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公开(公告)号：US20150171188A1
公开(公告)日：2015-06-18
申请号：US14633984
申请日：2015-02-27
Inventor： Hyung Sup YOON , Byoung-Gue MIN , Jong-Won LIM , Hokyun AHN , Seong-Il Kim , Sang Heung LEE , Dong Min KANG , Chull Won JU , Jae Kyoung MUN
IPC: H01L29/66 , H01L29/201 , H01L21/02 , H01L21/28 , H01L21/311 , H01L29/423 , H01L29/20 , H01L29/205
CPC classification number: H01L29/66462 , H01L21/02118 , H01L21/0217 , H01L21/02178 , H01L21/0254 , H01L21/28264 , H01L21/28593 , H01L21/31111 , H01L21/31144 , H01L29/2003 , H01L29/201 , H01L29/205 , H01L29/404 , H01L29/42316 , H01L29/42376 , H01L29/778 , H01L29/7786
Abstract: A field effect transistor is provided. The field effect transistor may include a capping layer on a substrate, a source ohmic electrode and a drain ohmic electrode on the capping layer, a first insulating layer and a second insulating layer stacked on the capping layer to cover the source and drain ohmic electrodes, a Γ-shaped gate electrode including a leg portion and a head portion, the leg portion being connected to the substrate between the source ohmic electrode and the drain ohmic electrode, and the head portion extending from the leg portion to cover a top surface of the second insulating layer, a first planarization layer on the second insulating layer to cover the Γ-shaped gate electrode, and a first electrode on the first planarization layer, the first electrode being connected to the source ohmic electrode or the drain ohmic electrode.
Abstract translation: 提供场效应晶体管。 场效应晶体管可以包括衬底上的覆盖层，覆盖层上的源欧姆电极和漏极欧姆电极，堆叠在覆盖层上以覆盖源极和漏极欧姆电极的第一绝缘层和第二绝缘层， 包括脚部和头部的栅格电极，所述脚部分连接到所述源欧姆电极和所述漏极欧姆电极之间的衬底，并且所述头部从所述腿部延伸以覆盖所述源极欧姆电极和所述漏极欧姆电极的顶表面 所述第二绝缘层，在所述第二绝缘层上覆盖所述栅格电极的第一平坦化层和所述第一平坦化层上的第一电极，所述第一电极连接到所述源欧姆电极或所述漏极欧姆电极。
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公开(公告)号：US20150087142A1
公开(公告)日：2015-03-26
申请号：US14555182
申请日：2014-11-26
Inventor： Jong-Won LIM , Ho Kyun AHN , Young Rak PARK , Dong Min KANG , Woo Jin CHANG , Seong-il KIM , Sung Bum BAE , Sang-Heung LEE , Hyung Sup YOON , Chull Won JU , Jae Kyoung MUN , Eun Soo NAM
IPC: H01L29/66 , H01L21/311 , H01L21/28 , H01L29/423
CPC classification number: H01L29/66431 , H01L21/28255 , H01L21/31116 , H01L21/31144 , H01L29/1608 , H01L29/42316 , H01L29/42376 , H01L29/66068 , H01L29/7787
Abstract: Disclosed is a manufacturing method of a high electron mobility transistor. The method includes: forming a source electrode and a drain electrode on a substrate; forming a first insulating film having a first opening on an entire surface of the substrate, the first opening exposing a part of the substrate; forming a second insulating film having a second opening within the first opening, the second opening exposing a part of the substrate; forming a third insulating film having a third opening within the second opening, the third opening exposing a part of the substrate; etching a part of the first insulating film, the second insulating film and the third insulating film so as to expose the source electrode and the drain electrode; and forming a T-gate electrode on a support structure including the first insulating film, the second insulating film and the third insulating film.
