公开(公告)号：US10048656B2

公开(公告)日：2018-08-14

申请号：US14000452

申请日：2011-03-17

申请人： Wakahiro Kawai

发明人： Wakahiro Kawai

IPC分类号： G05B13/02 ,  G05B19/418

摘要： A control device for controlling a line in which a plurality of machines performs processes in sequence on a workpiece, the control device having a monitoring section that monitors an amount of electric energy of at least a first machine of the plurality of machines, and a power source control section that controls a power source of at least a second machine of the plurality of machines in accordance with the amount of electric energy of the first machine.

公开(公告)号：US09535433B2

公开(公告)日：2017-01-03

申请号：US14123805

申请日：2011-08-23

申请人： Wakahiro Kawai ,  Takafumi Bessho

发明人： Wakahiro Kawai ,  Takafumi Bessho

IPC分类号： F27D1/00 ,  G05D23/19 ,  B23K1/008 ,  H05K3/34 ,  F27D21/00 ,  F27B9/20 ,  F27D19/00

CPC分类号： G05D23/19 ,  B23K1/008 ,  F27B9/20 ,  F27D21/0014 ,  F27D2019/0003 ,  H05K3/3494

摘要： A control device that controls a heating device having a plurality of heating zones, has a monitoring unit configured to monitor a temperature of at least a first heating zone in the plurality of heating zones, and a control unit configured to perform heat-up starting control, in which heat-up of at least a second heating zone is started in the plurality of heating zones, based on the temperature of the first heating zone.

摘要翻译： 一种控制具有多个加热区域的加热装置的控制装置，具有：监视单元，被配置为监视所述多个加热区域中的至少第一加热区域的温度;以及控制单元，其被配置为执行加热启动控制 ，其中基于第一加热区的温度，在多个加热区中启动至少第二加热区的加热。

公开(公告)号：US20130331959A1

公开(公告)日：2013-12-12

申请号：US14000452

申请日：2011-03-17

申请人： Wakahiro Kawai

发明人： Wakahiro Kawai

IPC分类号： G05B13/02

CPC分类号： G05B13/02 ,  G05B19/418 ,  G05B2219/32021 ,  Y02P70/161 ,  Y02P90/02 ,  Y02P90/205

摘要： A control device for controlling a line in which a plurality of machines performs processes in sequence on a workpiece, the control device having a monitoring section that monitors an amount of electric energy of at least a first machine of the plurality of machines, and a power source control section that controls a power source of at least a second machine of the plurality of machines in accordance with the amount of electric energy of the first machine.

摘要翻译： 一种用于控制多个机器在工件上依次执行处理的管线的控制装置，所述控制装置具有监视所述多个机器中的至少第一机器的电能量的监视部，以及功率 源极控制部分，其根据第一机器的电能量来控制多个机器中的至少第二机器的电源。

公开(公告)号：US20130175074A1

公开(公告)日：2013-07-11

申请号：US13810689

申请日：2011-07-06

申请人： Wakahiro Kawai

发明人： Wakahiro Kawai

IPC分类号： B32B37/04 ,  H05K1/11

摘要： A method for surface mounting an electronic component includes providing a conductive circuit on a substrate member, forming a thermoplastic resin layer on a front surface of the conductive circuit, providing a surface of an electrode of an electronic component with a metal layer, and bonding the metal layer of the electronic component and the conductive circuit to each other by melting and partially removing a thermoplastic resin by applying a load generated by ultrasonic vibration that vibrates in a direction substantially parallel to a surface of the metal layer, while pressing the metal layer to the thermoplastic resin layer, and then stopping applying the load generated by the ultrasonic vibration, and hardening the thermoplastic resin thus melted by cooling. The metal layer is configured by a thin layer made of a material having a shear strength lower than that of a material constituting the conductive circuit.

