公开(公告)号：US4642069A

公开(公告)日：1987-02-10

申请号：US782903

申请日：1985-10-02

申请人： Daisaku Sawada ,  Masami Sugaya ,  Ryuji Imai ,  Yoshinobu Soga

发明人： Daisaku Sawada ,  Masami Sugaya ,  Ryuji Imai ,  Yoshinobu Soga

IPC分类号： F16H9/00 ,  F16H61/00 ,  F16H61/662 ,  F16H11/04

CPC分类号： F16H61/662

摘要： A hydraulic control system for a continuously variable transmission having a first and a second variable-diameter pulley provided on a first and a second shaft, a transmission belt connecting the first and second pulleys to transmit power from one of the first and second pulleys to the other, and a pair of hydraulic cylinders for changing an effective diameter of the pulleys engaging the belt. The hydraulic control system includes a hydraulic source delivering a pressurized fluid, and a flow control device for controlling a flow of the pressurized fluid from said hydraulic source into one of said hydraulic cylinders, and a flow of the fluid from said one hydraulic cylinder, thereby changing the effective diameters of the pulleys to vary a speed ratio of the transmission. The control system comprises a pressure regulating device for regulating the pressurized fluid which is delivered from the hydraulic source and applied to the flow control device so that a pressure of the pressurized fluid is higher than a pressure in the above-indicated one hydraulic cylinder by a predetermined value.

摘要翻译： 一种用于无级变速器的液压控制系统，其具有设置在第一和第二轴上的第一和第二可变直径滑轮，连接第一和第二滑轮以将动力从第一和第二滑轮之一传递到第一和第二滑轮的传动皮带 以及用于改变与皮带接合的滑轮的有效直径的一对液压缸。 液压控制系统包括输送加压流体的液压源和用于控制加压流体从所述液压源流入所述液压缸中的一个的流量控制装置，以及来自所述一个液压缸的流体流，由此 改变滑轮的有效直径以改变变速器的速比。 控制系统包括压力调节装置，用于调节从液压源输送并施加到流量控制装置的加压流体，使得加压流体的压力高于上述一个液压缸中的压力 预定值。

公开(公告)号：US4685357A

公开(公告)日：1987-08-11

申请号：US801831

申请日：1985-11-26

申请人： Daisaku Sawada ,  Masami Sugaya ,  Yoshinobu Soga ,  Ryuji Imai

发明人： Daisaku Sawada ,  Masami Sugaya ,  Yoshinobu Soga ,  Ryuji Imai

IPC分类号： F16H9/00 ,  F16H61/00 ,  F16H61/662 ,  B60K41/16

CPC分类号： F16H61/66272 ,  Y10T477/624 ,  Y10T477/6242 ,  Y10T477/62427

摘要： A hydraulic control system for a continuously variable transmission having two variable-diameter pulleys, a belt connecting the pulleys to transmit power from one of the pulleys to the other, and corresponding cylinders for changing effective diameters of the pulleys. The control system comprises: a hydraulic source delivering a pressurized fluid; a first pressure regulating device for regulating the pressurized fluid to apply a first line pressure to one of the cylinders for controlling a tension of the belt; a flow control device for controlling flow of the fluid into and from the other cylinder to change the effective diameters of the pulleys to vary a speed ratio of the transmission; a second pressure regulating device provided between the hydraulic source and the first pressure regulating device to regulate the pressurized fluid to apply a second line pressure to the flow control device, the second line pressure being higher than a pressure in the above-indicated hydraulic cylinder or the first line pressure by a predetermined value; and a releasing device for releasing the second pressure regulating device from its regulating operation while the speed ratio of the transmission is changed with the fluid discharged from the above-indicated other cylinder, or while the speed ratio is held constant.

