公开(公告)号：US07311967B2

公开(公告)日：2007-12-25

申请号：US10038334

申请日：2001-10-18

申请人： Ashay A. Dani ,  Paul A. Koning ,  Saikumar Jayaraman ,  Christopher L. Rumer

发明人： Ashay A. Dani ,  Paul A. Koning ,  Saikumar Jayaraman ,  Christopher L. Rumer

IPC分类号： B32B5/16 ,  B32B18/00 ,  B32B27/38 ,  B32B13/04 ,  B32B15/04

CPC分类号： H01L24/29 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/16152 ,  Y10S428/913 ,  Y10T428/1225 ,  Y10T428/12701 ,  Y10T428/12896 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/2982 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31692 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01034 ,  H01L2924/01083 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/04642 ,  H01L2924/05432 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.

摘要翻译： 描述了热界面材料用于将电子部件热耦合到导热部件。 热界面材料包括粘弹性聚合物基质材料，基质材料中的易熔焊料颗粒和基质材料中的填料颗粒。 焊料颗粒具有低于所选温度（例如铟的157℃）的熔融温度，并且填料颗粒具有基本上高于所选温度（例如银的961℃）的熔融温度。 填料颗粒在不利的热和应力条件下保持热界面材料完好无损。

公开(公告)号：US07846778B2

公开(公告)日：2010-12-07

申请号：US10261676

申请日：2002-10-02

申请人： Christopher L. Rumer ,  Sabina J. Houle ,  Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

发明人： Christopher L. Rumer ,  Sabina J. Houle ,  Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

IPC分类号： H01L21/00 ,  H01L23/10

CPC分类号： H01L23/4275 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.

摘要翻译： 具有预先附着的相变热界面材料的集成散热器，散热器或热管以及制造电子组件的方法。

公开(公告)号：US07473995B2

公开(公告)日：2009-01-06

申请号：US10103801

申请日：2002-03-25

申请人： Christopher L. Rumer ,  Sabina J. Houle ,  Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

发明人： Christopher L. Rumer ,  Sabina J. Houle ,  Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

IPC分类号： H01L23/28 ,  H01L23/495 ,  H01L23/12 ,  H01L23/10 ,  H01L21/00

CPC分类号： H01L23/4275 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and a method of making an electronic assembly.

摘要翻译： 具有预先附着的相变热界面材料的集成散热器，散热器或热管以及制造电子组件的方法。

公开(公告)号：US07332807B2

公开(公告)日：2008-02-19

申请号：US11323512

申请日：2005-12-30

申请人： Ashay A. Dani ,  Anna M. Prakash ,  Saikumar Jayaraman ,  Mitesh Patel ,  Vijay S. Wakharkar

发明人： Ashay A. Dani ,  Anna M. Prakash ,  Saikumar Jayaraman ,  Mitesh Patel ,  Vijay S. Wakharkar

IPC分类号： H01L23/10 ,  H05K7/20

CPC分类号： H01L23/3737 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/05599

摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.

摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。

公开(公告)号：US07776657B2

公开(公告)日：2010-08-17

申请号：US11935597

申请日：2007-11-06

申请人： Ashay A. Dani ,  Anna M. Prakash ,  Saikumar Jayaraman ,  Mitesh Patel ,  Vijay S. Wakharkar

发明人： Ashay A. Dani ,  Anna M. Prakash ,  Saikumar Jayaraman ,  Mitesh Patel ,  Vijay S. Wakharkar

IPC分类号： H01L21/00

CPC分类号： H01L23/3737 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/05599

摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.

摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。

公开(公告)号：US06911726B2

公开(公告)日：2005-06-28

申请号：US10165401

申请日：2002-06-07

申请人： Christopher L. Rumer ,  Saikumar Jayaraman

发明人： Christopher L. Rumer ,  Saikumar Jayaraman

IPC分类号： H01L23/498 ,  H05K3/28 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L23/49811 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/15312 ,  H05K3/284 ,  H05K3/3426 ,  H01L2924/00 ,  H01L2224/29099

摘要： Apparatus and methods are provided wherein the reflowable electrically conductive interconnect material coupling the interconnects and/or land-side components of a microelectronic package is protected from elevated temperatures, such as those associated with reflow processes and environments which exceed the melting temperature of the interconnect material. One embodiment of the method provides covering the interconnect material about the interconnects and/or land-side components with heat-resistant curable material which protects the interconnect material from the elevated temperature and provides structural support to the interconnects and/or land-side components at the elevated temperature. One embodiment of the apparatus provides a substrate comprising interconnects and/or land-side components coupled to a carrier substrate with reflowable electrically conductive interconnect material, and a layer of heat-resistant curable material covering the interconnect material and forming fillets about the interconnects and/or land-side components.

