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    Method of manufacturing three-dimensional circuit device
    1.
    发明授权
    Method of manufacturing three-dimensional circuit device 有权
    制造三维电路装置的方法

    公开(公告)号：US08479387B2

    公开(公告)日：2013-07-09

    申请号：US12908217

    申请日：2010-10-20

    Applicant: Cheng-Feng Chiang

    Inventor： Cheng-Feng Chiang

    IPC: H01K3/22

    CPC classification number: H05K1/11 ,  H05K3/0014 ,  H05K3/182 ,  H05K2201/09118 ,  H05K2203/1476 ,  H05K2203/175 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49158

    Abstract: In a method of manufacturing a three-dimensional (3D) circuit device, conducting circuits are formed on a non-conductive base through electroplating. The non-conductive base, and a circuit pattern section, at least one conducting junction and at least one current-guiding junction provided on the base are formed through double injection molding process. An electrically conductive interface layer is formed on the circuit pattern section and the junctions; and then, metal circuits are formed on the circuit pattern section through electroplating. By providing the conducting junction and the current-guiding junction, when forming metal circuits through electroplating, electroplating current can be evenly distributed over the circuit pattern section to form metal coating with uniform thickness, which enables upgraded production efficiency and reduced cost in manufacturing a 3D circuit device.

    Abstract translation: 在制造三维（3D）电路器件的方法中，通过电镀在非导电基底上形成导电电路。 通过双注射成型工艺形成非导电基底和电路图形部分，至少一个导电结和设置在基底上的至少一个电流引导结。 在电路图形部分和接点上形成导电界面层; 然后通过电镀在电路图形部分上形成金属电路。 通过提供导电结和导流结，当通过电镀形成金属电路时，电镀电流可以均匀地分布在电路图形部分上，以形成均匀厚度的金属涂层，从而提高生产效率并降低制造3D的成本 电路设备。

    Carrying structure of semiconductor
    3.
    发明授权
    Carrying structure of semiconductor 有权
    半导体承载结构

    公开(公告)号：US08101962B2

    公开(公告)日：2012-01-24

    申请号：US12574223

    申请日：2009-10-06

    Applicant: Cheng-Feng Chiang

    Inventor： Cheng-Feng Chiang

    IPC: H01L33/00

    CPC classification number: H01L33/642 ,  H01L23/3677 ,  H01L23/3737 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A carrying structure of semiconductor includes a carrier made of a plastic material with a heat conduction region, each surface of the carrier has an interface layer formed on, and an electrically insulation circuit and a metal layer are defined on the interface layer. The insulation circuit is located on the surface of the heat conduction region and on an encircling annular region extended from two surfaces of the heat conduction region, and at the same time exposing parts of the carrier surface thereby splitting the metal layer on the interface layer into at least two electrodes. A thermal conductor formed in the heat conduction region has a LED chip adhered on it which has at least a contact point connected with the corresponding metal layer with a metal wiring so as to dissipate the heat generated by the chip rapidly with the thermal conductor.

    Abstract translation: 半导体的承载结构包括由具有导热区域的塑料材料制成的载体，载体的每个表面都形成有界面层，并且界面层上限定有电绝缘电路和金属层。 绝缘电路位于热传导区域的表面和从导热区域的两个表面延伸的环绕的环形区域上，并且同时使载体表面的部分露出，从而将界面层上的金属层分成 至少两个电极。 形成在导热区域的导热体具有附着在其上的LED芯片，其具有与金属布线至少与相应的金属层连接的接触点，以便用热导体快速散发由芯片产生的热量。

    Method for a plastic lead frame with reflective and conductive layer
    5.
    发明授权
    Method for a plastic lead frame with reflective and conductive layer 有权
    具有反射和导电层的塑料引线框架的方法

    公开(公告)号：US08220143B2

    公开(公告)日：2012-07-17

    申请号：US12470759

    申请日：2009-05-22

    Applicant: Cheng-Feng Chiang

    Inventor： Cheng-Feng Chiang

    IPC: H01R43/00 ,  C23C28/00

    CPC classification number: C23C18/1889 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/54 ,  H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: A plastic lead frame with reflection and conduction metal layer includes a base made of a metal catalyst containing or an organic substance containing plastic material, the base further includes a slanted reflection surface formed downwardly on top of the base; an insert slot continuously and staggeringly formed along the circumferential fringe of the base; a molded carrier made of non-metallic catalyst or organic substance containing plastic material accommodated in the insert slot; an interface layer formed on the surface of the base by chemical deposition; an insulation route formed on the surface of the base by ablating part of the interface layer with the laser beam radiation; and a metallic layer formed on the base by electroplating process thereby forming a plastic lead frame of excellent electrical conductivity and high light reflection property.

    Abstract translation: 具有反射和传导金属层的塑料引线框架包括由含有或含有塑料材料的有机物质的金属催化剂制成的基底，该基底还包括在基底的顶部向下形成的倾斜反射表面; 沿着基部的圆周边缘连续且交错地形成插入槽; 由非金属催化剂制成的模制载体或容纳在插入槽中的含有塑料材料的有机物质; 通过化学沉积形成在基底表面上的界面层; 通过用激光束辐射烧蚀界面层的一部分，形成在基体的表面上的绝缘路线; 以及通过电镀工艺在基底上形成的金属层，从而形成导电性优异，光反射性高的塑料引线框架。

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