公开(公告)号：US20110220920A1

公开(公告)日：2011-09-15

申请号：US13017983

申请日：2011-01-31

申请人： Brian Thomas Collins ,  Jasper Cabalu ,  Matthew Donofrio ,  Nathaniel O. Cannon

发明人： Brian Thomas Collins ,  Jasper Cabalu ,  Matthew Donofrio ,  Nathaniel O. Cannon

IPC分类号： H01L33/50

CPC分类号： H01L33/504 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/501 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： Methods of forming a light emitting device are provided in which a solid state lighting source is heated and a luminescent solution is applied to the heated solid state lighting source to form the light emitting device. The luminescent solution includes a first material that down-converts the radiation emitted by the solid state lighting source to radiation that has a peak wavelength in the green color range and that has a full width half maximum emission bandwidth that extends into the cyan color range, and at least one additional material that down-converts the radiation emitted by the solid state lighting source to radiation having a peak wavelength in another color range.

摘要翻译： 提供了形成发光器件的方法，其中加热固态光源并且将发光溶液施加到加热的固态光源以形成发光器件。 发光溶液包括将由固态光源发射的辐射降频转换为具有绿色范围内的峰值波长并且具有延伸到青色范围的全宽度半最大发射带宽的辐射的第一材料， 以及至少一种附加材料，其将由固态照明源发射的辐射下变频成具有另一颜色范围中的峰值波长的辐射。

公开(公告)号：US20100155763A1

公开(公告)日：2010-06-24

申请号：US12717048

申请日：2010-03-03

申请人： Matthew Donofrio ,  Nathaniel O. Cannon

发明人： Matthew Donofrio ,  Nathaniel O. Cannon

IPC分类号： H01L33/48 ,  H01L21/66 ,  B05C5/00 ,  B05C11/10 ,  B05D5/06

CPC分类号： H01L33/50 ,  B05B7/066 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： Methods are disclosed including heating an optical element. An optical material is applied to the heated optical element to provide a conformal layer that is cured via the thermal energy in the heated optical element.

摘要翻译： 公开了包括加热光学元件的方法。 将光学材料施加到加热的光学元件以提供通过加热的光学元件中的热能固化的共形层。

公开(公告)号：US08940561B2

公开(公告)日：2015-01-27

申请号：US12717048

申请日：2010-03-03

申请人： Matthew Donofrio ,  Nathaniel O. Cannon

发明人： Matthew Donofrio ,  Nathaniel O. Cannon

IPC分类号： H01L21/00 ,  H01L33/50 ,  B05B7/06

CPC分类号： H01L33/50 ,  B05B7/066 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： Methods are disclosed including heating an optical element. An optical material is applied to the heated optical element to provide a conformal layer that is cured via the thermal energy in the heated optical element.

摘要翻译： 公开了包括加热光学元件的方法。 将光学材料施加到加热的光学元件以提供通过加热的光学元件中的热能固化的共形层。

公开(公告)号：US20110284903A1

公开(公告)日：2011-11-24

申请号：US13164185

申请日：2011-06-20

申请人： Ban P. Loh ,  Nathaniel O. Cannon ,  Norbert Hiller ,  John Edmond ,  Mitch Jackson ,  Nicholas W. Medendorp, JR.

发明人： Ban P. Loh ,  Nathaniel O. Cannon ,  Norbert Hiller ,  John Edmond ,  Mitch Jackson ,  Nicholas W. Medendorp, JR.

IPC分类号： H01L33/50 ,  H01L33/52 ,  H01L21/28

CPC分类号： H01L33/52 ,  H01L24/97 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/4554

摘要： A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

摘要翻译： 用于发光器件封装的基座包括衬底。 第一接合焊盘和第二接合焊盘位于衬底的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。

公开(公告)号：US20090152573A1

公开(公告)日：2009-06-18

申请号：US12002429

申请日：2007-12-14

申请人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

发明人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

IPC分类号： H01L33/00 ,  H01L21/56

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.

摘要翻译： 一种封装的LED器件，其具有纹理化的密封剂，其与其上设置有至少一个LED芯片的安装表面保持一致。 可以在包装之前或期间将可以使用添加剂或减色过程进行纹理化的纹理密封剂施加到LED。 密封剂包括至少一个纹理表面，光从该表面发射。 纹理表面有助于减少密封剂内的全内反射，提高输出分布的提取效率和色温均匀性。 几个芯片可以安装在单个纹理密封剂下面。 可以使用具有不规则表面的模具同时在许多LED上形成多个密封剂。

公开(公告)号：US20120032220A1

公开(公告)日：2012-02-09

申请号：US13272712

申请日：2011-10-13

申请人： Nathaniel O. Cannon ,  Mitchell Jackson

发明人： Nathaniel O. Cannon ,  Mitchell Jackson

IPC分类号： H01L33/44 ,  B05C11/10 ,  B05B1/00

CPC分类号： H01L33/507 ,  B05B7/066 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： Light emitting structures are disclosed that can include a semiconductor light emitting diode (LED) that includes a p-n junction active layer. A first layer can include a binder material having a thickness that is less than about 1000 μm, wherein the first layer is directly on the LED. A second layer can include phosphor particles, where the second layer can have a thickness that is less than about 1000 μm and can be directly on the first layer so that the first layer is between the LED and the second layer.

