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10 条记录 (耗时 0.03 秒)

    Process for making a compliant thermally conductive compound
    2.
    发明授权
    Process for making a compliant thermally conductive compound 失效
    制备柔性导热性化合物的方法

    公开(公告)号：US5213704A

    公开(公告)日：1993-05-25

    申请号：US760045

    申请日：1991-09-13

    申请人： Herbert R. Anderson, Jr. ,  Richard B. Booth ,  Lawrence D. David ,  Mark O. Neisser ,  Harbans S. Sachdev ,  Mark A. Takacs

    发明人： Herbert R. Anderson, Jr. ,  Richard B. Booth ,  Lawrence D. David ,  Mark O. Neisser ,  Harbans S. Sachdev ,  Mark A. Takacs

    IPC分类号： C09K5/08

    CPC分类号： C09K5/08

    摘要： A process for making a compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

    摘要翻译： 制造兼容导热的，优选介电的化合物的方法，其增强诸如双极型VLSI半导体芯片的大功率电气部件的功率耗散能力。 该化合物具有化学稳定的热传导和粘度特性; 在使用过程中不会进行相分离，可以以小的间隙施加，以使热传导最大化。 该化合物优选包括其中分散有热填料颗粒的液体载体和具有与热填料颗粒的煅烧表面反应的官能团的偶联剂，以及具有自缩合优先润湿热填料颗粒的官能团。 另外的添加剂如热解二氧化硅和聚异丁烯增强了在功能使用期间遇到的导热化合物的热 - 机械剪切力降解的相稳定性和抗性，例如波动的功率循环。

    Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes
    4.
    发明授权
    Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes 失效
    在制造多层金属工艺的剥离结构中使用可解聚聚合物

    公开(公告)号：US4519872A

    公开(公告)日：1985-05-28

    申请号：US619516

    申请日：1984-06-11

    申请人： Herbert R. Anderson, Jr. ,  Harbans S. Sachdev ,  Krishna G. Sachdev

    发明人： Herbert R. Anderson, Jr. ,  Harbans S. Sachdev ,  Krishna G. Sachdev

    IPC分类号： H01L21/3205 ,  G03F7/039 ,  H01L21/027 ,  H01L21/302 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/768 ,  H05K3/04 ,  B44C1/22 ,  B29C17/08 ,  C03C15/00 ,  C03C25/06

    CPC分类号： H01L21/7688 ,  G03F7/039 ,  H01L21/0272 ,  H05K3/048 ,  Y10S438/951

    摘要： An improved lift-off process for multilevel metal structure in the fabrication of integrated circuits by employing lift-off layer formed from polymers which undergo clean depolymerization under the influence of heat or radiation and allow rapid and residue-free release of an "expendable mask". An embedded interconnection metallurgy system is formed by application of the lift-off layer of this invention over a cured polymer film or on an oxygen RIE barrier layer previously deposited on organic or inorganic substrate, followed by another barrier over which is then coated a radiation sensitive resist layer. After definition of the desired resist pattern by imagewise exposure and development, the image is replicated into the barrier by sputter etching in a fluorine containing ambient and subsequently into the base layer down to the substrate by oxygen reactive ion etching which is followed by blanket metal evaporation and finally the lift-off by brief heat treatment at the depolymerization temperature of the lift-off layer, and brief solvent soak.

    摘要翻译： 通过采用由在热或辐射的影响下经历清洁解聚的聚合物形成的剥离层，并且允许快速和无残留地释放“消耗性掩模”，改进了用于多层金属结构在集成电路制造中的剥离过程， 。 通过将本发明的剥离层施加在固化的聚合物膜上或预先沉积在有机或无机基底上的氧RIE阻挡层上，随后再涂覆有辐射敏感的另一个屏障，形成嵌入式互连冶金系统 抗蚀剂层。 在通过图像曝光和显影定义所需的抗蚀剂图案之后，通过在含氟环境中的溅射蚀刻将图像复制到屏障中，随后通过橡皮布金属蒸发随后通过氧反应离子蚀刻沉积到基底中。 最后通过在剥离层的解聚温度下进行短暂热处理，并进行短暂的溶剂浸泡。

