公开(公告)号：US5097318A

公开(公告)日：1992-03-17

申请号：US331802

申请日：1989-04-03

申请人： Akira Tanaka ,  Kazuji Yamada ,  Hirokazu Inoue ,  Hideo Arakawa ,  Masahide Okamoto

发明人： Akira Tanaka ,  Kazuji Yamada ,  Hirokazu Inoue ,  Hideo Arakawa ,  Masahide Okamoto

IPC分类号： H01L23/538 ,  H01L23/04 ,  H01L23/057 ,  H01L23/12 ,  H01L23/467 ,  H01L23/498 ,  H01L23/50

CPC分类号： H01L23/49822 ,  H01L23/057 ,  H01L23/467 ,  H01L23/49838 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/30107

摘要： A cavity-down type package for a semiconductor device comprises an insulating base substrate on which the semiconductor device and another insulating cap substrate with plural outer connection terminals on its outer surface and with electrodes provided on conductive layers for electric conduction on its inner surface. The electrodes on the insulating base substrate and those on the insulating cap substrate are connected with each other by using conductive material such as bumps.

摘要翻译： 一种用于半导体器件的降空型封装，包括其上安装有半导体器件（1）的绝缘基底（6）和在其外表面上具有多个外连接端子（5）的另一绝缘帽衬底（8） 其中电极（11）设置在导电层（4）上，用于在其内表面上导电。 绝缘基底基板上的电极和绝缘帽基板（8）上的电极通过诸如凸块的导电材料相互连接。

公开(公告)号：US5095359A

公开(公告)日：1992-03-10

申请号：US413622

申请日：1989-09-28

申请人： Akira Tanaka ,  Hirokazu Inoue ,  Kazuji Yamada ,  Kunio Miyazaki ,  Osamu Miura ,  Hideo Arakawa ,  Hiroshi Yokoyama ,  Yoshio Naganuma ,  Atsushi Morihara ,  Katsunori Ouchi

发明人： Akira Tanaka ,  Hirokazu Inoue ,  Kazuji Yamada ,  Kunio Miyazaki ,  Osamu Miura ,  Hideo Arakawa ,  Hiroshi Yokoyama ,  Yoshio Naganuma ,  Atsushi Morihara ,  Katsunori Ouchi

IPC分类号： G06F1/18 ,  H01L21/60 ,  H01L23/057 ,  H01L23/467 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065

CPC分类号： H01L23/467 ,  H01L23/057 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/30107

摘要： A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.

公开(公告)号：US4908695A

公开(公告)日：1990-03-13

申请号：US178650

申请日：1988-04-07

申请人： Atsushi Morihara ,  Yoshio Naganuma ,  Shuntaro Koyama ,  Kazuji Yamada ,  Tasao Soga ,  Hideo Arakawa ,  Shunsuke Nogita ,  Yukio Hishinuma

发明人： Atsushi Morihara ,  Yoshio Naganuma ,  Shuntaro Koyama ,  Kazuji Yamada ,  Tasao Soga ,  Hideo Arakawa ,  Shunsuke Nogita ,  Yukio Hishinuma

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L2224/16

摘要： A heat conducting member is placed in the space between a semiconductor chip which generates heat and a heat transfer block which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.

公开(公告)号：US5045922A

公开(公告)日：1991-09-03

申请号：US583144

申请日：1990-09-17

申请人： Hironori Kodama ,  Satoru Ogihara ,  Hideo Arakawa ,  Hirokazu Inoue ,  Yoshiyuki Yasutomi ,  Tadahiko Miyoshi

发明人： Hironori Kodama ,  Satoru Ogihara ,  Hideo Arakawa ,  Hirokazu Inoue ,  Yoshiyuki Yasutomi ,  Tadahiko Miyoshi

IPC分类号： H01L25/18 ,  H01L23/538 ,  H01L25/04 ,  H01L25/065 ,  H01L25/10 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18

CPC分类号： H05K1/0271 ,  H01L23/5383 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/105 ,  H05K1/0206 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2225/1005 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H05K1/0201 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/10522 ,  H05K2201/10704 ,  H05K2201/10734

摘要： An installation structure of integrated circuit devices, in which two or more types of integrated circuit devices of different base materials are installed onto the same installation substrate. Since the installation structure has a construction according to different characteristics such as a thermal conductivity, heat generation amount, thermal expansion coefficient and the like of the integrated circuit devices made of different materials, the reliability of each device and its connection and the reduction of the costs required for the cooling method can be presented.