摘要翻译： 一种用于无级变速器的液压控制系统，其具有两个可变直径的滑轮，连接滑轮以将功率从一个滑轮传递到另一个的皮带，以及用于改变皮带轮的有效直径的对应的气缸。 控制系统包括：输送加压流体的液压源; 第一压力调节装置，用于调节加压流体以向一个气缸施加第一管路压力，以控制带的张力; 流量控制装置，用于控制流体进入和流出另一个气缸以改变滑轮的有效直径以改变变速器的速比; 第二压力调节装置，设置在液压源和第一压力调节装置之间，以调节加压流体以向流量控制装置施加第二管路压力，第二管路压力高于上述液压缸中的压力或 第一行压力达预定值; 以及释放装置，用于当从上述另一个气缸排出的流体改变变速器的速比时，或者当变速比保持恒定时，释放第二压力调节装置的调节操作。

公开(公告)号：US5721453A

公开(公告)日：1998-02-24

申请号：US895990

申请日：1992-06-08

申请人： Ryuji Imai ,  Rokuro Kanbe

发明人： Ryuji Imai ,  Rokuro Kanbe

IPC分类号： H01L23/12 ,  H01L23/538 ,  H05K1/11 ,  H05K3/46 ,  H01L23/053

CPC分类号： H01L23/5383 ,  H01L2924/0002 ,  H05K1/115

摘要： An integrated circuit package comprises a power supply conductor film having a potential and conductor columns insulated from and passed through the power supply conductor film. A power supply conductor column comprises one of the conductor columns connected to a power supply having a potential different from the power supply conductor film. The other conductor columns are signal conductor columns for exchanging signals with mounted integrated circuits. An insulation space between the power supply conductor film and the power supply conductor column is greater than an insulation space between the power supply conductor film and a signal conductor column. Thereby, a probability of short-circuit occurrence in the power supply conductor film across the power supply conductor column is lowered.

摘要翻译： 集成电路封装包括具有与电源导体膜绝缘并通过电源导体膜的电位和导体柱的电源导体膜。 电源导体柱包括连接到具有不同于电源导体膜的电位的电源的导体列中的一个。 其他导体列是用于与安装的集成电路交换信号的信号导体列。 电源导体膜和电源导体柱之间的绝缘空间大于电源导体膜和信号导体柱之间的绝缘空间。 由此，供电导体柱的电源导体膜的短路发生的概率降低。

公开(公告)号：US5442145A

公开(公告)日：1995-08-15

申请号：US134606

申请日：1993-10-12

申请人： Ryuji Imai ,  Toshikatsu Takada

发明人： Ryuji Imai ,  Toshikatsu Takada

IPC分类号： C23C14/16 ,  H01L23/498 ,  H01L23/50 ,  H05K1/00

CPC分类号： H01L23/498 ,  H01L2924/0002 ,  H01L2924/09701

摘要： A terminal for an electric circuit device, comprises a copper core, a gold (Au) layer provided over the copper core, and a nickel (Ni) layer having the thickness of 1.5 .mu.m or less, provided under the gold (Au) layer. In another embodiment, the core is made of an alloy containing (Ni) and covered by a metallized surface layer made of copper.

摘要翻译： 电路装置的端子包括铜芯，设置在铜芯上方的金（Au）层和设置在金（Au）层下方的厚度为1.5μm以下的镍（Ni）层 。 在另一个实施例中，芯由含有（Ni）的合金制成并由铜制成的金属化表面层覆盖。

公开(公告)号：US5468997A

公开(公告)日：1995-11-21

申请号：US368384

申请日：1994-12-30

申请人： Ryuji Imai ,  Rokuro Kanbe

发明人： Ryuji Imai ,  Rokuro Kanbe

IPC分类号： H01L23/538 ,  H01L23/522 ,  H01L23/48 ,  H01L29/41

CPC分类号： H01L23/5383 ,  H01L23/5385 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16152

摘要： An integrated circuit package in which three conductor columns for connecting an insulating substrate and an integrated circuit are connected in parallel for use as I/O vias. Thereby, the conductor columns in a multilayer wiring portion between an integrated circuit and an insulating substrate is prevented from disconnecting.

摘要翻译： 用于连接绝缘基板和集成电路的三个导体柱并联连接用作I / O通孔的集成电路封装。 由此，防止集成电路和绝缘基板之间的多层布线部分中的导体柱断开。

公开(公告)号：US5901050A

公开(公告)日：1999-05-04

申请号：US914610

申请日：1997-08-21

申请人： Ryuji Imai

发明人： Ryuji Imai

IPC分类号： H01L23/02 ,  H01L23/055 ,  H01L23/10 ,  H01L23/498 ,  H05K3/32 ,  H05K9/00 ,  H05K7/02

CPC分类号： H01L23/49827 ,  H01L23/055 ,  H01L23/10 ,  H01L23/49822 ,  H05K3/325 ,  H05K9/0039 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/16152 ,  H01L2924/3011

摘要： In a wired base plate for an electronic part, an infinite number of metallic posts made of copper are provided to a lid joining section of a plural wire layer portion, which section includes a lid joining surface area to which a lid is joined. The metallic posts supports a pressure applied thereto from a lid at the time of mounting of the wired base plate on a circuit board and prevent the plural wire layer portion having a plurality of conductor wire layers and a plurality of resinous insulation layers, from being deformed by compression. A package for an electronic part having such a wired base plate is also provided.