公开(公告)号：US20110194254A1

公开(公告)日：2011-08-11

申请号：US13090855

申请日：2011-04-20

申请人： Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

发明人： Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

IPC分类号： H05K7/20 ,  H05K13/04 ,  B32B37/06 ,  B32B37/26

CPC分类号： H05K13/0465 ,  H01L23/42 ,  H01L23/4275 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10T156/10 ,  Y10T428/24926 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/31917 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01083 ,  H01L2224/29099 ,  H01L2224/0401

摘要： Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.

摘要翻译： 本发明的实施方案提供可用作聚合物焊料混合热界面材料的粘合剂基质的各种聚合物基质。 在替代实施方案中，粘合剂基质材料可以是磷光体，全氟醚，聚醚或氨基甲酸酯。 对于一个实施方案，选择粘合剂基质以提供对各种界面的改进的粘合性。 对于替代实施例，选择粘合剂基质以提供低接触电阻。 在替代实施例中，包含易熔和不可熔颗粒的聚合材料可用于需要散热的应用中，并且不限于用于微电子器件的热界面材料。

公开(公告)号：US07967942B2

公开(公告)日：2011-06-28

申请号：US11825400

申请日：2007-07-06

申请人： Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

发明人： Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

IPC分类号： C04B37/00 ,  H01L23/34 ,  B32B5/16 ,  B32B27/08

CPC分类号： H05K13/0465 ,  H01L23/42 ,  H01L23/4275 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10T156/10 ,  Y10T428/24926 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/31917 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01083 ,  H01L2224/29099 ,  H01L2224/0401

摘要： Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.

摘要翻译： 本发明的实施方案提供可用作聚合物焊料混合热界面材料的粘合剂基质的各种聚合物基质。 在替代实施方案中，粘合剂基质材料可以是磷光体，全氟醚，聚醚或氨基甲酸酯。 对于一个实施方案，选择粘合剂基质以提供对各种界面的改进的粘合性。 对于替代实施例，选择粘合剂基质以提供低接触电阻。 在替代实施例中，包含易熔和不可熔颗粒的聚合材料可用于需要散热的应用中，并且不限于用于微电子器件的热界面材料。

公开(公告)号：US07294394B2

公开(公告)日：2007-11-13

申请号：US11129516

申请日：2005-05-13

申请人： Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

发明人： Saikumar Jayaraman ,  Paul A. Koning ,  Ashay Dani

IPC分类号： B23B5/16

CPC分类号： H01L23/3737 ,  C08K3/08 ,  C08K3/22 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10T29/49002 ,  Y10T29/49083 ,  Y10T29/49099 ,  Y10T29/4913 ,  Y10T428/12701 ,  Y10T428/12896 ,  Y10T428/23 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2982 ,  H01L2924/00

摘要： According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.

摘要翻译： 根据本发明的一个方面，公开了一种用于提供由相变聚合物基体和易熔填料制成的热界面材料（TIM）的改进导热性的结构和方法。 TIM还可以具有不可熔填料和添加到相变聚合物基质中的百分比的非相变聚合物。 用于在两个或多个组分之间配合和传导热量的TIM可以是聚合物基质中的高度填充体系，其中填料的热导率高于聚合物基质。

公开(公告)号：US06981380B2

公开(公告)日：2006-01-03

申请号：US10326864

申请日：2002-12-20

申请人： Gregory M. Chrysler ,  Paul A. Koning ,  Saikumar Jayaraman ,  Makarem A. Hussein

发明人： Gregory M. Chrysler ,  Paul A. Koning ,  Saikumar Jayaraman ,  Makarem A. Hussein

IPC分类号： F35B21/02

CPC分类号： F25B21/02 ,  H01L23/38 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/0401

摘要： Apparatus and methods in accordance with the present invention utilize thermoelectric cooling (TEC) technology to provide enhanced power distribution and/or dissipation from a microelectronic die and/or microelectronic packages. Individual TEC devices are thermally interconnected with the microelectronic die in a number of placement configurations, including between the microelectronic die and the heat sink, on the integrated heat spreader (IHS) inner surface, and on the IHS outer surface. TEC devices comprise p- and n-type semiconducting material created using similar process as the microcircuits. The TEC devices are located in various regions within or on the microelectronic die, including directly below the microcircuits, on the backside of the microelectronic die, and on a separate substrate of microelectronic die material fabricated apart from the microelectronic die and subsequently thermally coupled to the backside of the microelectronic die.

摘要翻译： 根据本发明的装置和方法利用热电冷却（TEC）技术来提供来自微电子管芯和/或微电子封装的增强的功率分配和/或耗散。 单个TEC装置与集成散热器（IHS）内表面和IHS外表面上的多个放置配置（包括微电子管芯和散热器之间）与微电子管芯热互连。 TEC器件包括使用与微电路类似的工艺制造的p型和n型半导体材料。 TEC器件位于微电子管芯内或微电子管芯上的多个区域中，包括微电路正下方，微电子管芯的背面，以及与微电子管芯分开制造的微电子管芯材料的分离衬底，随后热耦合到 微电子模具的背面。