摘要翻译： 集成电路装置的安装结构，其中不同基材的两种或更多种集成电路装置安装在同一安装基板上。 由于安装结构具有根据由不同材料制成的集成电路器件的热导率，发热量，热膨胀系数等不同特性的结构，因此每个器件的可靠性及其连接以及减少 可以呈现冷却方法所需的成本。

公开(公告)号：US07617649B2

公开(公告)日：2009-11-17

申请号：US11427596

申请日：2006-06-29

申请人： Hideo Arakawa

发明人： Hideo Arakawa

IPC分类号： E04B2/00

CPC分类号： F16B35/041 ,  A47F5/0006 ,  A47F5/0846 ,  A47F5/0892 ,  A47G1/1686 ,  F16B35/06 ,  F16B37/045 ,  F16B45/00 ,  Y10T24/31 ,  Y10T24/3976 ,  Y10T24/4544

摘要： An article hanging system capable of easily changing an exhibit position and an exhibit height of an article such as a goods exhibited in a shop, a hanger and a display shelf comprises a ceiling rail assembly, a wire holder slidably retained to the ceiling rail assembly, a wire hanging down from the wire holder, a gripper fixably attachable at a desired position along the wire, a wire holder attached to a lower end of the wire and a floor rail assembly to which the wire holder is slidably retained. Each of the rail assemblies comprises longitudinal rails extending in a longitudinal direction (the Y-direction) and lateral rails slidable with respect to the longitudinal rail as being spanned between the longitudinal rails. Each of the wire holders are slidable along the lateral rail.

摘要翻译： 能够容易地改变展示位置的物品悬挂系统和商店，衣架和展示架中展示的商品等物品的展示高度，包括：天花板导轨组件，可滑动地保持在天花板导轨组件上的线架， 从电线支架垂下的电线，可固定地连接在沿线的期望位置的夹具，附接到电线的下端的电线保持架以及电线架可滑动地保持在其上的地板导轨组件。 每个轨道组件包括沿纵向方向（Y方向）延伸的纵向轨道，以及横跨在纵向轨道之间相对于纵向轨道滑动的横向轨道。 每个线夹可沿着侧轨滑动。

公开(公告)号：US07562856B2

公开(公告)日：2009-07-21

申请号：US11674050

申请日：2007-02-12

申请人： Hideo Arakawa

发明人： Hideo Arakawa

IPC分类号： B42F13/00

CPC分类号： F16B35/041 ,  A47F5/0006 ,  A47F5/0846 ,  A47F5/0892 ,  A47G1/1686 ,  F16B35/06 ,  F16B37/045 ,  F16B45/00 ,  Y10T24/31 ,  Y10T24/3976 ,  Y10T24/4544

摘要： An article hanging system capable of easily changing an exhibit position and an exhibit height of an article such as a goods exhibited in a shop, a hanger and a display shelf comprises a ceiling rail assembly, a wire holder slidably retained to the ceiling rail assembly, a wire hanging down from the wire holder, a gripper fixably attachable at a desired position along the wire, a wire holder attached to a lower end of the wire and a floor rail assembly to which the wire holder is slidably retained. Each of the rail assemblies comprises longitudinal rails extending in a longitudinal direction (the Y-direction) and lateral rails slidable with respect to the longitudinal rail as being spanned between the longitudinal rails. Each of the wire holders are slidable along the lateral rail.