摘要翻译： 在用于电子部件的有线基板中，由多个金属丝层部分的盖接合部分提供无数个由铜制成的金属柱，该部分包括盖接合的盖接合表面区域。 金属支柱在将布线基板安装在电路板上时从盖子施加的压力，并且防止具有多根导线层和多个树脂绝缘层的多个导线层部分变形 通过压缩。 还提供了一种用于具有这种有线基板的电子部件的封装。

公开(公告)号：US5196089A

公开(公告)日：1993-03-23

申请号：US751326

申请日：1991-08-28

申请人： Toshikatsu Takada ,  Ryuji Imai ,  Rokuro Kambe

发明人： Toshikatsu Takada ,  Ryuji Imai ,  Rokuro Kambe

IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/46

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/5384 ,  H05K3/4605 ,  H05K3/4647 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2203/0361 ,  H05K2203/0733 ,  H05K3/108 ,  H05K3/243 ,  H05K3/388

摘要： In a method of fabricating a multilayered interconnection for integrated circuit package, a coating of a metallized conductive pattern is formed on an upper surface of the substrate. A plurality of vertical copper studs are formed on the substrate for an interconnection with the metallized conductive pattern. A polyimide slurry is provided on the surface of the substrate to cover each top surface of the conductive studs. An upper surface of the polyimide slurry is polished to expose each top surface of the copper studs. A masking film is provided on each top surface of the copper studs prior to supplying an intermediate derivative of a polyimide polymer. The masking film works to protect the intermediate derivative against an chemically reaction with the copper studs to avoid a chelate compound from being produced at the time of heating step followed; A coat of the intermediate derivative of the polyimide polymer is provided entirely on the polished surface of the polyimide slurry, and is heated to form a coating of a polyimide layer. Then the coating of the polyimide layer is partly removed to expose portions corresponding to each top surface of the copper studs. The masking film is removed by etching.

摘要翻译： 在制造用于集成电路封装的多层互连的方法中，金属化导电图案的涂层形成在基板的上表面上。 在基板上形成多个垂直铜柱以与金属化导电图案互连。 在衬底的表面上提供聚酰亚胺浆料以覆盖导电柱的每个顶表面。 抛光聚酰亚胺浆料的上表面以暴露铜柱头的每个顶表面。 在提供聚酰亚胺聚合物的中间衍生物之前，在铜螺柱的每个顶表面上提供掩模膜。 掩模膜用于保护中间体衍生物免受铜柱的化学反应，以避免在加热步骤之后产生螯合化合物; 聚酰亚胺聚合物的中间体衍生物的涂层完全设置在聚酰亚胺浆料的抛光表面上，并加热形成聚酰亚胺层的涂层。 然后部分去除聚酰亚胺层的涂层，以露出对应于铜螺柱的每个顶表面的部分。 通过蚀刻去除掩模膜。

公开(公告)号：US06941210B2

公开(公告)日：2005-09-06

申请号：US10659316

申请日：2003-09-11

申请人： Takahiro Kondo ,  Toshimitsu Sato ,  Hisanori Nomoto ,  Naoyuki Sakamoto ,  Yoshiharu Harada ,  Toshio Sugimura ,  Masayasu Mizobuchi ,  Ryuji Imai

发明人： Takahiro Kondo ,  Toshimitsu Sato ,  Hisanori Nomoto ,  Naoyuki Sakamoto ,  Yoshiharu Harada ,  Toshio Sugimura ,  Masayasu Mizobuchi ,  Ryuji Imai