Abstract translation: 公开了一种高电子迁移率晶体管的制造方法。 该方法包括：在基板上形成源电极和漏电极; 在所述基板的整个表面上形成具有第一开口的第一绝缘膜，所述第一开口暴露所述基板的一部分; 在所述第一开口内形成具有第二开口的第二绝缘膜，所述第二开口暴露所述基板的一部分; 在所述第二开口内形成具有第三开口的第三绝缘膜，所述第三开口暴露所述基板的一部分; 蚀刻第一绝缘膜，第二绝缘膜和第三绝缘膜的一部分，以使源电极和漏电极露出; 以及在包括第一绝缘膜，第二绝缘膜和第三绝缘膜的支撑结构上形成T栅电极。
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公开(公告)号：US20140213045A1
公开(公告)日：2014-07-31
申请号：US14230031
申请日：2014-03-31
Inventor： Sung Bum BAE , Eun Soo NAM , Jae Kyoung MUN , Sung Bock KIM , Hae Cheon KIM , Chull Won JU , Sang Choon KO , Jong-Won LIM , Ho Kyun AHN , Woo Jin CHANG , Young Rak PARK
IPC: H01L29/66
CPC classification number: H01L29/66446 , H01L21/0242 , H01L21/02458 , H01L21/0254 , H01L21/02647 , H01L21/8252 , H01L27/0605 , H01L27/0883
Abstract: The present disclosure relates to a nitride electronic device and a method for manufacturing the same, and particularly, to a nitride electronic device and a method for manufacturing the same that can implement various types of nitride integrated structures on the same substrate through a regrowth technology (epitaxially lateral over-growth: ELOG) of a semi-insulating gallium nitride (GaN) layer used in a III-nitride semiconductor electronic device including Group III elements such as gallium (Ga), aluminum (Al) and indium (In) and nitrogen.
Abstract translation: 本发明涉及一种氮化物电子器件及其制造方法，特别涉及一种氮化物电子器件及其制造方法，该氮化物电子器件及其制造方法可以通过再生技术在同一衬底上实现各种氮化物一体化结构（ 用于包括III族元素如镓（Ga），铝（Al）和铟（In））和氮（III）的III族氮化物半导体电子器件中的半绝缘氮化镓（GaN）层的外延横向过度生长：ELOG） 。
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公开(公告)号：US20150380354A1
公开(公告)日：2015-12-31
申请号：US14845435
申请日：2015-09-04
Inventor： Byoung-Gue MIN , Sang Choon KO , Jong-Won LIM , Hokyun AHN , Hyung Sup YOON , Jae Kyoung MUN , Eun Soo NAM
IPC: H01L23/535 , H01L23/48
CPC classification number: H01L23/535 , H01L21/02365 , H01L21/28 , H01L21/76877 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/1305 , H01L2924/13091 , H01L2924/00
Abstract: A semiconductor device may include a substrate having a lower via-hole, an epitaxial layer having an opening exposing a top surface of the substrate, a semiconductor chip disposed on the top surface of the substrate and including first, second, and third electrodes, an upper metal layer connected to the first electrode, a supporting substrate disposed on the upper metal layer and having an upper via-hole, an upper pad disposed on the substrate and extending into the upper via-hole, a lower pad connected to the second electrode in the opening, and a lower metal layer covering a bottom surface of the substrate and connected to the lower pad through the lower via-hole.
Abstract translation: 半导体器件可以包括具有下通孔的衬底，具有暴露衬底的顶表面的开口的外延层，设置在衬底的顶表面上并包括第一，第二和第三电极的半导体芯片， 连接到第一电极的上金属层，设置在上金属层上并具有上通孔的支撑基板，设置在基板上并延伸到上通孔中的上焊盘，连接到第二电极的下焊盘 以及覆盖基板的底面的下金属层，并且通过下通路孔与下焊盘连接。
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公开(公告)号：US20140363937A1
公开(公告)日：2014-12-11
申请号：US14308000
申请日：2014-06-18
Inventor： Woo Jin CHANG , Jong-Won LIM , Ho Kyun AHN , Sang Choon KO , Sung Bum BAE , Chull Won JU , Young Rak PARK , Jae Kyoung MUN , Eun Soo NAM
CPC classification number: H01L29/66901 , H01L29/2003 , H01L29/401 , H01L29/402 , H01L29/42316 , H01L29/66462 , H01L29/7786
Abstract: Disclosed are a power semiconductor device and a method of fabricating the same which can increase a breakdown voltage of the device through a field plate formed between a gate electrode and a drain electrode and achieve an easier manufacturing process at the same time. The power semiconductor device according to an exemplary embodiment of the present disclosure includes a source electrode and a drain electrode formed on a substrate; a dielectric layer formed between the source electrode and the drain electrode to have a lower height than heights of the two electrodes and including an etched part exposing the substrate; a gate electrode formed on the etched part; a field plate formed on the dielectric layer between the gate electrode and the drain electrode; and a metal configured to connect the field plate and the source electrode.
