公开(公告)号：US08610267B2

公开(公告)日：2013-12-17

申请号：US12840900

申请日：2010-07-21

申请人： Ching-Jung Yang ,  Chang-Pin Huang ,  Tzuan-Horng Liu ,  Michael Shou-Ming Tong ,  Ying-Ju Chen ,  Tung-Liang Shao ,  Hsien-Wei Chen ,  Hao-Yi Tsai ,  Mirng-Ji Lii

发明人： Ching-Jung Yang ,  Chang-Pin Huang ,  Tzuan-Horng Liu ,  Michael Shou-Ming Tong ,  Ying-Ju Chen ,  Tung-Liang Shao ,  Hsien-Wei Chen ,  Hao-Yi Tsai ,  Mirng-Ji Lii

IPC分类号： H01L23/48

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/93 ,  H01L25/0657 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81447 ,  H01L2224/81464 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A die includes a metal pad, a passivation layer, and a patterned buffer layer over the passivation layer. The patterned buffer layer includes a plurality of discrete portions separated from each other. An under-bump-metallurgy (UBM) is formed in an opening in the patterned buffer layer and an opening in the passivation layer. A metal bump is formed over and electrically coupled to the UBM.

公开(公告)号：US08531032B2

公开(公告)日：2013-09-10

申请号：US13224487

申请日：2011-09-02

申请人： Chen-Hua Yu ,  Chih-Hang Tung ,  Tung-Liang Shao

发明人： Chen-Hua Yu ,  Chih-Hang Tung ,  Tung-Liang Shao

IPC分类号： H01L23/498

CPC分类号： H01L23/3675 ,  H01L21/4871 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/49816 ,  H01L23/5329 ,  H01L24/19 ,  H01L25/0657 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2225/06513 ,  H01L2225/06589 ,  H01L2924/15321 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/181 ,  H01L2924/00

摘要： A multi-chip semiconductor device comprises a thermally enhanced structure, a first semiconductor chip, a second semiconductor chip, an encapsulation layer formed on top of the first semiconductor chip and the second semiconductor chip. The multi-chip semiconductor device further comprises a plurality of thermal vias formed in the encapsulation layer. The thermally enhanced structure comprises a heat sink block attached to a first semiconductor die. The heat sink block may further comprise a variety of thermal vias and thermal openings. By employing the thermal enhanced structure, the thermal performance of the multi-chip semiconductor device can be improved.

公开(公告)号：US20130056871A1

公开(公告)日：2013-03-07

申请号：US13224487

申请日：2011-09-02

申请人： Chen-Hua Yu ,  Chih-Hang Tung ,  Tung-Liang Shao

发明人： Chen-Hua Yu ,  Chih-Hang Tung ,  Tung-Liang Shao

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L23/3675 ,  H01L21/4871 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/49816 ,  H01L23/5329 ,  H01L24/19 ,  H01L25/0657 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2225/06513 ,  H01L2225/06589 ,  H01L2924/15321 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/181 ,  H01L2924/00

摘要： A multi-chip semiconductor device comprises a thermally enhanced structure, a first semiconductor chip, a second semiconductor chip, an encapsulation layer formed on top of the first semiconductor chip and the second semiconductor chip. The multi-chip semiconductor device further comprises a plurality of thermal vias formed in the encapsulation layer. The thermally enhanced structure comprises a heat sink block attached to a first semiconductor die. The heat sink block may further comprise a variety of thermal vias and thermal openings. By employing the thermal enhanced structure, the thermal performance of the multi-chip semiconductor device can be improved.

公开(公告)号：US20130037950A1

公开(公告)日：2013-02-14

申请号：US13206694

申请日：2011-08-10

申请人： Chun Hui Yu ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Chen-Hua Yu ,  Da-Yuan Shih

发明人： Chun Hui Yu ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Chen-Hua Yu ,  Da-Yuan Shih

IPC分类号： H01L23/485 ,  H01L21/82 ,  H01L21/56

CPC分类号： H01L23/481 ,  H01L21/563 ,  H01L21/568 ,  H01L21/76805 ,  H01L21/76838 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/8203 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/83005

摘要： A multi-chip wafer level package comprises three stacked semiconductor dies. A first semiconductor die is embedded in a first photo-sensitive material layer. A second semiconductor die is stacked on top of the first semiconductor die wherein the second semiconductor die is face-to-face coupled to the first semiconductor die. A third semiconductor die is back-to-back attached to the second semiconductor die. Both the second semiconductor die and the third semiconductor die are embedded in a second photo-sensitive material layer. The multi-chip wafer level package further comprises a plurality of through assembly vias formed in the first photo-sensitive material layer and the second photo-sensitive material layer.

