公开(公告)号：US07027638B2

公开(公告)日：2006-04-11

申请号：US09949111

申请日：2001-09-07

申请人： Chung-sam Jun ,  Sang-mun Chon ,  Hyoung-jin Kim ,  Dong-chun Lee ,  Sang-bong Choi ,  Sung-gon Ryu

发明人： Chung-sam Jun ,  Sang-mun Chon ,  Hyoung-jin Kim ,  Dong-chun Lee ,  Sang-bong Choi ,  Sung-gon Ryu

IPC分类号： G06K9/00

CPC分类号： G06T5/008 ,  G06T7/90 ,  G06T2207/20021 ,  G06T2207/30148

摘要： A method for correcting color variations on the surface of a wafer, a method for selectively detecting a defect from different patterns, and computer readable recording media for the same are provided. Color variations in images of different parts of a wafer can be corrected using the mean and standard deviation of grey level values for the pixels forming each of the different parts of the wafer. In addition, different threshold values are applied to metal interconnect patterns and spaces of the wafer so that a defect can be selectively detected from the different patterns. Thus, a bridge known as a fatal, or killing defect to a semiconductor device can be detected without also falsely detecting grains as fatal defects. Due to increased defect screening capacity of the methods, the defect detecting method can be further efficiently managed.

公开(公告)号：US07902664B2

公开(公告)日：2011-03-08

申请号：US11878084

申请日：2007-07-20

申请人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Kyung-du Kim ,  Sun-kyu Hwang

发明人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Kyung-du Kim ,  Sun-kyu Hwang

IPC分类号： H01L23/34

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0231 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

摘要翻译： 示例实施例涉及半导体封装。 半导体封装可以包括安装基板，安装到安装基板的半导体芯片，穿过其中并安装到安装基板的至少一个无源部件，以及覆盖安装基板，半导体芯片和至少一个无源部件 。

公开(公告)号：US20070172690A1

公开(公告)日：2007-07-26

申请号：US11399499

申请日：2006-04-07

申请人： Si-suk Kim ,  Kwang-su Yu ,  Dong-chun Lee ,  Jae-hoon Choi

发明人： Si-suk Kim ,  Kwang-su Yu ,  Dong-chun Lee ,  Jae-hoon Choi

IPC分类号： B32B15/01

CPC分类号： H05K3/3436 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/40 ,  B32B15/01 ,  B32B15/018 ,  C22C13/00 ,  C22C13/02 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16225 ,  H05K3/3463 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T428/12708 ,  H01L2924/00014

摘要： A joining method, a method of mounting a semiconductor package (PKG) using the same, and a substrate-joining structure prepared thereby are provided. The joining method may comprise placing a first junction composition including tin and silver, and a second junction composition, including tin and bismuth to contact each other and forming a junction by performing a thermal treatment on the junction compositions at a temperature of at least 170° C. or higher.

摘要翻译： 提供了一种接合方法，一种安装使用其的半导体封装（PKG）的方法以及由此制备的基片接合结构。 接合方法可以包括将包含锡和银的第一接合组合物和包含锡和铋的第二接合组合物彼此接触并通过在接合组合物上在至少170°的温度下进行热处理形成接合部 C.或更高。

公开(公告)号：US08218330B2

公开(公告)日：2012-07-10

申请号：US11862521

申请日：2007-09-27

申请人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Jun-young Lee ,  Jung-hyeon Kim

发明人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Jun-young Lee ,  Jung-hyeon Kim

IPC分类号： H05K1/18

CPC分类号： H05K1/183 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/184 ,  H05K3/3442 ,  H05K2201/09981 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/0242 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2224/0401

摘要： A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.