Abstract translation: 公开了功率半导体器件及其制造方法，其可以通过形成在栅电极和漏电极之间的场板来增加器件的击穿电压，并且同时实现更容易的制造工艺。 根据本公开的示例性实施例的功率半导体器件包括形成在衬底上的源电极和漏电极; 形成在所述源电极和所述漏电极之间的电介质层具有比所述两个电极的高度低的高度，并且包括暴露所述衬底的蚀刻部分; 形成在蚀刻部分上的栅电极; 形成在栅电极和漏电极之间的电介质层上的场板; 以及配置成连接场板和源电极的金属。
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Patent Agency Ranking
公开(公告)号：US20230231404A1
公开(公告)日：2023-07-20
申请号：US18153155
申请日：2023-01-11
Inventor： Dong Yun JUNG , Kun Sik PARK , JONG IL WON , Hyun-Gyu JANG , Doohyung CHO , Jong-Won LIM
IPC: H02J7/00
CPC classification number: H02J7/007182 , H02J7/0047 , H02J7/00711 , H02J7/00714 , H02J2207/20
Abstract: There is provided a battery system including: a controller; a main switch controlled by the controller to supply or cut off a voltage of a battery to a load; and a semiconductor pre-charger module including a semiconductor switch connected in parallel with the main switch and configured to supply or cut off the voltage of the battery to the load according to a control signal output from the controller, and a semiconductor switch driver configured to receive the control signal from the controller and output a single pulse signal for driving the semiconductor switch to turn on and off the semiconductor switch. Here, the semiconductor switch driver of the semiconductor pre-charger module includes an isolation element configured to electrically isolate the controller and the battery voltage, and the semiconductor switch of the semiconductor pre-charger module is a MOS-controlled thyristor (MCT).
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公开(公告)号：US20170236909A1
公开(公告)日：2017-08-17
申请号：US15248676
申请日：2016-08-26
Inventor： Ho Kyun AHN , Dong Min KANG , Yong-Hwan KWON , Dong-Young KIM , SEONG IL KIM , Hae Cheon KIM , Eun Soo NAM , Jae Won DO , Byoung-Gue MIN , Hyung Sup YOON , Sang-Heung LEE , Jong Min LEE , Jong-Won LIM , Hyun Wook JUNG , Kyu Jun CHO
IPC: H01L29/40 , H01L29/66 , H01L29/778 , H01L29/20 , H01L29/205
CPC classification number: H01L29/404 , H01L21/6835 , H01L29/0619 , H01L29/0657 , H01L29/2003 , H01L29/205 , H01L29/401 , H01L29/4175 , H01L29/66462 , H01L29/7786 , H01L29/7787 , H01L2221/68327 , H01L2221/6834
Abstract: A high electron mobility transistor includes a substrate including a first surface and a second surface facing each other and having a via hole passing through the first surface and the second surface, an active layer on the first surface, a cap layer on the active layer and including a gate recess region exposing a portion of the active layer, a source electrode and a drain electrode on one of the cap layer and the active layer, an insulating layer on the source electrode and the drain electrode and having on opening corresponding to the gate recess region to expose the gate recess region, a first field electrode on the insulating layer, a gate electrode electrically connected to the first field electrode on the insulating layer, and a second field electrode on the second surface and contacting the active layer through the via hole.
