摘要:
A method for forming printed re-routing for wafer level packaging, especially chip size packaging. The method includes forming a contact layer on a semiconductor die, printing a conductive redistribution structure on the contact layer, and etching the contact layer of the die by using the conductive redistribution structure as a self-aligning mask.
摘要:
An electronic component has a plurality of chips which are stacked one above the other and contact-connected to one another. To form this component, a first planar chip arrangement is provided with the functional chips spaced apart from one another in a grid and with a filling material in the spaces between the chips to form an insulating holding frame that fixes the chips, the frame has chip-dedicated contact-connecting elements that serve for the electrical contact-connection to another chip of another chip arrangement and each chip has dedicated electrically conductive strips. At least one additional planar chip arrangement is formed by the same method as the first planar chip arrangement and is then stacked on the first planar chip arrangement so that the two chip arrangements lie one above the other and the respective contact-connecting elements of the two chip arrangements are connected to one another for electrical chip-to-chip contact-connection. Subsequently, each of the components, which comprise a stack of chips, is separated from the assembled stack of chip arrangements.
摘要:
A method for fabricating an integrated circuit connection region includes application of a dielectric to an integrated circuit with a connection region, application of a corrodible metalization layer to the dielectric, application of a protection device to the metalization layer, and removal of the protection device in a region around the connection region.
摘要:
An electronic structure includes an electronic component, which is configured to be in electric contact with a base and has a mounting side configured for mounting onto the base. The structure also includes a raised elastic support positioned on the component and multiple contacts positioned on the component, with at least one contact also being positioned on the support.
摘要:
A method for fabricating an integrated circuit connection region includes application of a dielectric to an integrated circuit with a connection region, application of a corrodible metalization layer to the dielectric, application of a protection device to the metalization layer, and removal of the protection device in a region around the connection region.
摘要:
The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).
摘要:
A method for fabricating an integrated circuit connection region includes application of a dielectric to an integrated circuit with a connection region, application of a corrodible metalization layer to the dielectric, application of a protection device to the metalization layer, and removal of the protection device in a region around the connection region.
摘要:
The present invention provides a method for producing a semiconductor device, with the steps of: applying an interconnect level (11, 12) to a semiconductor substrate (10); structuring the interconnect level (12); and applying a solder layer (13) on the structured interconnect level (11, 12) in such a way that the solder layer (13) assumes the structure of the interconnect level (11, 12). The present invention likewise provides such a semiconductor device.
摘要:
A process for producing a component module comprising a module carrier and a plurality of components with which contact is made on the latter, comprising the following steps: arranging separated components on a surface-adhesive film at a predefined contact-specific spacing from one another, embedding the components in a flexible material in order to form a flexible holding frame which holds the components, pulling off the film, producing contact-making elements on the exposed side of the components, performing a functional test of the components and, if necessary, repair and/or replacement of components, and fixing and making contact with the components held in the holding frame on the module carrier.
摘要:
A method for producing a semiconductor component with the following steps. A semiconductor chip is provided having electrical contacts in a contact making region. A housing including a rear plate and a side area is provided and surrounds the semiconductor chip. A first compliant buffer layer is applied on a rear plate. The semiconductor chip is applied to the first compliant buffer layer, and a second compliant buffer layer is applied to and around the semiconductor chip except in the contact making region. A contact passage plate is provided with an opening over the contact areas and the contact passage plate is fixed to the second compliant buffer layer.