IPC分类号： F02D29/00 ,  F02D45/00 ,  F02P5/15 ,  F02P5/152 ,  F02P5/153 ,  F16H61/04 ,  F16H59/74

CPC分类号： B60W30/18 ,  B60W10/04 ,  B60W10/11 ,  B60W30/1819 ,  B60W2510/1025 ,  B60W2510/105 ,  B60W2520/10 ,  B60W2710/0666 ,  F02D35/027 ,  F02D41/0225 ,  F02D41/023 ,  F02D41/187 ,  F02D2200/0404 ,  F02D2200/0406 ,  F02D2200/0414 ,  F02D2200/0602 ,  F02D2200/501 ,  F02D2200/602 ,  F02D2250/21 ,  F02P5/1504 ,  F16H61/0437 ,  F16H61/686 ,  F16H63/502 ,  F16H2306/42 ,  Y02T10/46 ,  Y10T477/67 ,  Y10T477/688

摘要： An apparatus for controlling ignition timing during a shift in a vehicular automatic transmission is provided that is capable of suppressing shift shock in the event that input torque of the automatic transmission is affected by external changes, such as changes in fuel and air pressure and the like, by adjusting immediately to those changes. This control apparatus is provided with an ignition timing controller that controls an ignition timing retard amount; a calculator that calculates a basic retard amount; a detector that detects an engine retard amount; a determinator that determines a retard correction value based on a shift mode of the automatic transmission and the like; and a corrector that corrects the ignition timing retard amount of the controller based on the retard correction value, the basic retard amount, and the engine retard amount.

摘要翻译： 提供一种用于在车辆自动变速器的换档期间控制点火正时的装置，其能够在自动变速器的输入转矩受到燃料和空气压力等的变化等外部变化的影响的情况下抑制换档冲击 ，通过立即调整这些变化。 该控制装置设置有点火正时控制器，其控制点火正时延迟量; 计算基本延迟量的计算器; 检测发动机延迟量的检测器; 确定器，其基于自动变速器的换档模式等来确定延迟校正值; 以及校正器，其基于延迟校正值，基本延迟量和发动机延迟量来校正控制器的点火正时延迟量。

公开(公告)号：US5479138A

公开(公告)日：1995-12-26

申请号：US364041

申请日：1994-12-27

申请人： Masao Kuroda ,  Sotaro Tsukamoto ,  Susumu Wakamatsu ,  Ryuji Imai

发明人： Masao Kuroda ,  Sotaro Tsukamoto ,  Susumu Wakamatsu ,  Ryuji Imai

IPC分类号： H01P3/08 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC分类号： H01P3/088 ,  H05K1/0253 ,  H05K1/0224 ,  H05K1/0298 ,  H05K2201/09681 ,  H05K3/0005

摘要： In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, .ltoreq.25.98.times.Rx.sup.-0.3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)}.sup.2 .times.100.

摘要翻译： 在具有带状结构的多层布线板中，其中接地导体布线和信号电路布线之间设置有绝缘层，所述接地导体布线为格栅形式，开口面积比Rx [ ％]，线宽比Ry = Wg / Ws具有由Ry表示的关系，其中Wg是接地导体布线的线宽，Sg是开口的宽度， Ws是信号电路布线的线宽，Rx = {Sg /（Wg + Sg）}×100×100。

公开(公告)号：US5331204A

公开(公告)日：1994-07-19

申请号：US962419

申请日：1992-10-19

申请人： Masao Kuroda ,  Ryuji Imai ,  Toshiya Asano

发明人： Masao Kuroda ,  Ryuji Imai ,  Toshiya Asano

IPC分类号： H01L23/12 ,  H01L23/14 ,  H01L23/50 ,  H01L23/538 ,  H01L23/64 ,  H05K3/46 ,  H01L23/48 ,  H01L23/02 ,  H01L29/46 ,  H01L39/02

CPC分类号： H01L23/538 ,  H01L23/50 ,  H01L23/64 ,  H01L2924/0002 ,  H01L2924/3011

摘要： An object of the present invention is to match impedance of each portion of whole lines of a signal wiring with the integrated circuit mounted on the package. All ground planes are deleted within a region vertically under/above a connection pad provided on the top- or bottom-surface of a polyimide multilayer part, whereby no capacitance is generated between the connection pad and the ground planes, so that the impedance of the signal wiring within the region right under/above the connection pad is prevented from being lowered.

摘要翻译： 本发明的目的是使信号布线的整个线路的每一部分的阻抗与安装在封装上的集成电路相匹配。 所有接地层在垂直于设置在聚酰亚胺多层部件的顶表面或底面的连接焊盘的下方或上方的区域内被删除，由此在连接焊盘和接地层之间不产生电容，使得 防止连接垫正下方/下方的区域内的信号线被降低。