-
1.发明授权公开(公告)号：US09577304B2
公开(公告)日：2017-02-21
申请号：US14637898
申请日：2015-03-04
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Chih-Heng Chuo , Gwun-Jin Lin , Kuo-Fu Su
CPC classification number: H01P1/227 , H03H7/38 , H05K1/0225 , H05K1/0251 , H05K1/116 , H05K1/189 , H05K3/3447 , H05K2201/0715 , H05K2201/093 , H05K2201/09381 , H05K2201/0939 , H05K2201/09718 , H05K2201/10931
Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.
Abstract translation: 公开了一种具有插入部件的电路板的高频连接焊盘的衰减减小结构。 电路板包括形成在其上的至少一对差模信号线。 衬底具有分别设置有至少一对上连接焊盘和下连接焊盘的上表面和下表面。 第一金属层形成在基板的下表面上。 第一金属层包括衰减减小接地图案结构。 衰减降低接地图案结构包括中空区域和至少一个突出部分。 突出部分沿着朝向下连接焊盘的方向从第一金属层延伸。
-
2.发明授权公开(公告)号：US09313890B2
公开(公告)日：2016-04-12
申请号：US14478322
申请日：2014-09-05
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Chih-Heng Chuo , Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/118 , H05K1/024 , H05K1/025 , H05K1/117 , H05K2201/0191
Abstract: An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.
Abstract translation: 电路板的衰减减小结构包括在高频信号接触焊盘和电路板的接地层之间形成的膨胀厚度。 膨胀的厚度大于接地层和高频信号线之间的参考厚度。 电路板由聚对苯二甲酸乙二醇酯（PET）或聚酰亚胺（PI）制成。 或者，使用包括树脂和纤维材料的刚性板或刚挠板。 电路板可以是通过组合至少两个单层电路板而形成的单层电路板或多层板。 在高频信号接触焊盘和接地层之间安装厚度扩大的焊盘，或者增加电路板的接合层的一部分的厚度以提供膨胀的厚度。
-
3.发明授权公开(公告)号：US09040835B2
公开(公告)日：2015-05-26
申请号：US14108790
申请日：2013-12-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
CPC classification number: H05K1/0245 , H05K1/0225 , H05K1/118 , H05K3/4069 , H05K2201/09845
Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.
Abstract translation: 柔性电路板的差分信号传输线的衰减降低接地结构包括柔性基板，在该柔性基板上至少有一对差模信号线，至少一个接地线，覆盖绝缘层和薄金属箔 形成层。 至少一个通孔延伸穿过薄金属箔层和覆盖绝缘层，并且对应于接地线的导电接触区。 通孔填充有导电膏层，以将薄金属箔层电连接到接地线的导电接触区域，以提供良好的接地布置。 薄金属箔层包括形成在对应于差模信号线的顶角的位置处的多个开口。
-
公开(公告)号：US08753143B2
公开(公告)日：2014-06-17
申请号：US13649184
申请日：2012-10-11
Applicant: Advanced Flexible Circuits Co., Ltd.
Inventor： Kuo-Fu Su , Gwun-Jin Lin , Chih-Heng Chuo
IPC: H01R12/00
CPC classification number: H01R4/024 , H01R12/594 , H01R12/65 , H01R12/79
Abstract: A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector.
Abstract translation: 用于柔性电路电缆的连接结构包括柔性电路电缆，该柔性电路电缆具有柔性电路基板，该电路基板的第一端与连接器外壳的焊台相连接，该第一端分别对应于电缆的柔性电路电缆的导线的第一指垫导电触点 连接器的金属导电端子的焊接部分。 在每个导电线的第一指垫导电接触件的金属涂层和相应的金属导电端子的电缆焊接部分之间形成焊接层，以将柔性电路电缆的导线设置成与金属电连接 连接器的导电端子。
-
公开(公告)号：US09462685B2
公开(公告)日：2016-10-04
申请号：US14090157
申请日：2013-11-26
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
CPC classification number: H05K1/028 , B29C53/04 , H05K2201/051 , H05K2201/056 , H05K2201/057 , H05K2201/09063 , H05K2203/0195 , Y10T29/49826
Abstract: Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.
Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组合的方法和结构。 通过将预折线作为中心线来处理预成形的柔性电路板，以将柔性电路板的连接部分朝向端子分配部分折叠。 然后，将连接部朝向端子分配部的方向卷绕，以使连接部形成卷边体。 然后将卷绕的物体穿过铰链组件的孔，以使轧制体完全延伸穿过铰链组件的孔，使得柔性电路板的延伸部分定位在铰链组件的孔中，并且第一端 并且第二端分别位于铰链组件的孔的相对侧。
-
Patent Agency Ranking
公开(公告)号：US09433086B2
公开(公告)日：2016-08-30
申请号：US14283372
申请日：2014-05-21
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
CPC classification number: H05K1/0271 , H05K1/0277 , H05K1/028 , H05K1/0281 , H05K1/118 , H05K2201/09063 , H05K2201/09145
Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.
Abstract translation: 公开了一种用于柔性电路板的撕裂保护结构。 在柔性电路板的延伸部中，至少形成有切割线。 切割线至少具有应力分流切割部分从该终端延伸的终端。 应力转向切割段通过沿切割方向切割形成，该切割方向限定相对于延伸部分的延伸方向的角度，以用作柔性电路板的撕裂保护结构。 柔性电路板的延伸部分沿着切口线可折叠。 应力转向切割段还可以包括在其终止端中形成的撕裂保护孔。
-
公开(公告)号：US09386692B2
公开(公告)日：2016-07-05
申请号：US14704196
申请日：2015-05-05
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
CPC classification number: H05K1/028 , H05K1/118 , H05K3/361 , H05K2201/0394 , H05K2201/041 , H05K2201/055 , H05K2201/09481
Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.
Abstract translation: 提供了一种用于柔性电路板的电源路径结构，并且包括第一柔性电路板，其包括至少一个第一连接焊盘和第一相对连接焊盘以及连接在第一连接焊盘和第一相对连接之间的第一电源路径 垫和第二柔性电路板，其包括连接在第二连接焊盘和第二相对连接焊盘之间的至少一个第二连接焊盘和第二相对连接焊盘和第二电源路径。 第一柔性电路板在垂直方向上堆叠在第二柔性电路板上，使得第一电源路径和第二电源路径形成用作电源路径的并联连接的电源路径，或者 第一柔性电路板的接地路径。
-
公开(公告)号：US09204561B2
公开(公告)日：2015-12-01
申请号：US14307652
申请日：2014-06-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/115 , H05K1/028 , H05K1/0298 , H05K3/002 , H05K3/426 , Y10T29/49165
Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
Abstract translation: 电路板的通孔的结构包括在载体板上形成布线之后形成的粘合剂层和导体层。 至少一个通孔在垂直方向上穿过载板，布线，粘合剂层和导体层延伸并形成孔壁表面。 导体层相对于垂直方向上的电路迹线的暴露区域显示高度差。 导电覆盖部分覆盖导体层和通孔的孔壁表面。 载板是单面板，双面板，多层板或其组合，单面板，双面板和多层板可以是柔性板， 刚性板，或组合柔性和刚性板的复合板。
-
9.发明授权公开(公告)号：US09041482B2
公开(公告)日：2015-05-26
申请号：US14108838
申请日：2013-12-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
CPC classification number: H01P1/22 , H01P1/227 , H01P3/026 , H03H7/38 , H05K1/00 , H05K1/0242 , H05K1/025 , H05K1/0393 , H05K2201/0969 , H05K2201/09827
Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.
Abstract translation: 柔性电路板的高频信号传输线的衰减减小控制结构包括形成在基板的表面上的阻抗控制层。 阻抗控制层包括沿着衬底的高频信号传输线的延伸方向布置的衰减减小图案，并且对应于高频信号传输线的底角结构，以便改善高频信号传输线的衰减， 频率信号通过高频信号传输线路传输。 基板的相对表面包括形成在其上的导电屏蔽层。 导电屏蔽层形成有对应于高频信号传输线的顶角结构的衰减减小图案。
-
公开(公告)号：US10080277B1
公开(公告)日：2018-09-18
申请号：US15920915
申请日：2018-03-14
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.
-
-
-
-
-
-
-
-
-
Search Results
25
records
(took 0.015 seconds)