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公开(公告)号：US20170133471A1
公开(公告)日：2017-05-11
申请号：US15238492
申请日：2016-08-16
Inventor： Jong Min LEE , Byoung-Gue MIN , Hyung Sup YOON , Dong Min KANG , Dong-Young KIM , SEONG-IL KIM , Hae Cheon KIM , Jae Won DO , Ho Kyun AHN , Sang-Heung LEE , Jong-Won LIM , Hyun Wook JUNG , Kyu Jun CHO , Chull Won JU
IPC: H01L29/40 , H01L29/66 , H01L29/778 , H01L29/20 , H01L29/205
CPC classification number: H01L29/408 , H01L29/2003 , H01L29/205 , H01L29/66462 , H01L29/7786 , H01L29/7787
Abstract: The present invention relates to a high reliability field effect power device and a manufacturing method thereof. A method of manufacturing a field effect power device includes sequentially forming a transfer layer, a buffer layer, a barrier layer and a passivation layer on a substrate, patterning the passivation layer by etching a first region of the passivation layer, and forming at least one electrode on the first region of the barrier layer exposed by patterning the passivation layer, wherein the first region is provided to form the at least one electrode, and the passivation layer may include a material having a wider bandgap than the barrier layer to prevent a trapping effect and a leakage current of the field effect power device.
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公开(公告)号：US20150129890A1
公开(公告)日：2015-05-14
申请号：US14583858
申请日：2014-12-29
Inventor： Hokyun AHN , Jong-Won LIM , Jeong-Jin KIM , Hae Cheon KIM , Jae Kyoung MUN , Eun Soo NAM
IPC: H01L29/778 , H01L29/51 , H01L29/205 , H01L29/20 , H01L29/201
CPC classification number: H01L29/7787 , H01L29/2003 , H01L29/201 , H01L29/205 , H01L29/42316 , H01L29/4236 , H01L29/42376 , H01L29/51 , H01L29/518 , H01L29/66462 , H01L29/7786
Abstract: A field effect transistor includes an active layer and a capping layer sequentially stacked on a substrate, and a gate electrode penetrating the capping layer and being adjacent to the active layer. The gate electrode includes a foot portion adjacent to the active layer and a head portion having a width greater than a width of the foot portion. The foot portion of an end part of the gate electrode has a width less than a width of the head portion of another part of the gate electrode and greater than a width of the foot portion of the another part of the gate electrode. The foot portion of the end part of the gate electrode further penetrates the active layer so as to be adjacent to the substrate.
Abstract translation: 场效应晶体管包括依次层叠在基板上的有源层和覆盖层，以及贯穿封盖层并与活性层相邻的栅电极。 栅电极包括与有源层相邻的脚部和具有大于脚部的宽度的宽度的头部。 栅电极的端部的脚部的宽度小于栅电极的另一部分的头部的宽度，并且大于栅极的另一部分的脚部的宽度。 栅电极的端部的脚部进一步穿过有源层，以与衬底相邻。
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公开(公告)号：US20190103483A1
公开(公告)日：2019-04-04
申请号：US16137235
申请日：2018-09-20
Inventor： Hokyun AHN , Min Jeong SHIN , Jeong Jin KIM , Hae Cheon KIM , Jae Won DO , Byoung-Gue MIN , Hyung Sup YOON , Hyung Seok LEE , Jong-Won LIM , Sungjae CHANG , Hyunwook JUNG , Kyu Jun CHO , Dong Min KANG , Dong-Young KIM , SEONG-IL KIM , Sang-Heung LEE , Jongmin LEE , Hong Gu JI
IPC: H01L29/78 , H01L29/20 , H01L29/45 , H01L29/417 , H01L29/423 , H01L29/66 , H01L21/3065
Abstract: Provided is a semiconductor device including a substrate in which an insulation layer is disposed between a first semiconductor layer and a second semiconductor layer, a through-hole penetrating through the substrate, the through-hole having a first hole penetrating through the first semiconductor layer and a second hole penetrating through the insulation layer and the second semiconductor layer from a bottom surface of the first hole, an epi-layer disposed inside the through-hole, a drain electrode disposed inside the second hole and contacting one surface of the epi-layer, and a source electrode and a gate electrode which are disposed on the other surface of the epi-layer.
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