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公开(公告)号：US08685789B2
公开(公告)日：2014-04-01
申请号：US12776199
申请日：2010-05-07
IPC分类号： H01L21/00
CPC分类号： H01L23/498 , B23K20/008 , B23K2101/32 , B23K2101/38 , H01L23/4952 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/05624 , H01L2224/291 , H01L2224/2919 , H01L2224/45014 , H01L2224/45015 , H01L2224/45032 , H01L2224/45033 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/45624 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4846 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/49175 , H01L2224/78316 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/20303 , H01L2924/20304 , H01L2924/20755 , H01L2924/30107 , H01L2224/45655 , H01L2224/45644 , H01L2224/45639 , H01L2224/45647 , H01L2924/0665 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/01049
摘要： A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
摘要翻译： 柔性导电带超声波接合到管芯的表面，端子与封装的引线框架结合。 多个带和/或多个粘合区域提供各种益处，例如高电流能力，降低的铺展电阻，由于接触面积大而导致的可靠接合，较低的成本和较高的通量，由于较少的粘结和测试区域。
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公开(公告)号：US20100214754A1
公开(公告)日：2010-08-26
申请号：US12776199
申请日：2010-05-07
CPC分类号： H01L23/498 , B23K20/008 , B23K2101/32 , B23K2101/38 , H01L23/4952 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/05624 , H01L2224/291 , H01L2224/2919 , H01L2224/45014 , H01L2224/45015 , H01L2224/45032 , H01L2224/45033 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/45624 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4846 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/49175 , H01L2224/78316 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/20303 , H01L2924/20304 , H01L2924/20755 , H01L2924/30107 , H01L2224/45655 , H01L2224/45644 , H01L2224/45639 , H01L2224/45647 , H01L2924/0665 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/01049
摘要： A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
摘要翻译： 柔性导电带超声波接合到管芯的表面，端子与封装的引线框架结合。 多个带和/或多个粘合区域提供各种益处，例如高电流能力，降低的铺展电阻，由于接触面积大而导致的可靠接合，较低的成本和较高的通量，由于较少的粘结和测试区域。
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公开(公告)号：US07745253B2
公开(公告)日：2010-06-29
申请号：US11675534
申请日：2007-02-15
IPC分类号： H01L21/44
CPC分类号： H01L23/498 , B23K20/008 , B23K2101/32 , B23K2101/38 , H01L23/4952 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/05624 , H01L2224/291 , H01L2224/2919 , H01L2224/45014 , H01L2224/45015 , H01L2224/45032 , H01L2224/45033 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/45624 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4846 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/49175 , H01L2224/78316 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/20303 , H01L2924/20304 , H01L2924/20755 , H01L2924/30107 , H01L2224/45655 , H01L2224/45644 , H01L2224/45639 , H01L2224/45647 , H01L2924/0665 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/01049
摘要： A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
摘要翻译： 柔性导电带超声波接合到管芯的表面，端子与封装的引线框架结合。 多个带和/或多个粘合区域提供各种益处，例如高电流能力，降低的铺展电阻，由于接触面积大而导致的可靠接合，较低的成本和较高的通量，由于较少的粘结和测试区域。
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公开(公告)号：US08511536B2
公开(公告)日：2013-08-20
申请号：US13578702
申请日：2011-03-30
IPC分类号： B23K31/02
CPC分类号： H01L24/84 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L31/18 , H01L31/188 , H01L2224/45014 , H01L2224/48245 , H01L2224/48247 , H01L2224/78343 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , Y02E10/50 , H01L2224/45099 , H01L2924/00
摘要： An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is movable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.
