公开(公告)号：US4728533A

公开(公告)日：1988-03-01

申请号：US430291

申请日：1982-09-30

Applicant: Haim Feigenbaum ,  Sheldon Pudick

Inventor： Haim Feigenbaum ,  Sheldon Pudick

IPC: H01M8/02 ,  H01M2/08

CPC classification number: H01M8/0271

Abstract: A process for forming an integral edge seal in a gas distribution plate for use in a fuel cell. A seal layer is formed along an edge of a porous gas distribution plate by impregnating the pores in the layer with a material adapted to provide a seal which is operative dry or when wetted by an electrolyte of a fuel cell. Vibratory energy is supplied to the sealing material during the step of impregnating the pores to provide a more uniform seal throughout the cross section of the plate.

Abstract translation: 一种用于在用于燃料电池的气体分布板中形成整体边缘密封的方法。 通过用适于提供干燥的或当被燃料电池的电解液润湿的密封材料浸渍该层中的孔时，沿着多孔气体分配板的边缘形成密封层。 在浸渍孔隙的步骤期间将振动能量提供给密封材料，以在板的整个横截面上提供更均匀的密封。

公开(公告)号：US4450212A

公开(公告)日：1984-05-22

申请号：US430142

申请日：1982-09-30

Applicant: Haim Feigenbaum ,  Sheldon Pudick ,  Rajindar Singh

Inventor： Haim Feigenbaum ,  Sheldon Pudick ,  Rajindar Singh

IPC: C09K3/12 ,  H01M8/02 ,  H01M4/88

CPC classification number: C09K3/12 ,  H01M8/0271 ,  Y02P70/56

Abstract: In an improved seal for a gas distribution plate of a fuel cell, a groove is provided extending along an edge of the plate. A member of resinous material is arranged within the groove and a paste comprising an immobilized acid is arranged surrounding the member and substantially filling the groove. The seal, which is impervious to the gas being distributed, is resistant to deterioration by the electrolyte of the cell.

Abstract translation: 在用于燃料电池的气体分配板的改进的密封件中，沿着板的边缘延伸设置有槽。 树脂材料的构件设置在槽内，并且包括固定的酸的糊料被布置在构件周围并且基本上填充槽。 不透气体分布的密封件可抵抗电池电解质的劣化。

公开(公告)号：US4605602A

公开(公告)日：1986-08-12

申请号：US644822

申请日：1984-08-27

Applicant: Haim Feigenbaum ,  Sheldon Pudick ,  Chiu L. Wang

Inventor： Haim Feigenbaum ,  Sheldon Pudick ,  Chiu L. Wang

IPC: H01M8/02 ,  H01M8/24

CPC classification number: H01M8/2415 ,  H01M8/0297 ,  Y10T29/49108 ,  Y10T29/4911

Abstract: An improved interface configuration for use between adjacent elements of a fuel cell stack. The interface is impervious to gas and liquid and provides resistance to corrosion by the electrolyte of the fuel cell. The multi-layer configuration for the interface comprises a non-cupreous metal-coated metallic element to which is film-bonded a conductive layer by hot pressing a resin therebetween. The multi-layer arrangement provides bridging electrical contact.

Abstract translation: 用于在燃料电池堆的相邻元件之间使用的改进的接口配置。 界面对气体和液体是不透水的，并且提供抵抗燃料电池的电解质的腐蚀。 用于界面的多层结构包括非铜金属涂覆的金属元件，通过热压其间的树脂将导电层膜结合到其上。 多层布置提供桥接电接触。

