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公开(公告)号：US12216404B2
公开(公告)日：2025-02-04
申请号：US17106170
申请日：2020-11-29
Applicant: FUJIFILM Corporation
Inventor： Masafumi Kojima , Minoru Uemura , Takashi Kawashima , Akiyoshi Goto , Kei Yamamoto , Kazuhiro Marumo , Keiyu Ou
Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator A that generates an acid represented by General Formula (I), the acid having a pKa of −1.00 or more; one or more selected from the group consisting of a photoacid generator B that generates an acid having a pKa larger than that of an acid generated from the photoacid generator A by 1.00 or more, and a nitrogen-containing compound C having a pKa of a conjugate acid thereof larger than that of the acid generated from the photoacid generator A by 1.00 or more; and an acid-decomposable resin, in which in a case where the actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator D that generates an acid having a pKa of less than −1.00, a ratio of the number of moles of the photoacid generator A to the number of moles of the photoacid generator D in the composition, is 1.0 or more.
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公开(公告)号：US12001140B2
公开(公告)日：2024-06-04
申请号：US17169757
申请日：2021-02-08
Applicant: FUJIFILM Corporation
Inventor： Kazunari Yagi , Akihiro Kaneko , Takashi Kawashima , Akiyoshi Goto
IPC: G03F7/039 , C08F212/14 , C08F220/18 , C08F220/58 , G03F7/038
CPC classification number: G03F7/039 , C08F212/24 , C08F220/1806 , C08F220/585 , G03F7/038
Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is excellent in LER performance and a collapse suppressing ability. Furthermore, the present invention provides a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin having a polarity that increases by the action of an acid; and a compound that generates an acid upon irradiation with actinic rays or radiation, in which the resin has a repeating unit represented by General Formula (B-1).
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公开(公告)号：US11467489B2
公开(公告)日：2022-10-11
申请号：US16805922
申请日：2020-03-02
Applicant: FUJIFILM Corporation
Inventor： Kazunari Yagi , Takashi Kawashima , Tomotaka Tsuchimura
Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains a compound that generates an acid upon irradiation with actinic rays or radiation and a resin whose polarity increases by the action of an acid, in which the compound is represented by a specific General Formula (X).
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公开(公告)号：US20210216012A1
公开(公告)日：2021-07-15
申请号：US17212546
申请日：2021-03-25
Applicant: FUJIFILM Corporation
Inventor： Akihiro KANEKO , Kazunari Yagi , Takashi Kawashima , Akiyoshi Goto
IPC: G03F7/004 , C08F220/18 , C08F220/28 , C08F212/14 , C08F220/36 , G03F7/039 , C09D125/18 , C09D133/10 , C09D133/16
Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is excellent in LER performance and a collapse suppressing ability. Furthermore, the present invention provides a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes an acid-decomposable resin having a repeating unit represented by General Formula (I), and a compound that generates an add upon irradiation with actinic rays or radiation.
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公开(公告)号：US09958576B2
公开(公告)日：2018-05-01
申请号：US15389546
申请日：2016-12-23
Applicant: FUJIFILM Corporation
Inventor： Takashi Kawashima , Keisuke Arimura
CPC classification number: G02B1/04 , C08K5/56 , G02B5/208 , G02B5/22 , H01L27/14618 , H01L27/14625 , H04N5/2257 , H04N5/238 , C08L25/06 , C08L33/26 , C08L33/08 , C08L33/10
Abstract: Provided are a near infrared ray absorbent composition which can form a cured film having excellent heat resistance while maintaining high near infrared ray shielding properties, and a near infrared ray cut filter, a manufacturing method of a near infrared ray cut filter, a solid image pickup element, and a camera module using the near infrared ray absorbent composition. The near infrared ray absorbent composition contains a compound having a partial structure represented by M-X, and a near infrared ray absorbent compound, and a content of the compound having a partial structure represented by M-X is greater than or equal to 15 mass % with respect to a total solid content of the near infrared ray absorbent composition. Here, M is an atom selected from Si, Ti, Zr, and Al, X is one type selected from a hydroxy group, an alkoxy group, an acyloxy group, a phosphoryloxy group, a sulfonyloxy group, an amino group, an oxime group, and O═C(Ra)(Rb), Ra and Rb each independently represent a monovalent organic group, and in a case in which X is O═C(Ra)(Rb), X is bonded to M by an unshared electron pair of an oxygen atom of a carbonyl group.