公开(公告)号：US5417400A

公开(公告)日：1995-05-23

申请号：US793822

申请日：1991-11-18

申请人： Hideo Arakawa

发明人： Hideo Arakawa

IPC分类号： F16G11/04 ,  F21V21/104 ,  F21V21/112 ,  F21V21/16 ,  F21V21/18 ,  F16G11/00

CPC分类号： F21V21/16 ,  F16G11/108 ,  F21V21/104 ,  F21V21/112 ,  F21V21/18 ,  Y10T24/3976 ,  Y10T24/4614

摘要： A wire holder capable of facilitating adjustment and/or variation of a length and tension of the wire. The wire holder includes a wire grip and a connector. The connector is formed on an outer surface thereof with a groove longitudinally extending from an upper end portion thereof to an intermediate portion thereof and laterally extending from a substantially central portion of the connector to the outer surface of the connector in the manner that a bottom surface of the groove is smoothly curved so as to gradually decrease a depth of the groove toward a lower end portion of the connector and toward the outer surface of the connector.

摘要翻译： 一种能够促进电线的长度和张力的调节和/或变化的线保持器。 电线架包括电线把手和连接器。 连接器在其外表面上形成有从其上端部向其中间部分纵向延伸并从连接器的大致中心部分横向延伸到连接器的外表面的凹槽， 的槽平滑地弯曲，从而逐渐减小槽朝向连接器的下端部分的朝向连接器的外表面的深度。

公开(公告)号：US4736855A

公开(公告)日：1988-04-12

申请号：US922161

申请日：1986-10-23

申请人： Hideo Arakawa

发明人： Hideo Arakawa

IPC分类号： A47B43/00 ,  A47B57/56 ,  A47F5/00 ,  A47F5/08 ,  A47G1/16 ,  A47G29/00 ,  E04H1/12 ,  F16B2/16 ,  F16G11/04 ,  F16G11/10 ,  G09F15/00

CPC分类号： A47F5/08 ,  A47B43/006 ,  A47B57/567 ,  A47F5/0892 ,  A47G1/1686 ,  E04H1/1272 ,  F16G11/108 ,  G09F15/0068

摘要： Display apparatus having a rail fixable on a stationary structure and provided with a groove, a sliding member fittable in the rail groove and slidable therealong, a wire or cord coupled to the sliding member, a gripping member through which the wire or cord passes, a supporting hook connected to an end of the wire or cord remote from the gripping member, and a second rail having a groove for receiving the hook such that the wire or cord is coupled to the second rail and is tensioned when installed. The gripping member through which the wire or cord passes, comprises a hollow member having an inner tapered surface, a sleeve member having a passage formed therein for the wire or cord and situated within the hollow member to be freely slidable with respect thereto with at least a portion of the sleeve member projecting out from the hollow member, and at least one ball captured in the sleeve member seating against the tapered inner surface of the hollow member and communicating with the passage. A spring urges the sleeve member in a direction in which the inner surface of the hollow member tapers.

摘要翻译： 显示装置具有可固定在固定结构上并具有凹槽的轨道，可装配在轨道槽中并沿其滑动的滑动构件，连接到滑动构件的导线或绳索，线或线通过该夹持构件， 连接到远离抓握构件的线或线的端部的支撑钩，以及具有用于接收钩的凹槽的第二轨道，使得线或绳连接到第二轨道并且在安装时被张紧。 电线或电线穿过的夹持构件包括具有内锥形表面的中空构件，套筒构件具有形成在其中的用于电线或电线的通道，并且位于中空构件内，以至少可自由地滑动 套筒构件的一部分从中空构件突出，并且至少一个捕获在套筒构件中的球抵靠中空构件的锥形内表面并与通道连通。 弹簧沿着中空构件的内表面逐渐变细的方向推动套筒构件。