公开(公告)号：US5378982A

公开(公告)日：1995-01-03

申请号：US23019

申请日：1993-02-25

Applicant: Haim Feigenbaum ,  John S. Szalay ,  Blake F. Woith

Inventor： Haim Feigenbaum ,  John S. Szalay ,  Blake F. Woith

IPC: G01M11/00 ,  G01R1/073 ,  G02F1/13 ,  G09G3/00 ,  G01R1/04

CPC classification number: G09G3/006 ,  G01R1/0735

Abstract: A test probe for use in testing a liquid crystal display device includes a rigid carrier block (20) having a lower surface to which is secured a flexible circuit (44) having a free end (50) aligned with the free end (26) of the carrier block. A plurality of projecting probe contact features (54) are integrally formed on traces (56) of the flexible circuit (44) and project from the plane of the flexible circuit adjacent the free end. An elastomeric back-up pad (40) is interposed between the carrier block (20) and the projecting contact features (54). The lower side of the carrier block is recessed (30) and the flexible circuit is pre-formed to the configuration of the recess in which it is mechanically secured by a rigid clamp or pressure bar (60). Conductive traces (56) of the flexible circuit have inner ends (58) bearing electrical contacts (68) for connection to test circuitry. The rigid carrier block (20) is mounted to enable the projecting probe contact features to be pressed against a line of contacts (16) on a display device panel (12) while maintaining a clearance between the aligned free ends of the carrier block (26), elastomer (42) and flexible circuit (50) and the edge (70) of a member (18) that overlies the display panel (12) and extends closely adjacent to and parallel to the row of display panel contacts (16).

Abstract translation: 用于测试液晶显示装置的测试探针包括具有下表面的刚性载体块（20），固定有柔性电路（44），柔性电路（44）具有与自由端（26）对准的自由端（50） 载体块。 多个突出的探针接触特征（54）一体地形成在柔性电路（44）的迹线（56）上并且从邻近自由端的柔性电路的平面突出。 弹性体支撑垫（40）插入在承载块（20）和突出接触特征（54）之间。 承载块的下侧凹入（30），并且柔性电路预先形成为通过刚性夹具或压力杆（60）机械固定的凹部的构型。 柔性电路的导电迹线（56）具有用于连接到测试电路的具有电触头（68）的内端（58）。 安装刚性承载块（20）以使得突出的探针接触特征能够压靠在显示装置面板（12）上的一线触点（16）上，同时保持载体块（26）的对准的自由端之间的间隙 ），弹性体（42）和柔性电路（50）以及覆盖在显示面板（12）上并且与行显示面板触点（16）紧密相邻并平行延伸的构件（18）的边缘（70）。

公开(公告)号：US5307561A

公开(公告)日：1994-05-03

申请号：US991735

申请日：1992-11-27

Applicant: Haim Feigenbaum ,  William R. Crumly ,  Christopher M. Schreiber

Inventor： Haim Feigenbaum ,  William R. Crumly ,  Christopher M. Schreiber

IPC: G01R1/073 ,  G01R31/02 ,  H01H1/14 ,  H01L21/66 ,  H01R12/00 ,  H05K1/11 ,  H05K3/20 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H05K3/02

CPC classification number: G01R1/073 ,  H05K3/205 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10666 ,  H05K2203/0113 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K2203/167 ,  H05K3/365 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: Shaped contacts (40, 42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16, 18, 26, 28) makes indentations (24a, 24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a,24b), are electroplated with a pattern of conductive material (34, 36, 38), and a dielectric substrate (32) is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical (18) or pyramidal (28) shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed. This enables the contacts to penetrate foreign materials, such as oxides, that may form on the surface of the pads (56, 58), to which the contacts are to be connected to ensure a good contact without any need for wiping action. The projecting contacts can also be pressed into plated holes (82, 84) in a substrate, such as a printed wiring board, to which mateable/demateable electrical connection is to be made.

Abstract translation: 用于互连电路或用于集成电路测试探针的成形触点（40,42）作为电路迹线（34）作为不锈钢芯棒（10）的整体部件进行电镀。 成形的硬化钢压痕工具（16,18,26,28）在心轴（10）的表面中形成具有预定形状的凹部（24a，24b），其设置有电介质图案，例如特氟隆（12） ）或光致抗蚀剂。 包括凹陷（24a，24b）的钢心轴的区域用导电材料（34,36,38）的图案电镀，并且电介质基底（32）层压到导电材料上。 由凹口形成的电路特征限定了锥形（18）或金字塔形（28）形状的凸起接触，其具有小的面积的自由端，允许更高的压力施加到触点抵靠的表面。 这使得触点能够渗透可能形成在焊盘（56,58）的表面上的诸如氧化物的异物，触点将被连接到该表面，以确保良好的接触而不需要擦拭动作。 突出的触点也可以被压入诸如印刷电路板的基板中的电镀孔（82,84）中，以便进行可配对/可分离的电连接。

