Silica spherical particles for semiconductor sealing material

    公开(公告)号:US12145852B2

    公开(公告)日:2024-11-19

    申请号:US17293112

    申请日:2019-11-13

    Abstract: The purpose of the present invention is to provide: silica particles of which the maximum particle diameter can be minimized and which can achieve proper fluidability that cannot be achieved by the conventional techniques; and silica spherical particles which, when used as a filler for a heat-dissipating sheet, can achieve excellent heat conductivity and flexibility. Silica spherical particles characterized in that, when particles each having a size of 5 μm or more and imaged by an optical measurement are observed, the particle diameter of each of the particles, which is determined from the image, satisfies the following requirements. Requirements: D99≤29 μm, and 10 μm≤Dmode

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