公开(公告)号：US20140147327A1

公开(公告)日：2014-05-29

申请号：US14232198

申请日：2012-07-27

申请人： Hiroaki Kurishita ,  Hideo Arakawa ,  Satoru Matsuo

发明人： Hiroaki Kurishita ,  Hideo Arakawa ,  Satoru Matsuo

IPC分类号： C22C1/05 ,  C22C27/04

CPC分类号： C22C1/05 ,  B22F3/15 ,  B22F2998/10 ,  C22C27/04 ,  C22C32/0052 ,  C22F1/18 ,  C22C1/1084

摘要： The present invention relates to the development of an alloy material with significantly improved low-temperature brittleness, recrystallization brittleness, and irradiation brittleness by the introduction of a recrystallization microstructure into an alloy, particularly a tungsten material, to significantly strengthen a weak grain boundary of the recrystallization microstructure. The present invention comprises the steps of: mechanically alloying at least one species selected from a group-IVA, VA, or VIA transition metal carbide and a metallic raw material; sintering base powders obtained through the mechanically alloying step, by using a hot isostatic press; and performing plastic deformation of at least 60% on the alloy obtained through the sintering step, at a strain rate between 10−5 s−1 and 10−2 S−1 and at a temperature between 500° C. and 2,000° C. It is therefore possible to obtain an alloy material with significantly improved low-temperature brittleness, recrystallization brittleness, and irradiation brittleness.

摘要翻译： 本发明涉及通过在合金，特别是钨材料中引入重结晶微观结构，显着提高低温脆性，再结晶脆性和照射脆性的合金材料的发展，显着增强了 再结晶微观结构。 本发明包括以下步骤：将选自IVA，VA或VIA过渡金属碳化物中的至少一种与金属原料机械合金化; 通过机械合金化步骤获得的烧结基础粉末，使用热等静压机; 并且在通过烧结步骤获得的合金上，在10 -5 s -1和10 -2 S -1之间的应变速率和500℃至2000℃的温度下进行至少60％的塑性变形。 因此，可以获得具有显着改善的低温脆性，再结晶脆性和照射脆性的合金材料。

公开(公告)号：US07335836B2

公开(公告)日：2008-02-26

申请号：US10531712

申请日：2003-10-20

申请人： Hideo Arakawa

发明人： Hideo Arakawa

IPC分类号： H01B7/34

CPC分类号： F16M11/046 ,  F16G11/108 ,  F16M13/027 ,  F21S8/06 ,  F21S8/068 ,  F21V21/104 ,  F21V21/112 ,  F21V21/16 ,  H02G3/20

摘要： The electrical apparatus suspension unit 1 is provided with two power supply wires 20-1 and 20-2 by which the electrical apparatus 3 is conducted and suspended from the ceiling 5. Each of the wires 20 is connected to the hung member of the electrical apparatus 3 at the lower end by the a lower holder 40, and connected to the rail 9 laid on the ceiling 5 at the upper end by an upper holder 100. The power supply wire 20 comprises a core wire 21, an insulating layer 23 covering the core wire 21 and an outer layer 25 covering the insulating layer 23. The core wire 21 of the power supply wire 20-1 conducts to a grounded conductor cable W1 and the core wire 21 of another power supply wire 20-2 conducts to a voltage applied conductor cable W2. The power supply wires 20 having high tensile strength enables to suspend the electrical apparatus and also supply power thereto.

摘要翻译： 电气设备悬挂单元1设置有两个电源线20-1和20-2，电气设备3通过该电源线20被引导并从天花板5悬挂。 每个电线20在下端通过下保持器40连接到电气设备3的悬挂构件，并且通过上保持器100连接到在上端放置在天花板5上的导轨9。 电源线20包括芯线21，覆盖芯线21的绝缘层23和覆盖绝缘层23的外层25。 电源线20-1的芯线21传导到接地导体电缆W 1，并且另一个电源线20-2的芯线21传导到施加电压的导体电缆W 2。 具有高拉伸强度的电源线20能够悬挂电气设备并且还向其供电。