公开(公告)号：US5306546A

公开(公告)日：1994-04-26

申请号：US994802

申请日：1992-12-22

Applicant: Christopher M. Schreiber ,  Haim Feigenbaum ,  Harold C. Bowers

Inventor： Christopher M. Schreiber ,  Haim Feigenbaum ,  Harold C. Bowers

IPC: H01L21/48 ,  H01L23/538 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  B32B9/00

CPC classification number: H05K3/4617 ,  H01L21/4857 ,  H01L23/5383 ,  H05K3/4038 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/0394 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/063 ,  H05K3/20 ,  H05K3/205 ,  H05K3/4647 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A multi-level substrate (24) for mounting and interconnecting a number of integrated circuit chips (10) is formed of a stack of laminated sheets each comprising a conductive circuit layer (30,34,38,42,46) is laminated to a dielectric film (32,36,40,44,48). The sheets are formed by fully additive or semi-additive processes on a reusable mandrel and are interconnected to one another by raised features (78) on the circuit layer of one sheet that project through a hole (86) in the dielectric film of an adjacent sheet to contact a receiving area (88) of the circuit layer of the adjacent sheet. Integrated circuit chips (10) and other electrical components are mounted to the uppermost sheet and electrically connected thereto by means of wiring bonding (16) or a f lip-chip arrangement (150) in which chip pads (148) rest upon and contact raised features (146) of the circuit layer (140) of the uppermost sheet.

Abstract translation: 用于安装和互连多个集成电路芯片（10）的多层基板（24）由层压片材堆叠形成，每个层压片材包括导电电路层（30,34,38,42,46）层压到 电介质膜（32,36,40,44,48）。 片材通过在可重复使用的心轴上的完全添加或半添加工艺形成，并且通过在相邻的电介质膜中的孔（86）突出的一片的电路层上的凸起特征（78）彼此互连。 片材接触相邻片材的电路层的接收区域（88）。 集成电路芯片（10）和其他电气部件安装到最上面的片材并且通过布线接合（16）或者其中芯片焊盘（148）搁置在其上并且接触凸起特征 （140）的最上层片材（146）。

公开(公告)号：US07504839B2

公开(公告)日：2009-03-17

申请号：US10956318

申请日：2004-10-01

Applicant: Haim Feigenbaum ,  Bao Q. Le ,  Long T. Hoang ,  Robert K. Betz

Inventor： Haim Feigenbaum ,  Bao Q. Le ,  Long T. Hoang ,  Robert K. Betz

IPC: G01R31/26

CPC classification number: H05K3/4092 ,  G01R1/06711 ,  G01R1/07342 ,  G01R3/00 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/205 ,  H05K2201/0391

Abstract: A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second material is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.

Abstract translation: 柔性电路包括多个电迹线和直接形成于其上的多个探针尖。 电迹线由第一导电材料制成，并且探针尖端由比第一导电材料硬的第二导电材料制成。 第一种材料是铜或铜合金，第二种材料是镍或镍合金，其中第二种材料可镀金。 探针尖端的部分被暴露以便于与另一个电路的接触垫的电接触。 柔性电路还可以包括接地层，以便在较高频率下与另一电路进行电校正。

公开(公告)号：US06614659B2

公开(公告)日：2003-09-02

申请号：US10013897

申请日：2001-12-07

Applicant: Haim Feigenbaum ,  Blake F. Woith ,  John Szalay ,  Terry Wang

Inventor： Haim Feigenbaum ,  Blake F. Woith ,  John Szalay ,  Terry Wang

IPC: H05K720

CPC classification number: H05K7/1023 ,  H05K1/141 ,  H05K3/325 ,  H05K3/365

Abstract: Apparatus for holding and securing an electrical module, IC, or other electronic components to a PCB that is easy to use and manipulate. The apparatus utilizes a transitional element to hold the electrical module or IC and then secure itself to the PCB using fasteners or the like. Preferred methods for assembling and using the apparatus are disclosed.

