摘要:
An electronic device and camera module are described. The camera module includes a housing for housing components of the camera module. The housing has a top side which defines an opening. The camera module also includes a lens barrel housed by the housing and having one or more lens elements and an actuator housed by the housing and engaging the lens barrel. The actuator is configured to move the lens barrel to a first position in which at least a portion of the lens barrel extends through the opening. The camera module also includes an image sensor for receiving light which passes through the lens elements of the lens barrel. The image sensor is configured to produce an electronic signal based on the received light. The electronic device also includes a processor electrically connected to the camera module for receiving the electronic signal from the image sensor.
摘要:
In a system and method for updating a real-time map, operating environment information of a terminal device, which is basic information for update condition determination, is collected, an update condition of a terminal device, which includes one or more of a state of travel, a travel speed, and a network state, is checked by comparing the collected operating environment information with preset criteria, and map data, which is stored in the terminal device, in a combination of one or more of level, tile, and layer units corresponding to the checked update condition, is partially updated.
摘要:
A package stack structure may an upper package include an upper package substrate having a first edge and a second edge opposite to the first edge. The upper package substrate has a first region arranged near the first edge and a second region arranged near the second edge. A first upper semiconductor device is mounted on the upper package substrate. The package stack structure may also include a lower package having a lower package substrate and a lower semiconductor device. The lower package is connected to the upper package through a plurality of inter-package connectors. The plurality of the inter-package connectors may include first inter-package connectors configured to transmit data signals; second inter-package connectors configured to transmit address/control signals; third inter-package connectors configured to provide a supply voltage for an address/control circuit; and fourth inter-package connectors configured to provide a supply voltage for a data circuit.
摘要:
The present invention relates to a real-time map data updating system and method, comprising: collecting operating environment information of a terminal device, which is basic information for update condition determination; checking an update condition of the terminal device which includes one or more of a state of travel, a travel speed, and a network state by comparing the collected operating environment information to preset criteria; and partially updating map data, which is stored in the terminal device, in a combination of one or more of level, tile, and layer units corresponding to the checked update condition.
摘要:
Provided is an electromagnetic interference (EMI) removing device for active reduction of electromagnetic interference and a semiconductor package including the same. The EMI removing device may include a film substrate having an antenna pattern configured to generate a second electromagnetic wave, which may have substantially the same frequency band, modulation mode, and directivity as a first electromagnetic wave generated by a first semiconductor chip and a phase opposite to a phase of the first electromagnetic wave.
摘要:
A semiconductor package including a substrate, a chip stack portion disposed on the substrate and including a plurality of first semiconductor chips, at least one second semiconductor chip disposed on the chip stack portion, and a signal transmitting medium to electrically connect the at least one second semiconductor chip and the substrate to each other, such that the chip stack portion is a parallelepiped structure including a first chip that is a semiconductor chip of the plurality of first semiconductor chips and includes a through silicon via (TSV), a second chip that is another semiconductor chip of the plurality of first semiconductor chips and electrically connected to the first chip through the TSV, and an internal sealing member to fill a space between the first chip and the second chip.
摘要:
An electronic device and camera module are described. The camera module includes a housing for housing components of the camera module. The housing has a top side which defines an opening. The camera module also includes a lens barrel housed by the housing and having one or more lens elements and an actuator housed by the housing and engaging the lens barrel. The actuator is configured to move the lens barrel to a first position in which at least a portion of the lens barrel extends through the opening. The camera module also includes an image sensor for receiving light which passes through the lens elements of the lens barrel. The image sensor is configured to produce an electronic signal based on the received light. The electronic device also includes a processor electrically connected to the camera module for receiving the electronic signal from the image sensor.
摘要:
An optical navigation device, such as an optical navigation joystick or mouse, includes an internal redirector which may be separate or formed from material of a touch surface of the optical device. The redirector is disposed at an angle with respect to a plane of the touch surface, operative to reflect light which would otherwise strike the touch surface at a low angle and be internally reflected. The light may be reflected in a direction away from a light sensor of the device, reducing sensed internally reflected light, or may be reflected into the touch surface at a higher angle, potentially increasing a quantity of good signal. The redirector may also include portions which block light directly emitted from a light emitter, or reflected off other surfaces of the navigation device.
摘要:
A package on package (PoP) employing a through substrate via (TSV) technique in order to reduce the size of a semiconductor chip, has vertically narrow pitches, and forms a higher number of connection terminals. The PoP include a first substrate with a recess disposed in a first surface of the substrate, and a semiconductor chip disposed at the recess. The PoP also includes a semiconductor package connected to the first semiconductor package. The first substrate includes TSVs for electronically connecting the semiconductor package and the semiconductor chip, and routing lines for re-distributing the signals/and or power transmitted via the TSVs.
摘要:
Provided are a display device with improved display quality and a method of driving the same. The display device includes: a display panel which includes a plurality of dither blocks displaying an image that corresponds to a dither image signal; and an image signal controller which generates the dither image signal by using a dither pattern that determines a plurality of dither pixels, which are to be dithered, from among a plurality of pixels included in each of the dither blocks, wherein each of the dither blocks includes a plurality of pixels, whose respective polarities are inverted every frame and which are driven accordingly, and comprises equal numbers of positive-polarity dither pixels and negative-polarity dither pixels.