摘要翻译： 多芯片晶片级封装包括三个堆叠的半导体管芯。 第一半导体管芯被嵌入在第一光敏材料层中。 第二半导体管芯堆叠在第一半导体管芯的顶部上，其中第二半导体管芯与第一半导体管芯面对面连接。 第三半导体管芯背靠背连接到第二半导体管芯。 第二半导体管芯和第三半导体管芯都嵌入第二光敏材料层。 多芯片晶片级封装还包括形成在第一光敏材料层和第二光敏材料层中的多个通过组装通孔。

公开(公告)号：US07911556B2

公开(公告)日：2011-03-22

申请号：US12691718

申请日：2010-01-21

申请人： Chi-chun Yang ,  Tung-liang Shao ,  Ye-hen Chien

发明人： Chi-chun Yang ,  Tung-liang Shao ,  Ye-hen Chien

IPC分类号： G02F1/1333

CPC分类号： G02B6/009 ,  G02B6/0071 ,  G02F1/133608 ,  G02F1/133615

摘要： A backlight module having replaceable lamp module is provided. The backlight module includes a replaceable lamp module, a light-guiding plate, a frame and a positioning and protecting mechanism. The light-guiding plate is disposed over the bottom surface among four sides of the frame, wherein one side of the light-guiding plate and a corresponding side of the frame form a sliding groove. The replaceable lamp module is set in the sliding groove and slidably along the sliding groove. The positioning and protecting mechanism comprises a protecting device set on the replaceable lamp module and a positioning device set on the frame. The protecting device is capable of forming a gap between the replaceable lamp module and the bottom of the sliding groove in order to protect the replaceable lamp module from scraped by the structures of the backlight module while the replaceable lamp module is inserting into the sliding groove. The protecting device and the positioning device are capable of positioning and holding the replaceable lamp module in the sliding groove while the replaceable lamp module reaches the predetermined position in the backlight module, and meantime the gap is disappeared.

摘要翻译： 提供具有可更换灯模块的背光模块。 背光模块包括可替换的灯模块，导光板，框架和定位和保护机构。 导光板设置在框架的四个侧面的底面之上，其中导光板的一侧和框架的相应侧面形成滑动槽。 可更换的灯模块设置在滑动槽中并且可沿着滑动槽滑动。 定位和保护机构包括设置在可更换灯模块上的保护装置和设置在框架上的定位装置。 保护装置能够在可更换的灯模块和滑动槽的底部之间形成间隙，以便在可更换的灯模块插入到滑动槽中时，保护可替换的灯模块被背光模块的结构刮掉。 保护装置和定位装置能够将可更换的灯模块定位并保持在滑动槽中，同时可更换的灯模块到达背光模块中的预定位置，同时间隙消失。

公开(公告)号：US20100118517A1

公开(公告)日：2010-05-13

申请号：US12691718

申请日：2010-01-21

申请人： Chi-chun Yang ,  Tung-liang Shao ,  Ye-hen Chien

发明人： Chi-chun Yang ,  Tung-liang Shao ,  Ye-hen Chien

IPC分类号： G09F13/04

CPC分类号： G02B6/009 ,  G02B6/0071 ,  G02F1/133608 ,  G02F1/133615

摘要： A backlight module having replaceable lamp module is provided. The backlight module includes a replaceable lamp module, a light-guiding plate, a frame and a positioning and protecting mechanism. The light-guiding plate is disposed over the bottom surface among four sides of the frame, wherein one side of the light-guiding plate and a corresponding side of the frame form a sliding groove. The replaceable lamp module is set in the sliding groove and slidably along the sliding groove. The positioning and protecting mechanism comprises a protecting device set on the replaceable lamp module and a positioning device set on the frame. The protecting device is capable of forming a gap between the replaceable lamp module and the bottom of the sliding groove in order to protect the replaceable lamp module from scraped by the structures of the backlight module while the replaceable lamp module is inserting into the sliding groove. The protecting device and the positioning device are capable of positioning and holding the replaceable lamp module in the sliding groove while the replaceable lamp module reaches the predetermined position in the backlight module, and meantime the gap is disappeared.

摘要翻译： 提供具有可更换灯模块的背光模块。 背光模块包括可替换的灯模块，导光板，框架和定位和保护机构。 导光板设置在框架的四个侧面的底面之上，其中导光板的一侧和框架的相应侧面形成滑动槽。 可更换的灯模块设置在滑动槽中并且可沿着滑动槽滑动。 定位和保护机构包括设置在可更换灯模块上的保护装置和设置在框架上的定位装置。 保护装置能够在可更换的灯模块和滑动槽的底部之间形成间隙，以便在可更换的灯模块插入到滑动槽中时，保护可替换的灯模块被背光模块的结构刮掉。 保护装置和定位装置能够将可更换的灯模块定位并保持在滑动槽中，同时可更换的灯模块到达背光模块中的预定位置，同时间隙消失。

公开(公告)号：US08227822B2

公开(公告)日：2012-07-24

申请号：US12577895

申请日：2009-10-13

申请人： Chun Chang Hung ,  Tung Liang Shao ,  Falcon Lin

发明人： Chun Chang Hung ,  Tung Liang Shao ,  Falcon Lin

IPC分类号： H01L29/18 ,  H01L33/00

CPC分类号： H01L33/507 ,  G02F1/133603 ,  G02F1/133606 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light emitting diode apparatus comprises a substrate having a circuit pattern, a reflection layer disposed on the substrate, at least one light emitting element disposed on the reflection layer, a reflector disposed around the at t one light emitting element, a sealing material formed over the at least one light emitting element and a phosphor layer disposed over the sealing material. The light emitting element comprises a conductive portion electrically coupled to the circuit pattern. In one embodiment, a plurality of light emitting elements are linearly arrayed, and a spacer is disposed between every two adjacent light emitting elements.

