公开(公告)号：US5756380A

公开(公告)日：1998-05-26

申请号：US556782

申请日：1995-11-02

申请人： Howard M. Berg ,  Sankaranarayanan Ganesan ,  Gary L. Lewis ,  George W. Hawkins ,  James W. Sloan ,  Scott C. Bolton

发明人： Howard M. Berg ,  Sankaranarayanan Ganesan ,  Gary L. Lewis ,  George W. Hawkins ,  James W. Sloan ,  Scott C. Bolton

IPC分类号： H01L23/31 ,  H01L21/60

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85444 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/15173 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181

摘要： A method for making moisture resistant semiconductor devices having organic substrates targets each of the potentially critical interfaces within a semiconductor device having the potential for delamination and cracking. An organic substrate (110) is designed to include a solid pad (116) having a chemically created oxide layer (118) formed thereon. A silicone-based die attach material (108) is dispensed and gelled very soon after dispensing to prevent excessive bleed. A semiconductor die (102) is mounted to the substrate after undergoing a cleaning operation to remove contaminants from the backside of the die. Prior to molding compound encapsulation and subsequent to die attach material cure, the substrate is cleaned to improve adhesion to the die attach material fillet (122). In practicing these operations, the following interfaces are targeted and their adhesion characteristics are improved: die attach material to die pad; die attach material to die; molding compound to die pad; and molding compound to die attach material.

摘要翻译： 一种制造具有有机衬底的耐湿半导体器件的方法，其目标是具有分层和破裂潜力的半导体器件内的每个潜在关键界面。 有机基板（110）被设计成包括其上形成有化学产生的氧化物层（118）的固体焊盘（116）。 在分配之后，非常快速地分配并凝胶化有机硅基的管芯附着材料（108），以防止过量的流出。 在经历清洁操作之后将半导体管芯（102）安装到基板上以从模具的背面去除污染物。 在模塑复合物封装之后和随后的模具附着材料固化之后，清洁基底以提高对芯片连接材料圆角（122）的粘附。 在实施这些操作时，以下接口是针对性的，并且其粘附特性得到改善：芯片附着材料到芯片焊盘; 模具附着材料; 模塑复合材料到模具垫; 并将模塑复合物模塑附着材料。

公开(公告)号：US4468411A

公开(公告)日：1984-08-28

申请号：US365724

申请日：1982-04-05

申请人： James W. Sloan ,  Truoc T. Tran ,  Frank T. Jones, III

发明人： James W. Sloan ,  Truoc T. Tran ,  Frank T. Jones, III

IPC分类号： H01L21/312 ,  H01L23/556 ,  H01L23/00

CPC分类号： H01L23/556 ,  H01L21/312 ,  H01L2224/49171 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/14 ,  Y10S438/953

摘要： A controlled quantity of a liquid polyimide precursor compound is deposited on the active surface of an integrated circuit die which has been prepared for packaging, and thereafter cured using a two step curing process to develop a polyimide coating of sufficient thickness to provide alpha particle protection for the die once packaged.

摘要翻译： 将控制量的液体聚酰亚胺前体化合物沉积在已经制备用于包装的集成电路管芯的有效表面上，然后使用两步固化方法固化，以开发足够厚度的聚酰亚胺涂层，以提供α粒子保护 一次封装包装。

公开(公告)号：US5280193A

公开(公告)日：1994-01-18

申请号：US877930

申请日：1992-05-04

申请人： Paul T. Lin ,  James W. Sloan

发明人： Paul T. Lin ,  James W. Sloan

IPC分类号： H01L25/18 ,  H01L21/56 ,  H01L23/31 ,  H01L25/04 ,  H05K3/00 ,  H05K3/40 ,  H01L23/16 ,  H01L23/02 ,  H01L23/12 ,  H01L23/28

CPC分类号： H01L21/565 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/403

摘要： A semiconductor multiple package module (10) on a PCB material substrate (18) is provided, wherein semiconductor dice are directly mounted onto the PCB material substrate (18) thereby eliminating a subsequent board mounting at the customer level. A plurality of semiconductor dice are mounted and electrically connected to a plurality of circuit traces (22) on the PCB material substrate (18) having a plurality of edge connectors (20). The plurality of circuit traces (22) has conductive paths to electrically interconnect the semiconductor dice to the edge connectors (20) and to each other. The semiconductor dice are directly overmolded on the PCB material substrate (18) with a molding compound to form individual semiconductor devices (12, 14, and 16) having separate package bodies. The individualized package bodies enable repair to the module by making removal of only nonfunctional semiconductor devices from the PCB material substrate (18) possible.

