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    Injection molding system and method of chip package
    4.
    发明授权
    Injection molding system and method of chip package 有权
    注塑系统和芯片封装方法

    公开(公告)号：US08293572B2

    公开(公告)日：2012-10-23

    申请号：US13010192

    申请日：2011-01-20

    申请人： Wen-Chuan Chen ,  Nan-Chun Lin

    发明人： Wen-Chuan Chen ,  Nan-Chun Lin

    IPC分类号： H01L21/00

    CPC分类号： H01L21/565 ,  B29C45/14639 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00

    摘要： The injection molding system comprises a substrate, an inner cover, a molding tool, and a bottom plate. The substrate is used to locate at least one semiconductor device under molding and the inner cover with at least one first injection via, cavity and runner placed over the substrate. In addition, the molding tool includes at least one second injecting via aligned with the runner and the bottom plate is placed under the substrate. Furthermore, a filling material is filled into the cavity and runner of the inner cover during molding. In order to avoid overflowing the filling material, the system further comprises an O-ring placed between the molding tool and the inner cover. The inner radius of the O-ring corresponds with the inner radius of the injection via and is aligned with it.

    摘要翻译： 注塑系统包括基底，内盖，模制工具和底板。 衬底用于在模制下定位至少一个半导体器件，并且内盖具有放置在衬底上的至少一个第一注入通孔，空腔和流道。 此外，成型工具包括至少一个与流道对准的第二注射孔，并且底板被放置在基底之下。 此外，在成型期间，将填充材料填充到内盖的空腔和流道中。 为了避免填充材料溢出，系统还包括置于模制工具和内盖之间的O形环。 O形环的内半径对应于注射通孔的内半径并与其对准。

    INJECTION MOLDING SYSTEM AND METHOD OF CHIP PACKAGE
    6.
    发明申请
    INJECTION MOLDING SYSTEM AND METHOD OF CHIP PACKAGE 有权
    注射成型系统和芯片包装方法

    公开(公告)号：US20120187582A1

    公开(公告)日：2012-07-26

    申请号：US13010192

    申请日：2011-01-20

    申请人： Wen-Chuan Chen ,  Nan-Chun Lin

    发明人： Wen-Chuan Chen ,  Nan-Chun Lin

    IPC分类号： H01L23/28 ,  B29C45/14 ,  H01L21/56

    CPC分类号： H01L21/565 ,  B29C45/14639 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00

    摘要： The injection molding system comprises a substrate, an inner cover, a molding tool, and a bottom plate. The substrate is used to locate at least one semiconductor device under molding and the inner cover with at least one first injection via, cavity and runner placed over the substrate. In addition, the molding tool includes at least one second injecting via aligned with the runner and the bottom plate is placed under the substrate. Furthermore, a filling material is filled into the cavity and runner of the inner cover during molding. In order to avoid overflowing the filling material, the system further comprises an O-ring placed between the molding tool and the inner cover. The inner radius of the O-ring corresponds with the inner radius of the injection via and is aligned with it.

    摘要翻译： 注塑系统包括基底，内盖，模制工具和底板。 衬底用于在模制下定位至少一个半导体器件，并且内盖具有放置在衬底上的至少一个第一注入通孔，空腔和流道。 此外，成型工具包括至少一个与流道对准的第二注射孔，并且底板被放置在基底之下。 此外，在成型期间，将填充材料填充到内盖的空腔和流道中。 为了避免填充材料溢出，系统还包括置于模制工具和内盖之间的O形环。 O形环的内半径对应于注射通孔的内半径并与其对准。

    METHOD FOR DIE BONDING HAVING PICK-AND-PROBING FEATURE
    8.
    发明申请
    METHOD FOR DIE BONDING HAVING PICK-AND-PROBING FEATURE 审中-公开
    具有拾音和探测特征的DIE接合方法

    公开(公告)号：US20090227048A1

    公开(公告)日：2009-09-10

    申请号：US12042093

    申请日：2008-03-04

    申请人： Li-Chih FANG ,  Wen-Jeng Fan ,  Nan-Chun Lin

    发明人： Li-Chih FANG ,  Wen-Jeng Fan ,  Nan-Chun Lin

    IPC分类号： H01L21/66

    CPC分类号： H01L21/67144 ,  H01L21/67271

    摘要： Disclosed is a die-bonding method having pick-and-probe features after wafer sawing where at least a die is probed and sorted according to different grades during a pick-and-place step performed after wafer sawing. A suction nozzle having a plurality of probes is utilized to probe the electrical terminals of the die. After picking, the suction nozzle is moved on a common moving path and the picked die is tested through the suction nozzle. The picked-and-probed die is moved and die-bonded to a die carrier loaded in a corresponding one of a plurality of die-bonding areas by moving the Suction nozzle on a chosen sorting path. Therefore, the die is probed and sorted during die-bonding processes. Higher graded dice at a same level are assembled on a same die carrier to form a higher graded semiconductor package.

    摘要翻译： 公开了一种在晶片锯切之后具有拾取和探针特征的芯片接合方法，其中在晶片锯切之后执行的拾取和放置步骤期间，至少一个模具被探测并根据不同的等级进行分类。 使用具有多个探针的吸嘴来探测管芯的电端子。 拾取后，吸嘴在公共移动路径上移动，并通过吸嘴测试拾取的模具。 通过在所选择的分选路径上移动吸入喷嘴，将拾取和探测的模具移动并压模到装载在多个芯片接合区域中的相应的一个芯片接合区域中的模具载体。 因此，在芯片接合工艺期间探针和分选。 相同级别的较高分级骰子组装在相同的裸片载体上以形成更高级别的半导体封装。