Abstract translation: 用于将电气模块，IC或其他电子部件保持并固定到易于使用和操纵的PCB的装置。 该装置利用过渡元件来保持电气模块或IC，然后使用紧固件等将其自身固定在PCB上。 公开了组装和使用该装置的优选方法。

公开(公告)号：US6007669A

公开(公告)日：1999-12-28

申请号：US003651

申请日：1998-01-07

Applicant: William R. Crumly ,  Haim Feigenbaum ,  Eric Dean Jensen ,  Pete Henry Hudson ,  John De Nuto

Inventor： William R. Crumly ,  Haim Feigenbaum ,  Eric Dean Jensen ,  Pete Henry Hudson ,  John De Nuto

IPC: H01L23/498 ,  H01L23/538 ,  H05K3/20 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K3/4617 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K2201/0195 ,  H05K2203/1189 ,  H05K3/205 ,  H05K3/4647 ,  Y10T29/49126 ,  Y10T29/49139

Abstract: The present invention includes stack flexible circuit layers having raised features or bumps for Z-axis interconnection to another circuit layer or electrical component. An intermediate or adhesive layer separates each circuit layer. The multiple layers are stacked with the raised features from one layer aligning with pads of an overlying or underlying layer and are laminated so that the raised features pierce the intermediate or adhesive layer and make electrical contact with the corresponding pad of the adjacent circuit layer. The raised features may have a shape sufficient to penetrate the intermediate and/or the adhesive layer allowing blind vias to be made without pre-drilling the intermediate or adhesive layers. The intermediate layer of film can have a function other than or in addition to that of an adhesive. For example, in a connector application where the raised feature is used to make contact to corresponding pads, a film that has a low permeability to water could be placed between the raised features and corresponding pads on the next layer. The low water permeability film would act as a sealant to prevent environmental attack on the connection. The raised feature would penetrate the sealant to make electrical contact to a corresponding pad. This would allow the connector to be disassembled and reconnected.

Abstract translation: 本发明包括具有凸起特征或凸块的堆叠柔性电路层，用于与另一个电路层或电气部件的Z轴互连。 中间层或粘合剂层分隔每个电路层。 多个层层叠有来自与覆盖层或下层的衬垫对准的一层的凸起特征，并且层叠，使得凸起特征刺穿中间层或粘合剂层，并与相邻电路层的相应焊盘电接触。 升高的特征可以具有足以穿透中间体和/或粘合剂层的形状，允许在不预先钻孔中间层或粘合剂层的情况下制造盲孔。 膜的中间层可以具有除了粘合剂以外的功能或附加的功能。 例如，在使用凸起特征与相应的焊盘接触的连接器应用中，具有低渗透性的膜可以放置在凸起的特征​​和下一层的相应焊盘之间。 低透水性膜将用作密封剂，以防止连接处的环境破坏。 凸起的特征​​将穿透密封剂以使电接触到相应的垫。 这将允许连接器被拆卸并重新连接。

公开(公告)号：US5946555A

公开(公告)日：1999-08-31

申请号：US743608

申请日：1996-11-04

Applicant: William R. Crumly ,  Haim Feigenbaum

Inventor： William R. Crumly ,  Haim Feigenbaum

IPC: H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/10 ,  H01L23/3164 ,  H01L23/4985 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14

Abstract: The invention includes the use of a decal to produce a packaged chip either at the chip level or wafer level. The decal includes a substrate containing circuitry that routes the chip output pads to bumps prepared for package attachment to another substrate such as a printed circuit board. The decal can be applied either to the wafer or to a single chip. The decal protects the chip and if necessary changes the interconnection density so that the chip can be interfaced with a printed circuit board or other electronic device. This configuration also may allow the packaged integrated circuit to be tested utilizing the bumps on the decal as temporary electrical contact features.

Abstract translation: 本发明包括使用贴花来在芯片级或晶片级产生封装芯片。 贴花包括一个包含基板的电路，其将芯片输出焊盘路由到准备用于封装附接到诸如印刷电路板的另一基板的凸块。 贴花可以应用于晶片或单芯片。 贴花保护芯片，并且如果需要，改变互连密度，使得芯片可以与印刷电路板或其他电子设备接口。 该配置还可以允许使用贴花上的凸块来测试封装的集成电路作为临时电接触特征。