摘要翻译： 提供了一种在PCB材料基板（18）上的半导体多封装模块（10），其中将半导体晶片直接安装在PCB材料基板（18）上，从而消除了在客户层面上随后的板安装。 多个半导体晶片安装并电连接到具有多个边缘连接器（20）的PCB材料基板（18）上的多个电路迹线（22）。 多个电路迹线（22）具有导电路径，以将半导体晶片与边缘连接器（20）电互连并彼此连接。 半导体晶片通过模制化合物在PCB材料基板（18）上直接包覆成型，以形成具有单独封装体的单个半导体器件（12,14和16）。 通过从PCB材料基板（18）中仅去除非功能半导体器件，个性化的封装体能够修复模块。

公开(公告)号：US5794804A

公开(公告)日：1998-08-18

申请号：US828869

申请日：1997-03-31

申请人： James W. Sloan ,  Charles Papciak ,  William A. Conard

发明人： James W. Sloan ,  Charles Papciak ,  William A. Conard

IPC分类号： A61J1/00 ,  A61J1/14 ,  B32B15/08 ,  B65D39/00

CPC分类号： B32B15/08 ,  A61J1/1425 ,  A61J1/18 ,  B65D51/002 ,  A61J1/1468 ,  Y10T428/1355

摘要： A method is provided for reducing particle formation during manufacture of shell caps for containers such as pharmaceutical containers. The method entails providing a solid polymeric coating on substantially all surfaces of the shell caps to form coated shell caps before permitting the coated shell caps to contact each other or other objects. A pharmaceutical container which employs the shell caps also is provided. The container comprises a vial for storing medicinal compositions therein and a shell cap for sealing the vial. The shell cap includes a hollow metallic preform and a solid polymeric coating which substantially completely encapsulates the preform.

摘要翻译： 提供了一种用于在用于诸如药物容器的容器的壳盖的制造期间减少颗粒形成的方法。 该方法需要在壳盖的基本上所有表面上提供固体聚合物涂层，以在允许涂覆的壳盖彼此接触或其它物体之前形成涂覆的外壳盖。 还提供了采用壳帽的药物容器。 容器包括用于储存药物组合物的小瓶和用于密封小瓶的壳盖。 壳盖包括中空金属预制件和基本上完全包封预成型件的固体聚合物涂层。

公开(公告)号：US5250841A

公开(公告)日：1993-10-05

申请号：US007036

申请日：1993-01-21

申请人： James W. Sloan ,  Timothy J. Mennitt ,  John P. Warren

发明人： James W. Sloan ,  Timothy J. Mennitt ,  John P. Warren

IPC分类号： H01L23/495 ,  H01L23/58 ,  H01L23/48 ,  H01L23/50

CPC分类号： H01L22/32 ,  H01L23/4951 ,  H01L23/49541 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/14

摘要： A semiconductor device (10) includes test-only leads (20) and operational leads (18). Operational leads (18) provide access to portions of a semiconductor die (12) needed for device operation. Test-only leads (20) provide access to portions of die (12) which are not needed for device operation, but which are needed during manufacturing tests. Operational leads (18) have an external configuration which facilitates attachment to a user substrate. Test-only leads (20) have an external configuration which enables electrical access to the device for test purposes; however, the test-only lead configuration makes attachment to the user substrate difficult. Since the test-only leads (20) and the operational leads (18) have two different external lead configurations, overall lead pitch is reduced, enabling device (10) to be made very small. Yet, complexity of mounting device (10) to a user substrate is not increased since the pitch between adjacent operational leads (18) can be made larger than the overall lead pitch.

