公开(公告)号：US20110291271A1

公开(公告)日：2011-12-01

申请号：US13206987

申请日：2011-08-10

申请人： Hiroyuki SAKAI ,  Takeshi FUKUDA ,  Shinji UJITA ,  Yasufumi KAWAI

发明人： Hiroyuki SAKAI ,  Takeshi FUKUDA ,  Shinji UJITA ,  Yasufumi KAWAI

IPC分类号： H01L23/48 ,  H01L21/283

CPC分类号： H01L23/5222 ,  H01L23/3114 ,  H01L23/5221 ,  H01L23/5225 ,  H01L23/525 ,  H01L23/5329 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/061 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/141 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/085 ,  H01P11/003 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor chip such as an MMIC is provided. The semiconductor chip has: a Si semiconductor as a substrate; and a low-loss transmission line, and can be easily connected to a circuit board on which the semiconductor chip is to be mounted and can ensure a stable GND potential. The semiconductor chip is a flip-chip semiconductor chip, and includes: a Si substrate; an integrated circuit manufactured on a main surface of the substrate; a dielectric film formed above the integrated circuit; and a conductor film for grounding formed on an upper surface of the dielectric film. The integrated circuit includes a wiring layer including a signal line which transmits signals for the integrated circuit. The signal line, the dielectric film, and the conductor film constitute a microstrip line.

摘要翻译： 提供诸如MMIC的半导体芯片。 半导体芯片具有：作为基板的Si半导体; 和低损耗传输线，并且可以容易地连接到其上将要安装半导体芯片的电路板，并且可以确保稳定的GND电位。 半导体芯片是倒装芯片半导体芯片，包括：Si衬底; 在所述基板的主表面上制造的集成电路; 形成在集成电路上方的电介质膜; 以及形成在电介质膜的上表面上的用于接地的导体膜。 该集成电路包括布线层，该布线层包括传输用于集成电路的信号的信号线。 信号线，电介质膜和导体膜构成微带线。

公开(公告)号：US20090091491A1

公开(公告)日：2009-04-09

申请号：US12237697

申请日：2008-09-25

申请人： Shinji UJITA ,  Takeshi FUKUDA

发明人： Shinji UJITA ,  Takeshi FUKUDA

IPC分类号： G01S13/00 ,  H04B1/00

CPC分类号： H03D7/165 ,  H04B2201/70715

摘要： Provided is a receiving device that is used for a spread spectrum radar apparatus, receives a spectrum-spread signal, and obtains a precise radar spectrum, and includes: a despreading unit that (i) generates first and second despread signals that are generated by despreading a reception signal using a pseudo-noise code, the second despread signal passing through a transmission line carrying a current having a current value identical to a current value of a current carried by a transmission line through which the first despread signal passes, and (ii) includes a first transistor pair including first and second transistors having an identical characteristic, the first transistor outputting the first despread signal, and the second transistor outputting the second despread signal; and a quadrature demodulating unit that generates an in-phase signal and a quadrature signal by quadrature-demodulating the first despread signal and the second despread signal, respectively.

摘要翻译： 提供了一种用于扩频雷达装置的接收装置，接收频谱扩展信号并获得精确的雷达频谱，包括：解扩单元，其（i）产生通过解扩生成的第一和第二解扩信号 使用伪噪声码的接收信号，所述第二解扩信号通过承载具有与由所述第一解扩信号通过的传输线承载的电流的当前值相同的电流值的电流的传输线，以及（ii ）包括第一晶体管对，其包括具有相同特性的第一和第二晶体管，第一晶体管输出第一解扩信号，第二晶体管输出第二解扩信号; 以及正交解调单元，其分别通过对第一解扩展信号和第二解扩信号进行正交解调来生成同相信号和正交信号。