摘要翻译： 提供超声波接合系统。 超声波接合系统包括结合头组件和由粘合头组件支撑的接合工具。 该系统还包括一个按压构件，该按压构件适于压靠使用该接合工具粘结的接合材料。 按压构件由接合头组件支撑，并且能够独立于接合工具相对于接合头组件移动。 超声波接合系统也可以是用于将带状材料接合到太阳能电池的部分的超声波带接合系统或太阳能电池带接合系统。
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公开(公告)号：US20130140346A1
公开(公告)日：2013-06-06
申请号：US13578702
申请日：2011-03-30
IPC分类号： H01L31/18
CPC分类号： H01L24/84 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L31/18 , H01L31/188 , H01L2224/45014 , H01L2224/48245 , H01L2224/48247 , H01L2224/78343 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , Y02E10/50 , H01L2224/45099 , H01L2924/00
摘要： An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is movable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.
摘要翻译： 提供超声波接合系统。 超声波接合系统包括结合头组件和由粘合头组件支撑的接合工具。 该系统还包括一个按压构件，该按压构件适于压靠使用该接合工具粘结的接合材料。 按压构件由接合头组件支撑，并且能够独立于接合工具相对于接合头组件移动。 超声波接合系统也可以是用于将带状材料接合到太阳能电池的部分的超声波带接合系统或太阳能电池带接合系统。
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公开(公告)号：US20130042960A1
公开(公告)日：2013-02-21
申请号：US13578740
申请日：2011-04-29
CPC分类号： H01L31/18 , H01L24/45 , H01L31/0504 , H01L31/188 , H01L2224/45014 , H01L2224/45124 , H01L2224/78 , H01L2224/85 , H01L2224/85207 , H01L2924/00014 , H01L2924/13091 , Y02E10/50 , H01L2224/48 , H01L2924/00
摘要： An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.
摘要翻译： 提供超声波粘接机。 超声波接合机包括在接合操作期间构造成支撑工件的支撑结构。 所述超声波接合装置还包括位于所述支撑结构上方的上部接合工具，其被配置为将上部接合材料接合到所述工件的上侧;以及下部接合工具，其位于所述支撑结构的下方，并且被配置为将下部接合材料接合到 工件的下侧。 超声波接合机也可以是被配置为将上导电带和下导电带接合到太阳能基板的超声波带接合机。
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公开(公告)号：US08685791B2
公开(公告)日：2014-04-01
申请号：US13750741
申请日：2013-01-25
IPC分类号： H01L21/00
CPC分类号： H01L23/498 , B23K20/008 , B23K2101/32 , B23K2101/38 , H01L23/4952 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/05624 , H01L2224/291 , H01L2224/2919 , H01L2224/45014 , H01L2224/45015 , H01L2224/45032 , H01L2224/45033 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/45624 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/4846 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/49175 , H01L2224/78316 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/20303 , H01L2924/20304 , H01L2924/20755 , H01L2924/30107 , H01L2224/45655 , H01L2224/45644 , H01L2224/45639 , H01L2224/45647 , H01L2924/0665 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/01049
摘要： A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
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公开(公告)号：US20120273554A1
公开(公告)日：2012-11-01
申请号：US13539823
申请日：2012-07-02
CPC分类号： B23K20/10 , B23K2101/36
摘要： An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.
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公开(公告)号：US20120080507A1
公开(公告)日：2012-04-05
申请号：US13251741
申请日：2011-10-03
CPC分类号： B23K20/10 , B23K2101/36
摘要： An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.
摘要翻译： 提供超声波太阳能基板接合系统。 该系统包括结合头组件，其包括用于将带状材料结合到多个太阳能基底的接合工具。 该系统还包括色带馈送系统，其将连续长度的色带材料的部分连续地提供给接合工具，使得接合工具在带材的连续长度的部分和多个太阳能基底之间形成超声波接合。
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公开(公告)号：US08544717B2
公开(公告)日：2013-10-01
申请号：US13578740
申请日：2011-04-29
CPC分类号： H01L31/18 , H01L24/45 , H01L31/0504 , H01L31/188 , H01L2224/45014 , H01L2224/45124 , H01L2224/78 , H01L2224/85 , H01L2224/85207 , H01L2924/00014 , H01L2924/13091 , Y02E10/50 , H01L2224/48 , H01L2924/00
摘要： An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.
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