摘要翻译： 公开了可以包括包括p-n结有源层的半导体发光二极管（LED）的发光结构。 第一层可以包括厚度小于约1000μm的粘合剂材料，其中第一层直接在LED上。 第二层可以包括磷光体颗粒，其中第二层可以具有小于约1000μm的厚度并且可以直接在第一层上，使得第一层在LED和第二层之间。

公开(公告)号：US20090179213A1

公开(公告)日：2009-07-16

申请号：US12014404

申请日：2008-01-15

申请人： Nathaniel O. Cannon ,  Mitchell Jackson

发明人： Nathaniel O. Cannon ,  Mitchell Jackson

IPC分类号： H01L33/00 ,  B05C11/00

CPC分类号： H01L33/507 ,  B05B7/066 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： Methods are disclosed including applying a layer of binder material onto an LED structure. A luminescent solution including an optical material suspended in a solution is atomized using a flow of pressurized gas, and the atomized luminescent solution is sprayed onto the LED structure including the layer of binder material using the flow of pressurized gas.

摘要翻译： 公开了包括将一层粘合剂材料施加到LED结构上的方法。 将包含悬浮在溶液中的光学材料的发光溶液用加压气体流雾化，用加压气体流将雾化的发光液喷射到包含粘合剂材料层的LED结构体上。

公开(公告)号：US09431589B2

公开(公告)日：2016-08-30

申请号：US12002429

申请日：2007-12-14

申请人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

发明人： Ban P. Loh ,  Chenhua You ,  Bernd Keller ,  Nathaniel O. Cannon ,  Mitch Jackson ,  Ernest W. Combs

IPC分类号： H01L33/54 ,  H01L25/075

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.

公开(公告)号：US08791491B2

公开(公告)日：2014-07-29

申请号：US13164185

申请日：2011-06-20

申请人： Ban P. Loh ,  Nathaniel O. Cannon ,  Norbert Hiller ,  John Edmond ,  Mitch Jackson ,  Nicholas W. Medendorp, Jr.

发明人： Ban P. Loh ,  Nathaniel O. Cannon ,  Norbert Hiller ,  John Edmond ,  Mitch Jackson ,  Nicholas W. Medendorp, Jr.

IPC分类号： H01L33/00 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L33/52 ,  H01L24/97 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/4554

摘要： A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

摘要翻译： 用于发光器件封装的基座包括衬底。 第一接合焊盘和第二接合焊盘位于衬底的第一表面上。 第一接合焊盘包括朝向衬底的第一端偏移并且被配置为在其上接收发光二极管的管芯附着区域。 第二接合焊盘包括在第一接合焊盘和基板的第二端之间的接合区域以及第二接合焊盘延伸部，其在接合区域沿着基板的侧面朝向基板的角部在第一端部处延伸 基质。 第一和第二焊盘是基板的第二表面。 第一焊盘与衬底的第一端相邻并接触第二接合焊盘。 第二焊盘邻近衬底的第二端并接触第一接合焊盘。 公开了相关的LED封装和形成LED封装的方法。

公开(公告)号：US08618569B2

公开(公告)日：2013-12-31

申请号：US13272712

申请日：2011-10-13

申请人： Nathaniel O. Cannon ,  Mitchell Jackson

发明人： Nathaniel O. Cannon ,  Mitchell Jackson

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  B05B7/066 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2933/0041 ,  H01L2924/00014

摘要： Light emitting structures are disclosed that can include a semiconductor light emitting diode (LED) that includes a p-n junction active layer. A first layer can include a binder material having a thickness that is less than about 1000 μm, wherein the first layer is directly on the LED. A second layer can include phosphor particles, where the second layer can have a thickness that is less than about 1000 μm and can be directly on the first layer so that the first layer is between the LED and the second layer.

摘要翻译： 公开了可以包括包括p-n结有源层的半导体发光二极管（LED）的发光结构。 第一层可以包括厚度小于约1000μm的粘合剂材料，其中第一层直接在LED上。 第二层可以包括磷光体颗粒，其中第二层可以具有小于约1000μm的厚度，并且可以直接在第一层上，使得第一层在LED和第二层之间。