公开(公告)号：US20090003412A1

公开(公告)日：2009-01-01

申请号：US12038198

申请日：2008-02-27

申请人： Noboru NEGORO ,  Takeshi FUKUDA ,  Hiroyuki SAKAI

发明人： Noboru NEGORO ,  Takeshi FUKUDA ,  Hiroyuki SAKAI

IPC分类号： H04B1/69

CPC分类号： G01S13/325 ,  G01S7/023 ,  H04B2201/70715

摘要： To provide a spread spectrum radar apparatus which can lower the probability for misidentifying a presence of object. The spread spectrum radar apparatus includes: a pseudo-noise code for transmission generation unit which generates a pseudo-noise code for transmission; a spread spectrum modulation unit which performs spread spectrum modulation on a carrier wave using the pseudo-noise code for transmission; a pseudo-noise code for receiver generation unit which generates a pseudo-noise code for receiver which is a time-delayed pseudo-noise code for transmission; a spread spectrum demodulation unit which performs spread spectrum demodulation on a received signal, using the pseudo-noise code for receiver, so as to output a correlation signal; a code change control unit which changes the pseudo-noise codes for transmission and receiver into a different kind of the pseudo-noise codes at every predetermined time; and a correlation value calculation unit which averages or integrates, with the number of kinds of the generated pseudo-noise codes, an intensity of the correlation signal.

摘要翻译： 提供一种可以降低错误识别物体存在的可能性的扩频雷达装置。 扩频雷达装置包括：发送生成单元的伪噪声码，生成用于发送的伪噪声码; 扩频调制单元，其使用用于发送的伪噪声码对载波进行扩频调制; 用于生成用于接收机的伪噪声码的接收机生成单元的伪噪声码，所述伪噪声码是用于发射的时间延迟的伪噪声码; 扩展频谱解调单元，使用接收机的伪噪声码对接收信号进行扩频解调，以输出相关信号; 代码变更控制单元，其将每个预定时间的伪噪声码改变为不同种类的伪噪声码; 以及相关值计算单元，其与生成的伪噪声代码的种类的数量对相关信号的强度进行平均或积分。

公开(公告)号：US20110291111A1

公开(公告)日：2011-12-01

申请号：US13206908

申请日：2011-08-10

申请人： Shuichi NAGAI ,  Takeshi FUKUDA ,  Hiroyuki SAKAI

发明人： Shuichi NAGAI ,  Takeshi FUKUDA ,  Hiroyuki SAKAI

IPC分类号： H01L29/161 ,  H01L23/495 ,  H01L21/78

CPC分类号： H01L23/3114 ,  H01L23/10 ,  H01L23/481 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H01L2924/1616 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A chip size package includes: a radio frequency substrate having a radio frequency semiconductor circuit formed on a principal surface; a semiconductor cover substrate arranged at a position facing the principal surface of the radio frequency substrate; and a joining frame arranged in a manner such as to surround the radio frequency semiconductor circuit between the radio frequency substrate and the semiconductor cover substrate, the joining frame joining the radio frequency substrate and the semiconductor cover substrate, wherein: the radio frequency substrate further has a wire formed on a surface opposite to the principal surface; and the radio frequency semiconductor circuit and the wire are electrically connected to each other through a via hole penetrating through the radio frequency substrate in a thickness direction thereof.

摘要翻译： 芯片尺寸封装包括：具有形成在主表面上的射频半导体电路的射频基板; 布置在面向所述射频基板的主表面的位置处的半导体盖基板; 以及以包围射频基板和半导体盖基板之间的射频半导体电路的方式布置的接合框架，连接射频基板和半导体盖基板的接合框架，其中：射频基板还具有 形成在与所述主表面相对的表面上的线; 并且射频半导体电路和导线通过穿过射频基板的厚度方向上的通孔彼此电连接。

公开(公告)号：US20120220722A1

公开(公告)日：2012-08-30

申请号：US13405588

申请日：2012-02-27

申请人： Toshio SHIOBARA ,  Tsutomu KASHIWAGI ,  Takeshi FUKUDA

发明人： Toshio SHIOBARA ,  Tsutomu KASHIWAGI ,  Takeshi FUKUDA

IPC分类号： C08L83/14

CPC分类号： C08G77/50 ,  C08L83/10 ,  C08L83/14

摘要： Disclosed is an addition reaction-curable organopolysilmethylenesiloxane copolymer composition including: (A) an organopolysilmethylenesiloxane copolymer represented by formula (a) shown below: which has in one molecule at least two alkenyl groups bonding to silicon atoms; (B) an organopolysiloxane represented by formula (b) shown below: R2aSiO(4-a)/2   (b) which has in one molecule at least two alkenyl groups bonding to silicon atoms; (C) an organohydrogenpolysilmethylenesiloxane and/or organohydrogenpolysiloxane; and (D) a platinum group metal-based catalyst.The copolymer composition excels in heat resistance, electrical insulation, mechanical strength, and optical properties, and exhibits good water resistance, hydrolysis resistance and gas barrier properties under severe use conditions without suffering gas permeability and poor chemical resistance inherent in silicone rubber.