摘要翻译： 发光二极管装置包括具有电路图案的基板，设置在基板上的反射层，设置在反射层上的至少一个发光元件，设置在第一个发光元件周围的反射器，形成在其上的密封材料 所述至少一个发光元件和设置在所述密封材料上的荧光体层。 发光元件包括电耦合到电路图案的导电部分。 在一个实施例中，多个发光元件被线性排列，并且间隔物设置在每两个相邻的发光元件之间。

公开(公告)号：US07581866B2

公开(公告)日：2009-09-01

申请号：US11622807

申请日：2007-01-12

申请人： Tung-liang Shao ,  Chi-chun Yang ,  Ye-hen Chien

发明人： Tung-liang Shao ,  Chi-chun Yang ,  Ye-hen Chien

IPC分类号： F21V33/00 ,  G02F1/1335

CPC分类号： G02F1/1309 ,  F21V19/04 ,  G02F1/133604 ,  G02F1/133615 ,  G02F2001/133325 ,  G02F2001/133328 ,  G02F2001/133612

摘要： A lamp module for use in a liquid crystal display includes a lamp tube, a reflector, a dismantling mechanism disposed on the reflector. The reflector comprises a first side, a second side, and a third side forming a sink, for accommodating the lamp tube and reflecting light from the lamp tube. The dismantling mechanism disposed on the reflector and outside a bezel of the liquid crystal display when the lamp module is assembled to the liquid crystal display. The lamp module is capable of being disassembled from the bezel of the liquid crystal display by applying a force on the dismantling mechanism.

摘要翻译： 用于液晶显示器的灯模块包括灯管，反射器，设置在反射器上的拆卸机构。 反射器包括形成水槽的第一侧，第二侧和第三侧，用于容纳灯管并反射来自灯管的光。 当将灯模块组装到液晶显示器时，拆卸机构设置在反射器上并且在液晶显示器的边框的外侧。 灯模块能够通过在拆卸机构上施加力而从液晶显示器的边框拆卸。

公开(公告)号：US20090009679A1

公开(公告)日：2009-01-08

申请号：US12042542

申请日：2008-03-05

申请人： Therm-Hoo Ke ,  Ying-Feng Hsu ,  Chi-Chun Yang ,  Li-Chuan Yu ,  Tzu-Yi Liu ,  Tung-Liang Shao ,  Tung-I Yen ,  Shih-Chang Chang

发明人： Therm-Hoo Ke ,  Ying-Feng Hsu ,  Chi-Chun Yang ,  Li-Chuan Yu ,  Tzu-Yi Liu ,  Tung-Liang Shao ,  Tung-I Yen ,  Shih-Chang Chang

IPC分类号： G02F1/13357 ,  F21V17/00

CPC分类号： G02B6/0031 ,  G02B6/0091

摘要： A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction.

摘要翻译： 背光模块包括框架，光学元件，底板，保持器和光源。 光学元件位于框架上，并且框架的侧壁和光学元件之间的空间。 底板位于光学元件下方。 光源位于插入该空间的保持器上。保持器沿着朝向底板底面的方向插入空间中，并沿相反方向从空间移除。

公开(公告)号：US20120092033A1

公开(公告)日：2012-04-19

申请号：US12903984

申请日：2010-10-13

申请人： Tung-Liang Shao ,  Shih-Wei Liang ,  Ying-Ju Chen ,  Ching-Jung Yang ,  Hsien-Wei Chen ,  Hao-Yi Tsai ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Tung-Liang Shao ,  Shih-Wei Liang ,  Ying-Ju Chen ,  Ching-Jung Yang ,  Hsien-Wei Chen ,  Hao-Yi Tsai ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： G01R31/00 ,  G01R27/00 ,  G01R29/26

CPC分类号： G01R31/2648 ,  G01R31/002 ,  G01R31/2644 ,  G01R31/2884 ,  H01L22/34 ,  H01L2224/13

摘要： Provided is a test structure for testing an unpackaged semiconductor wafer. The test structure includes a force-application component that is coupled to an interconnect structure of the semiconductor wafer. The force-application component is operable to exert a force to the semiconductor wafer. The test structure also includes first and second test portions that are coupled to the interconnect structure. The first and second test portions are operable to measure an electrical performance associated with a predetermined region of the interconnect structure. The first and second test portions are operable to measure the electrical performance while the force is exerted to the semiconductor wafer.

摘要翻译： 提供了一种用于测试未封装的半导体晶片的测试结构。 测试结构包括耦合到半导体晶片的互连结构的施力部件。 力施加部件可操作以向半导体晶片施加力。 测试结构还包括耦合到互连结构的第一和第二测试部分。 第一和第二测试部分可操作以测量与互连结构的预定区域相关联的电性能。 第一和第二测试部分可操作以在力施加到半导体晶片时测量电气性能。