摘要翻译： 一种表面安装电子部件的方法包括在基板部件上设置导电电路，在导电电路的前表面形成热塑性树脂层，使电子部件的电极的表面具有金属层， 电子部件的金属层和导电电路彼此熔融并部分地除去热塑性树脂，通过施加由大体上平行于金属层的表面振动的超声波振动产生的载荷，同时将金属层压到 热塑性树脂层，然后停止施加由超声波振动产生的载荷，并且使通过冷却熔化的热塑性树脂硬化。 金属层由具有比构成导电电路的材料的剪切强度低的材料制成的薄层构成。

公开(公告)号：US07419101B2

公开(公告)日：2008-09-02

申请号：US11222739

申请日：2005-09-12

申请人： Wakahiro Kawai

发明人： Wakahiro Kawai

IPC分类号： G06K19/06

CPC分类号： G06K17/00 ,  B65D19/44 ,  B65D2203/10 ,  G06K7/10336 ,  G06K19/0717 ,  G06K2017/0045 ,  G06Q10/08

摘要： The physical distribution management apparatus comprises a non-contact communication section for communicating out of contact with a non-contact IC tag, an information acquisition section for acquiring the information concerning a situation where it is placed, a control section for writing the information acquired by the information acquisition section into a prescribed storage section, and a portable power source section for supplying an electric power to each of the sections.

摘要翻译： 物理分发管理装置包括用于与非接触IC标签进行通信的非接触通信部分，用于获取关于其放置的情况的信息的信息获取部分，用于写入由 信息获取部分转换成规定的存储部分，以及用于向每个部分提供电力的便携式电源部分。

公开(公告)号：US06873033B2

公开(公告)日：2005-03-29

申请号：US10636583

申请日：2003-08-08

申请人： Wakahiro Kawai ,  Yoshiki Iwamae

发明人： Wakahiro Kawai ,  Yoshiki Iwamae

IPC分类号： B42D15/10 ,  G06K19/04 ,  G06K19/07 ,  G06K19/077 ,  G07F7/02 ,  H01L23/02 ,  H01L23/04 ,  H01L23/06 ,  H01L23/29

CPC分类号： G06K19/047 ,  G06K19/041 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2924/0002 ,  H01L2924/00

摘要： A coin-shaped IC tag which can be endowed with a predetermined weight is described. The coin-shaped IC tag ensures a normal operation and affords a satisfactory feeling of weightiness as a value medium. Methods of manufacturing the coin-shaped IC tag are also described. The coin-shaped IC tag comprises an IC tag core. The IC tag core comprises an IC packaging base member including a base and an electronic circuit for communicating data and for recording data, the electronic circuit mounted on the base. The IC tag core also comprises a high specific gravity resin layer joined to the IC packaging base member.

摘要翻译： 描述了可以赋予预定重量的硬币形IC标签。 硬币形IC标签确保正常操作，并且作为价值介质提供令人满意的重量感。 还描述了制造硬币形IC标签的方法。 硬币形IC标签包括IC标签芯。 IC标签芯包括IC封装基座构件，其包括基座和用于传送数据和用于记录数据的电子电路，安装在基座上的电子电路。 IC标签芯还包括与IC封装基体部件接合的高比重树脂层。

公开(公告)号：US20140129045A1

公开(公告)日：2014-05-08

申请号：US14123805

申请日：2011-08-23

申请人： Wakahiro Kawai ,  Takafumi Bessho

发明人： Wakahiro Kawai ,  Takafumi Bessho

IPC分类号： G05D23/19

CPC分类号： G05D23/19 ,  B23K1/008 ,  F27B9/20 ,  F27D21/0014 ,  F27D2019/0003 ,  H05K3/3494

摘要： A control device that controls a heating device having a plurality of heating zones, has a monitoring unit configured to monitor a temperature of at least a first heating zone in the plurality of heating zones, and a control unit configured to perform heat-up starting control, in which heat-up of at least a second heating zone is started in the plurality of heating zones, based on the temperature of the first heating zone.