摘要翻译： 公开了一种加成反应可固化的有机聚硅氧烷硅氧烷共聚物组合物，其包含：（A）由下式（a）表示的有机聚硅氧烷硅氧烷共聚物：其在一个分子中具有至少两个与硅原子键合的烯基; （B）由下式（b）表示的有机聚硅氧烷：在一分子中具有至少两个与硅原子键合的烯基的R2aSiO（4-a）/ 2（b） （C）有机氢聚硅亚甲基硅氧烷和/或有机氢聚硅氧烷; 和（D）铂族金属类催化剂。 该共聚物组合物的耐热性，电绝缘性，机械强度和光学性能优异，并且在严苛的使用条件下表现出良好的耐水性，耐水解性和气体阻隔性，而不会导致硅橡胶固有的气体渗透性和差的耐化学性。

公开(公告)号：US20130340351A1

公开(公告)日：2013-12-26

申请号：US13918341

申请日：2013-06-14

申请人： Takeshi FUKUDA ,  Tsuguo WATANABE ,  Junji HIROSE ,  Kenji NAKAMURA ,  Masato DOURA

发明人： Takeshi FUKUDA ,  Tsuguo WATANABE ,  Junji HIROSE ,  Kenji NAKAMURA ,  Masato DOURA

IPC分类号： B24D11/00

CPC分类号： B24D11/003 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D3/32 ,  B24D18/00 ,  B29C44/24 ,  B29C44/308 ,  B29C44/32 ,  B29C44/322 ,  B29C44/326 ,  B29C44/5654 ,  C08J9/30 ,  C08J2375/08 ,  Y10T156/1052 ,  Y10T156/1059

摘要： A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.

公开(公告)号：US20090073029A1

公开(公告)日：2009-03-19

申请号：US12258819

申请日：2008-10-27

申请人： Masaaki NISHIJIMA ,  Takeshi FUKUDA

发明人： Masaaki NISHIJIMA ,  Takeshi FUKUDA

IPC分类号： G01S13/32

CPC分类号： G01S13/325 ,  G01S7/03 ,  G01S7/35

摘要： A radar apparatus includes a PN code generator for generating a PN code, a variable delay device for delaying the PN code, an oscillator for generating a high-frequency signal, a transmission frequency multiplier for multiplying a frequency of a transmission differential signal obtained by being divided from the high-frequency signal by 3, a reception frequency multiplier for multiplying a frequency of a reception differential signal obtained by being divided from the high-frequency by 3, a transmitter for generating a radar wave by using the differential signal obtained through the multiplication by the transmission frequency multiplier and the PN code generated by the PN code generator, and a receiver for generating an in-phase signal and a quadrature signal from a reflected wave by using the differential signal obtained through the multiplication by the reception frequency multiplier and the PN code delayed by the delay device.

摘要翻译： 雷达装置包括用于产生PN码的PN码发生器，用于延迟PN码的可变延迟装置，用于产生高频信号的振荡器，用于将通过存在获得的发送差分信号的频率相乘的发送倍频器 将高频信号除以3，将从高频除以3获得的接收差分信号的频率乘以接收倍频器，用于通过使用通过所述高频信号获得的差分信号来生成雷达波的发送器 乘以传输倍频器和由PN码发生器产生的PN码;以及接收机，用于通过使用通过乘以接收倍频器获得的差分信号从反射波产生同相信号和正交信号;以及 PN码由延迟器延迟。

公开(公告)号：US20080204307A1

公开(公告)日：2008-08-28

申请号：US11939803

申请日：2007-11-14

申请人： Takeshi FUKUDA

发明人： Takeshi FUKUDA

IPC分类号： G01S13/00

CPC分类号： G01S13/325 ,  G01S7/032 ,  G01S7/35

摘要： Provided is a semiconductor device for a spread spectrum radar apparatus which suppresses spurious signals resulting from non-linearity of active elements. The semiconductor device as the inverse spread spectrum modulation unit for the spread spectrum radar apparatus has a coupled line of two lines and another coupled line of two lines. The semiconductor device includes: an unbalanced to balanced transforming circuit which converts a received signal inputted as an unbalanced signal into a balanced signal pair; a switch circuit having one or more transistors; and a balanced inverse spread spectrum circuit which obtains as differential signal PN signals belonging to the same sequence code as a PN code which is used to generate an original signal of the received signal, also obtains the balanced signal pair from the unbalanced to balanced transforming circuit, and performs inverse spread spectrum modulation on the balanced signal pair by the switch circuit using the PN codes inputted as the differential signal.

