy group equivalent is 260 to 400 g/eq.-
公开(公告)号:US20230279278A1
公开(公告)日:2023-09-07
申请号:US18014750
申请日:2021-07-09
Applicant: NIPPON STEEL Chemical & Material Co., Ltd.
Inventor: Takahiro YOSHIOKA , Hiroyuki TAKAHASHI
IPC: C09J171/12 , C09J7/38 , C09J167/00 , B32B7/12 , B32B27/08 , B32B15/098 , B32B27/36 , B32B27/42 , B32B15/09
CPC classification number: C09J171/12 , C09J7/38 , C09J167/00 , B32B7/12 , B32B27/08 , B32B15/098 , B32B27/36 , B32B27/42 , B32B15/09 , B32B15/18
Abstract: An adhesive resin composition for bonding two adherends of different materials together, the composition comprising a phenoxy resin and a polyester elastomer at a weight ratio (phenoxy resin:polyester elastomer) ranging from 20:80 to 80:20, wherein the area of portions where solid matter forms a phase separation structure attributed to both of the phenoxy resin and the polyester elastomer is at most 1 area % of an entire observation area in an elastic modulus phase image of a plurality of arbitrarily defined 10-μm square regions observed by an atomic force microscope (AFM) to which a probe having a tip radius of curvature of 10 nm at 25° C. is attached.
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