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Patent Agency Ranking
公开(公告)号：US09826129B2
公开(公告)日：2017-11-21
申请号：US14876287
申请日：2015-10-06
Applicant: FUJIFILM CORPORATION
Inventor： Takeshi Inasaki , Takashi Kawashima , Seiichi Hitomi , Kouitsu Sasaki
IPC: H04N5/225 , C07F9/30 , C07F7/18 , C07F9/40 , G02B5/20 , C07F9/12 , C07F9/09 , C07F9/143 , C07F9/58 , C07F1/08 , C07F9/06 , C09B57/10 , G02B5/22 , H04N5/33
CPC classification number: H04N5/2254 , C07F1/08 , C07F7/1804 , C07F9/06 , C07F9/098 , C07F9/12 , C07F9/143 , C07F9/304 , C07F9/4021 , C07F9/58 , C09B57/10 , G02B5/208 , G02B5/22 , H04N5/2257 , H04N5/33
Abstract: Provided are a near-infrared-ray-absorbing composition having strong near-infrared shielding properties when a cured film is produced, a near-infrared-ray cut filter, a manufacturing method therefor, a camera module, and a manufacturing method therefor. The near-infrared-ray-absorbing composition includes a copper complex obtained by reacting a compound (A) having at least two coordination sites with a copper component.
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公开(公告)号：US11886113B2
公开(公告)日：2024-01-30
申请号：US17002911
申请日：2020-08-26
Applicant: FUJIFILM Corporation
Inventor： Keita Kato , Michihiro Shirakawa , Akiyoshi Goto , Takashi Kawashima , Masafumi Kojima
IPC: G03F7/004 , C07C381/12 , C07D295/26 , C07D327/08 , C07D333/46 , C08L25/06 , C08L33/06 , C08L33/08 , C08L33/16 , G03F7/115 , G03F7/20
CPC classification number: G03F7/0045 , C07C381/12 , C07D295/26 , C07D327/08 , C07D333/46 , C08L25/06 , C08L33/064 , C08L33/08 , C08L33/16 , G03F7/115 , G03F7/2053
Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having an excellent pattern collapse suppressing property and excellent LWR performance can be obtained. In addition, the present invention also provides a resist film, a pattern forming method, and a method for manufacturing an electronic device, each regarding the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a resin whose solubility in a developer is changed by the action of an acid, a photoacid generator represented by General Formula (b1), and a solvent, in which the photoacid generator represented by General Formula (b1) is a compound that generates an acid having a pka of 1.0 or less upon irradiation with actinic rays or radiation
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公开(公告)号：US20200319551A1
公开(公告)日：2020-10-08
申请号：US16905566
申请日：2020-06-18
Applicant: FUJIFILM Corporation
Inventor： Tomotaka Tsuchimura , Takashi Kawashima , Akihiro Kaneko , Michihiro Ogawa , Michihiro Shirakawa , Hajime Furutani , Kyohei Sakita
IPC: G03F7/004 , G03F1/22 , G03F7/038 , G03F7/039 , G03F7/20 , C08F220/18 , C08F220/28 , C08F212/14
Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition that can provide a resist film with excellent sensitivity and a pattern with excellent LER performance, and can suppress pattern collapse during pattern formation. In addition, the present invention also provides a resist film, a pattern forming method, a mask blank with a resist film, a method for producing a photomask, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin X having a repeating unit A represented by General Formula (I), a repeating unit B having an acid-decomposable group, and a repeating unit C selected from a repeating unit c1 represented by General Formula (II) and the like; a compound Y which is a basic compound or ammonium salt compound whose basicity is reduced upon irradiation with actinic rays or radiation; and a photoacid generator Z which is a compound other than the compound Y.
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公开(公告)号：US12007688B2
公开(公告)日：2024-06-11
申请号：US16953305
申请日：2020-11-19
Applicant: FUJIFILM Corporation
Inventor： Daisuke Asakawa , Akiyoshi Goto , Masafumi Kojima , Takashi Kawashima , Yasufumi Oishi , Keita Kato
Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin including a repeating unit represented by Formula (1) and capable of increasing a polarity by an action of an acid.
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公开(公告)号：US11604414B2
公开(公告)日：2023-03-14
申请号：US16655447
申请日：2019-10-17
Applicant: FUJIFILM Corporation
Inventor： Michihiro Shirakawa , Hajime Furutani , Mitsuhiro Fujita , Tomotaka Tsuchimura , Takashi Kawashima , Michihiro Ogawa , Akihiro Kaneko , Hironori Oka , Yasuharu Shiraishi
Abstract: A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Conditions 1 and 2, Condition 1: The A value determined by Formula (1) is 0.14 or more, A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127) Formula (1): Condition 2: The concentration of the solid content in the photosensitive composition for EUV light is 2.5% by mass or less.
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