摘要翻译： 提供一种用于扩展频谱雷达装置的半导体装置，其抑制由有源元件的非线性引起的寄生信号。 作为扩频雷达装置的反扩频调制单元的半导体装置具有两条线的耦合线和两条线的另一条耦合线。 半导体器件包括：不平衡平衡变换电路，其将输入的不平衡信号的接收信号转换为平衡信号对; 具有一个或多个晶体管的开关电路; 并且获得作为与用于生成接收信号的原始信号的PN码相同的序列码的差分信号PN信号的平衡反扩频电路，还从不平衡到平衡变换电路获得平衡信号对 并且通过使用输入作为差分信号的PN码由开关电路在平衡信号对上进行反扩频调制。

公开(公告)号：US20120108065A1

公开(公告)日：2012-05-03

申请号：US13294835

申请日：2011-11-11

申请人： Takeshi FUKUDA ,  Tsuguo Watanabe ,  Junji Hirose ,  Kenji Nakamura ,  Masato Doura

发明人： Takeshi FUKUDA ,  Tsuguo Watanabe ,  Junji Hirose ,  Kenji Nakamura ,  Masato Doura

IPC分类号： H01L21/302 ,  B24D18/00 ,  B24D11/00

CPC分类号： B24D11/003 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D3/32 ,  B24D18/00 ,  B29C44/24 ,  B29C44/308 ,  B29C44/32 ,  B29C44/322 ,  B29C44/326 ,  B29C44/5654 ,  C08J9/30 ,  C08J2375/08 ,  Y10T156/1052 ,  Y10T156/1059

摘要： A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.

公开(公告)号：US20110151240A1

公开(公告)日：2011-06-23

申请号：US13038849

申请日：2011-03-02

申请人： Junji HIROSE ,  Takeshi FUKUDA

发明人： Junji HIROSE ,  Takeshi FUKUDA

IPC分类号： B32B3/26

CPC分类号： B29C44/06 ,  B32B5/022 ,  B32B5/20 ,  B32B5/245 ,  B32B7/12 ,  B32B27/065 ,  B32B27/12 ,  B32B27/36 ,  B32B2262/0246 ,  B32B2266/0278 ,  B32B2266/06 ,  B32B2307/724 ,  B32B2457/00 ,  B32B2457/14 ,  B32B2551/00 ,  B32B2551/08 ,  C08G18/12 ,  C08G18/4072 ,  C08G18/4277 ,  C08G18/4854 ,  C08G18/6564 ,  C08G18/6607 ,  C08G2101/00 ,  C08G2101/0008 ,  C08J9/30 ,  C08J2375/04 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2924/01012 ,  Y10T428/249975 ,  Y10T428/249978 ,  Y10T428/249979 ,  Y10T428/249991 ,  C08G18/3206

摘要： Provided herein is a process for producing a layered sheet. The process involves preparing a cell dispersed urethane composition by a mechanical foaming method. The cell dispersed urethane composition is applied to a base material sheet and cured to produce a polyurethane foam layer of uniform thickness. A releasing sheet may be utilized to make the thickness of the polyurethane foamed layer uniform. Also, provided herein is a layered sheet produced by the above process. The polyurethane foamed layer may have spherical fine cells having an average cell diameter of 20 to 300 μm. The polyurethane foamed layer may have a specific gravity of 0.2 to 0.5. The polyurethane foamed layer may also have a Asker C hardness of 10 to 50 degrees.

摘要翻译： 本文提供了一种生产层状片的方法。 该方法包括通过机械发泡方法制备细胞分散的聚氨酯组合物。 将细胞分散的氨基甲酸酯组合物施加到基材片上并固化以制备均匀厚度的聚氨酯泡沫层。 可以使用脱模片来使聚氨酯泡沫层的厚度均匀。 此外，本发明提供了通过上述方法制造的层状片材。 聚氨酯泡沫层可以具有平均泡孔直径为20〜300μm的球状细胞。 聚氨酯泡沫层的比重可以为0.2〜0.5。 聚氨酯泡沫层也可以具有10至50度的Asker C硬度。