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1.发明授权Thermal interface material and electronic assembly having such a thermal interface material 有权热界面材料和具有这种热界面材料的电子组件公开(公告)号：US07311967B2
公开(公告)日：2007-12-25
申请号：US10038334
申请日：2001-10-18
CPC分类号： H01L24/29 , H01L23/3737 , H01L23/42 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29324 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/29393 , H01L2224/32245 , H01L2224/73253 , H01L2924/0001 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/16152 , Y10S428/913 , Y10T428/1225 , Y10T428/12701 , Y10T428/12896 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/2982 , Y10T428/31511 , Y10T428/31529 , Y10T428/31663 , Y10T428/31692 , H01L2924/00 , H01L2924/01022 , H01L2924/01034 , H01L2924/01083 , H01L2224/29099 , H01L2924/00014 , H01L2924/0503 , H01L2924/05032 , H01L2924/04642 , H01L2924/05432 , H01L2224/29199 , H01L2224/29299
摘要： A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.
摘要翻译： 描述了热界面材料用于将电子部件热耦合到导热部件。 热界面材料包括粘弹性聚合物基质材料，基质材料中的易熔焊料颗粒和基质材料中的填料颗粒。 焊料颗粒具有低于所选温度（例如铟的157℃）的熔融温度，并且填料颗粒具有基本上高于所选温度（例如银的961℃）的熔融温度。 填料颗粒在不利的热和应力条件下保持热界面材料完好无损。
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2.发明授权Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials 有权凝胶热界面材料包括具有低熔点的填料和包含这些凝胶热界面材料的电子封装公开(公告)号：US06841867B2
公开(公告)日：2005-01-11
申请号：US10334241
申请日：2002-12-30
IPC分类号： H01L23/31 , H01L23/373 , H01L23/42 , H01L23/10 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/3737 , H01L23/3128 , H01L23/42 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H01L2924/00
摘要： A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.
摘要翻译： 包含至少一种乙烯基封端的聚合物的组合物; 至少一个包含末端Si-H单元的交联剂的量; 一定量的至少一种导热第一填料和至少一种导热第二填料，其中第一填料的熔点大于第二填料的熔点。 一种包括被配置为与印刷电路板匹配的封装的设备; 耦合到所述封装的半导体器件; 热元件; 以及设置在所述热元件和所述半导体器件之间的可固化热敏材料。
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公开(公告)号：US06974723B2
公开(公告)日：2005-12-13
申请号：US10956162
申请日：2004-09-30
IPC分类号： H01L23/31 , H01L23/373 , H01L23/42 , H01L29/866
CPC分类号： H01L23/3737 , H01L23/3128 , H01L23/42 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H01L2924/00
摘要： A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.
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4.发明授权Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same 有权具有用于体偏置的电介质障碍物的芯片封装热界面材料，其使用方法以及含有它们的体系公开(公告)号：US07332807B2
公开(公告)日：2008-02-19
申请号：US11323512
申请日：2005-12-30
CPC分类号： H01L23/3737 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29486 , H01L2224/2949 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.
摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。
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5.发明授权Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same 有权具有用于体偏置的电介质障碍物的芯片封装热界面材料，其使用方法以及含有它们的体系公开(公告)号：US07776657B2
公开(公告)日：2010-08-17
申请号：US11935597
申请日：2007-11-06
IPC分类号： H01L21/00
CPC分类号： H01L23/3737 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29486 , H01L2224/2949 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.
摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。
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6.发明授权Heat dissipating device with preselected designed interface for thermal interface materials 有权散热装置，具有预先设计的热界面材料接口公开(公告)号：US07996989B2
公开(公告)日：2011-08-16
申请号：US12061694
申请日：2008-04-03
IPC分类号： H05K7/20
CPC分类号： H01L23/10 , H01L23/367 , H01L23/42 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/45099 , H01L2224/48091 , H01L2224/49109 , H01L2224/73253 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/3011 , Y10T29/4935 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.
摘要翻译： 本发明的实施例包括散热装置。 散热装置包括具有表面的主体，其中表面被镀覆或涂覆有至少两种不同的金属，以形成有效地焊接到焊料并且用于粘附到聚合物焊料混合物中的聚合物的设计。 散热装置还包括表面扰动。
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7.发明授权Heat dissipating device with preselected designed interface for thermal interface materials 失效散热装置，具有预先设计的热界面材料接口公开(公告)号：US07527090B2
公开(公告)日：2009-05-05
申请号：US10612834
申请日：2003-06-30
IPC分类号： H05K7/20
CPC分类号： H01L23/10 , H01L23/367 , H01L23/42 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/45099 , H01L2224/48091 , H01L2224/49109 , H01L2224/73253 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/3011 , Y10T29/4935 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.
摘要翻译： 本发明的实施例包括散热装置。 散热装置包括具有表面的主体，其中表面被镀覆或涂覆有至少两种不同的金属，以形成有效地焊接到焊料并且用于粘附到聚合物焊料混合物中的聚合物的设计。 散热装置还包括表面扰动。
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8.发明申请HEAT DISSIPATING DEVICE WITH PRESELECTED DESIGNED INTERFACE FOR THERMAL INTERFACE MATERIALS 有权具有预先设计的用于热界面材料的界面的散热装置公开(公告)号：US20080185713A1
公开(公告)日：2008-08-07
申请号：US12061694
申请日：2008-04-03
CPC分类号： H01L23/10 , H01L23/367 , H01L23/42 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/45099 , H01L2224/48091 , H01L2224/49109 , H01L2224/73253 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/3011 , Y10T29/4935 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.
摘要翻译： 本发明的实施例包括散热装置。 散热装置包括具有表面的主体，其中表面被镀覆或涂覆有至少两种不同的金属，以形成有效地焊接到焊料并且用于粘附到聚合物焊料混合物中的聚合物的设计。 散热装置还包括表面扰动。
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公开(公告)号：US09613933B2
公开(公告)日：2017-04-04
申请号：US14198479
申请日：2014-03-05
申请人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, Jr. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
发明人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, Jr. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
IPC分类号： H01L23/12 , H01L25/065 , H01L25/10 , H01L23/31 , H01L23/498 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/565 , H01L21/76802 , H01L23/3128 , H01L23/49822 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/13023 , H01L2224/16227 , H01L2224/16238 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06548 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/37001 , H01L2924/00
摘要： An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.
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公开(公告)号：US20150255415A1
公开(公告)日：2015-09-10
申请号：US14198479
申请日：2014-03-05
申请人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, JR. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
发明人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, JR. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
IPC分类号： H01L23/00 , H01L25/065 , H01L23/498 , H01L23/31 , H01L21/56 , H01L21/768
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/565 , H01L21/76802 , H01L23/3128 , H01L23/49822 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/13023 , H01L2224/16227 , H01L2224/16238 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06548 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/37001 , H01L2924/00
摘要： An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.
摘要翻译： 描述了一种包括设置在基板上的基板和模具化合物的装置。 半导体管芯被嵌入在模具化合物内并且电耦合到衬底上的焊盘。 焊球围绕半导体管芯设置在基板上。 每个焊球上都有一个固体涂层。 固体涂层含有一种清洁剂，以促进其焊球与另一种焊球的聚结。 在模具化合物中形成了暴露焊球及其各自固体涂层的通孔。 在组合或替代实施例中，模具化合物的外边缘具有比通孔和半导体管芯之间的模具化合物区域更小的厚度。 在组合或替代实施例中，焊料球与模具化合物之间存在微通道。
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