    Solder and braze fluxes and processes for using the same
    5.
    发明授权
    Solder and braze fluxes and processes for using the same 失效
    焊锡和钎焊助焊剂及其使用方法

    公开(公告)号：US4504007A

    公开(公告)日：1985-03-12

    申请号：US417966

    申请日：1982-09-14

    申请人： Herbert R. Anderson, Jr. ,  Constance J. Araps ,  Richard A. Bates

    发明人： Herbert R. Anderson, Jr. ,  Constance J. Araps ,  Richard A. Bates

    IPC分类号： B23K35/22 ,  B23K35/36 ,  B23K35/363

    CPC分类号： B23K35/3613 ,  B23K35/3612

    摘要： In a soldering process for joining a plurality of metal components wherein a flux is employed to promote the process, the improvement comprises using as a flux in the process a flux consisting essentially of dihydroabietyl alcohol or dihydroabietyl alcohol and a member selected from the group consisting of a thermally depolymerizable polymer or a mixture of thermally depolymerizable polymers having the structure: ##STR1## where X and Y are n-alkyl and iso-alkyl not exceeding 6 carbon atoms; halogen; --COOR where R is n-alkyl and iso-alkyl not exceeding 6 carbon atoms; phenyl, naphthyl, tolyl and methyl-naphthyl groups; n is 5 to 500, and mixtures thereof.

    摘要翻译： 在用于连接多种金属组分的焊接工艺中，其中使用助熔剂来促进该方法，改进包括在该方法中使用基本上由二氢枞酚或二氢枞基醇组成的助熔剂和选自以下的成员： 可热解聚合物或具有以下结构的热解聚聚合物的混合物：其中X和Y是不超过6个碳原子的正烷基和异烷基; 卤素; -COOR，其中R是不超过6个碳原子的正烷基和异烷基; 苯基，萘基，甲苯基和甲基 - 萘基; n为5〜500，及其混合物。

    Dry process for forming metal patterns wherein metal is deposited on a depolymerizable polymer and selectively removed
    8.
    发明授权
    Dry process for forming metal patterns wherein metal is deposited on a depolymerizable polymer and selectively removed 失效
    用于形成金属图案的干法，其中金属沉积在可解聚聚合物上并选择性地除去

    公开(公告)号：US4456675A

    公开(公告)日：1984-06-26

    申请号：US517307

    申请日：1983-07-26

    申请人： Herbert R. Anderson, Jr. ,  Constance J. Araps ,  Catherine A. Lotsko

    发明人： Herbert R. Anderson, Jr. ,  Constance J. Araps ,  Catherine A. Lotsko

    IPC分类号： H01L21/28 ,  C23C14/04 ,  G03F7/039 ,  G03F7/36 ,  H01L21/302 ,  H01L21/3065 ,  B05D3/02

    CPC分类号： G03F7/039 ,  C23C14/042 ,  G03F7/36

    摘要： A process for forming a desired metal pattern on a substrate which comprises, forming a mask of a thermally depolymerizable polymer on the substrate with a pattern of openings complementary to the desired metal pattern, blanket coating the substrate and the mask with a metal, heating the substrate to depolymerize the depolymerizable polymer, cooling the surface of the metal to thereby delaminate the metal coated in areas where thermally depolymerizable polymer is present, removing the delaminated metal where necessary, and optionally plasma ashing the depolymerized polymer, if residue thereof remains, to remove the same from said substrate.

    摘要翻译： 一种在衬底上形成所需金属图案的方法，其包括：在所述衬底上形成具有与所需金属图案互补的开口图案的模板，用金属覆盖所述衬底和所述掩模，加热所述衬底上的热可聚合聚合物的掩模 底物以解聚可聚合的聚合物，冷却金属的表面，从而使涂覆在存在热可聚合聚合物的区域中涂覆的金属层析，必要时去除分层的金属，以及任选的等离子体灰化解聚的聚合物（如果残余物残留）除去 与所述基板相同。