摘要翻译： 一种可重复操作的无源元件嵌入式印刷电路板（PCB），其包括板构件，第一和第二填充物以及第一无源元件。 板构件具有彼此间隔开的第一和第二通孔。 第一和第二填充物分别埋在第一和第二通孔中，并由可回流的导电材料形成。 第一无源元件包括第一和第二电极。 第一插入槽形成在第一和第二通孔之间的板构件的表面的一部分中，以及第一和第二填充物的一部分。 第一无源元件安装在第一插入槽上。 第一电极包括底表面和接触第一填充物的一侧和暴露的上表面。 第二电极包括底表面和接触第二填充物的一侧和暴露的上表面。

公开(公告)号：US20080079118A1

公开(公告)日：2008-04-03

申请号：US11862521

申请日：2007-09-27

申请人： Hyo-jae BANG ,  Dong-chun Lee ,  Seong-chan Han ,  Jun-young Lee ,  Jung-hyeon Kim

发明人： Hyo-jae BANG ,  Dong-chun Lee ,  Seong-chan Han ,  Jun-young Lee ,  Jung-hyeon Kim

IPC分类号： H01L29/00 ,  H05K3/30

CPC分类号： H05K1/183 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/184 ,  H05K3/3442 ,  H05K2201/09981 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/0242 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2224/0401

摘要： A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.

摘要翻译： 一种可重复操作的无源元件嵌入式印刷电路板（PCB），其包括板构件，第一和第二填充物以及第一无源元件。 板构件具有彼此间隔开的第一和第二通孔。 第一和第二填充物分别埋在第一和第二通孔中，并由可回流的导电材料形成。 第一无源元件包括第一和第二电极。 第一插入槽形成在第一和第二通孔之间的板构件的表面的一部分中，以及第一和第二填充物的一部分。 第一无源元件安装在第一插入槽上。 第一电极包括底表面和接触第一填充物的一侧和暴露的上表面。 第二电极包括底表面和接触第二填充物的一侧和暴露的上表面。

公开(公告)号：US20110216516A1

公开(公告)日：2011-09-08

申请号：US13006692

申请日：2011-01-14

申请人： Jung-hoon Kim ,  Seong-chan Han ,  Dong-chun Lee ,  Jae-hoon Choi ,  Sun-kyu Hwang

发明人： Jung-hoon Kim ,  Seong-chan Han ,  Dong-chun Lee ,  Jae-hoon Choi ,  Sun-kyu Hwang

IPC分类号： H05K7/00

CPC分类号： H05K7/00

摘要： A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

摘要翻译： 公开了半导体模块，用于其的插座和半导体模块/插座组件。 半导体模块包括具有多个半导体器件，多个绝缘层和多个金属层的印刷电路板，多个绝缘层和多个金属层交替堆叠。 金属层的露出部分在印刷电路板的第一和第二端处暴露于半导体模块的外部。 第一端和第二端位于印刷电路板的相对端。

公开(公告)号：US20080044951A1

公开(公告)日：2008-02-21

申请号：US11812145

申请日：2007-06-15

申请人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Chang-yong Park ,  Hun Han

发明人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Chang-yong Park ,  Hun Han

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L21/563 ,  H01L24/10 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package may include a substrate having external contact terminals. A semiconductor chip having bonding pads may be formed on the substrate. Conductive bumps may connect the external contact terminals of the substrate to the bonding pads of the semiconductor chip. An underfill may be interposed between the substrate and the semiconductor chip. The underfill may include a first underfill region composed of a first material adjacent to the semiconductor chip and a second underfill region composed of a second material adjacent to the substrate, the first material having a higher glass transition temperature than the second material.

摘要翻译： 半导体封装可以包括具有外部接触端子的衬底。 具有接合焊盘的半导体芯片可以形成在基板上。 导电凸块可以将衬底的外部接触端子连接到半导体芯片的接合焊盘。 可以在基板和半导体芯片之间插入底部填充物。 底部填充物可以包括由与半导体芯片相邻的第一材料组成的第一底部填充区域和由与基底相邻的第二材料构成的第二底部填充区域，第一材料具有比第二材料更高的玻璃化转变温度。

公开(公告)号：US20080023812A1

公开(公告)日：2008-01-31

申请号：US11878084

申请日：2007-07-20

申请人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Kyung-du Kim ,  Sun-kyu Hwang

发明人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Kyung-du Kim ,  Sun-kyu Hwang

IPC分类号： H01L23/488

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0231 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

摘要翻译： 示例实施例涉及半导体封装。 半导体封装可以包括安装基板，安装到安装基板的半导体芯片，穿过其中并安装到安装基板的至少一个无源部件，以及覆盖安装基板，半导体芯片和至少一个无源部件 。