摘要翻译： 一种控制具有多个加热区域的加热装置的控制装置，具有：监视单元，被配置为监视所述多个加热区域中的至少第一加热区域的温度;以及控制单元，其被配置为执行加热启动控制 ，其中基于第一加热区的温度，在多个加热区中启动至少第二加热区的加热。

公开(公告)号：US07690578B2

公开(公告)日：2010-04-06

申请号：US10569456

申请日：2004-08-25

申请人： Wakahiro Kawai

发明人： Wakahiro Kawai

IPC分类号： G06K19/06

CPC分类号： B60C23/0493 ,  B29D2030/0077 ,  B29D2030/0083 ,  B60C19/00 ,  G06K19/02 ,  G06K19/07764

摘要： A flat IC tag contains memory means capable of data storage and transmission means capable of data transmission. The IC tag has on a surface thereof an unvulcanized rubber having identical properties to the unvulcanized rubber used for an article to which the IC tag is mounted. The opposite surface of the IC tag is mounted to the article before vulcanization. The article is vulcanized in this state to mount the IC tag to the article. Hence, the IC tag is not damaged if attached to tires and other articles in harsh operating environment.

摘要翻译： 扁平IC标签包含能够进行数据传输的数据存储和传输装置的存储装置。 IC标签的表面上具有与用于安装IC标签的制品的未硫化橡胶相同性能的未硫化橡胶。 在硫化之前，将IC标签的相对表面安装到制品上。 在该状态下将制品硫化以将IC标签安装到制品上。 因此，如果在恶劣的操作环境中连接到轮胎和其他物品上，IC标签不会损坏。

公开(公告)号：US07404522B2

公开(公告)日：2008-07-29

申请号：US10557789

申请日：2004-05-26

申请人： Wakahiro Kawai

发明人： Wakahiro Kawai

IPC分类号： G06K19/06

CPC分类号： H01Q7/00 ,  G06K19/02 ,  G06K19/0739 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01Q1/2208

摘要： An information carrier in which the substrate, having a signal-forming portion for forming signals corresponding to specific information, is attached to a base material having a transfer portion for transferring signals. The specific information is recognized using signals transferred from the signal-forming portion through the transfer portion. The surface attached to the substrate is the surface for attaching the carrier and substrate to an object. When the information carrier is peeled off the object, the substrate remains on the object, thereby separating the substrate and the base material. Accordingly, the signals from the signal-forming portion are no longer transmitted to base portion.

摘要翻译： 一种信息载体，其中具有用于形成对应于特定信息的信号的信号形成部分的基板被附接到具有用于传送信号的传送部分的基底材料。 使用从信号形成部分通过传送部分传送的信号识别特定信息。 附着于基板的表面是用于将载体和基板附着到物体的表面。 当信息载体从物体上剥离时，衬底保留在物体上，从而分离衬底和基底材料。 因此，来自信号形成部的信号不再传送到基部。

公开(公告)号：US07276436B2

公开(公告)日：2007-10-02

申请号：US10724202

申请日：2003-12-01

申请人： Wakahiro Kawai ,  Noriaki Sato

发明人： Wakahiro Kawai ,  Noriaki Sato

IPC分类号： H01L21/44

CPC分类号： H01L23/49855 ,  G06K19/07745 ,  G06K19/0775 ,  H01L21/563 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81395 ,  H01L2224/8183 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H05K3/061 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0571 ,  H05K2203/1189 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2224/0401

摘要： A semiconductor bear chip having a bump subjected to high temperatures is pressed, from the upper side, onto a wiring board including a wiring pattern, a thermosetting resin film covering an electrode area on the wiring pattern and having insulating particles dispersed and included and a thermoplastic resin film covering the thermosetting resin film, while applying a ultrasonic wave, thereby inserting the bumps of the semiconductor bear chip through the thermoplastic resin film and the thermosetting resin film to bond the top end portion of the bump with the electrode area.

摘要翻译： 将具有高温度的凸块的半导体支承片从上侧按压到包括布线图案的布线板，覆盖布线图案上的电极区域并具有分散并包含绝缘颗粒的热固性树脂膜和热塑性塑料 树脂膜覆盖热固性树脂膜，同时施加超声波，从而将半导体支承芯片的凸点通过热塑性树脂膜和热固性树脂膜插入，以将凸起的顶端部分与电极区域结合。