摘要翻译： 半导体器件（10）包括仅测试引线（20）和操作引线（18）。 操作引线（18）提供对设备操作所需的半导体管芯（12）的部分的访问。 仅测试导线（20）提供对设备操作所不需要但在制造测试期间需要的模具（12）的部分的访问。 操作引线（18）具有便于连接到用户基板的外部构造。 仅测试引线（20）具有外部配置，使得能够电连接到设备用于测试目的; 然而，仅测试引线配置使得难以附着到用户基板。 由于仅测试引线（20）和操作引线（18）具有两种不同的外部引线配置，因此整体引线间距减小，从而使器件（10）非常小。 然而，由于可以使相邻的操作引线（18）之间的间距大于整个引线间距，因此安装装置（10）对用户基板的复杂度不会增加。

公开(公告)号：US5592025A

公开(公告)日：1997-01-07

申请号：US349272

申请日：1994-12-05

申请人： Minh-Hien N. Clark ,  James W. Sloan

发明人： Minh-Hien N. Clark ,  James W. Sloan

IPC分类号： H01L23/31 ,  H01L23/498 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48 ,  H01L23/04 ,  H01L23/52

CPC分类号： H01L24/06 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/32 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06165 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49179 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/854 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K3/4038 ,  Y02P70/613

摘要： Pad array carriers allow greater I/O densities over conventional leaded packages by using an array arrangement for external electrical connections. A pad array carrier (48) is manufactured using a substrate (40) having metal on only one side and unplated through-holes (44). A semiconductor die (50) is mounted on and affixed to the top surface of the substrate with an electrically insulative adhesive (51). The use of the insulative adhesive allows routing of signal traces into the die mounting region directly underneath the die. Wire bonds (52) connect the die to metal traces (46) on the substrate. A package body (54) is formed on the substrate covering the die and wire bonds (52). Solder balls (56 & 58) are directly attached to the backside of the solder pads (47) by way of the through-holes.

摘要翻译： 通过使用用于外部电连接的阵列布置，焊盘阵列载体允许比常规引线封装更大的I / O密度。 使用仅在一侧具有金属的基板（40）和未镀覆的通孔（44）来制造焊盘阵列载体（48）。 半导体管芯（50）用电绝缘粘合剂（51）安装在衬底的顶表面上并固定到衬底的顶表面上。 使用绝缘粘合剂允许将信号迹线路由到芯片正下方的管芯安装区域。 线接合（52）将管芯连接到衬底上的金属迹线（46）。 封装体（54）形成在覆盖芯片和引线键合（52）的基板上。 焊球（56和58）通过通孔直接连接到焊盘（47）的背面。

公开(公告)号：US5570632A

公开(公告)日：1996-11-05

申请号：US409470

申请日：1995-03-23

申请人： Christopher Cumens ,  Charles Papciak ,  Eric E. Shoup ,  James W. Sloan ,  Edward F. Vander Bush

发明人： Christopher Cumens ,  Charles Papciak ,  Eric E. Shoup ,  James W. Sloan ,  Edward F. Vander Bush

IPC分类号： G06K5/02 ,  G06K13/00 ,  B41F17/18

CPC分类号： G06K13/00 ,  G06K5/02

摘要： An apparatus for applying and verifying a printed mark on the periphery of generally cylindrically-shaped objects as they travel on a path. The apparatus comprises at least a first conveyor mounted for movement on a first side of the path. The first conveyor is located to engage the objects to translate the objects at a known translational velocity along the path. A transport assembly is mounted for cyclic movement back and forth along a transport assembly path parallel to the path of the objects at least part of the cyclic movement being approximately at the known translational velocity of the objects. A mark applicator is mounted on the transport assembly and is located in a position to apply a mark on each object as the object is translated by the first conveyor. A sensor is mounted on the transport assembly. The sensor is located in a position to read the applied mark on each object as the object is translated by the belt. The sensor generates a signal representative of the mark.

摘要翻译： 一种用于在大致圆柱形物体的周边在路径上行进时施加和验证印刷标记的装置。 该装置包括至少一个第一传送器，其安装成用于在路径的第一侧上移动。 第一输送机被定位成接合物体以沿着路径以已知的平移速度平移物体。 运输组件被安装用于沿着平行于物体的路径的运输组件路径来回循环运动，至少部分循环运动大致处于物体的已知平移速度。 标记施加器安装在运输组件上，并且当物体被第一输送机平移时，位于每个物体上施加标记的位置。 传感器安装在运输组件上。 传感器位于通过皮带翻译物体时读取每个物体上的应用标记的位置。 传感器产生代表标记的信号。

公开(公告)号：US09117325B1

公开(公告)日：2015-08-25

申请号：US13959108

申请日：2013-08-05

申请人： James W. Sloan

发明人： James W. Sloan

IPC分类号： G07F13/02 ,  F24B15/04 ,  G01F11/14

CPC分类号： G07F13/02 ,  F24B15/04 ,  G01F11/14 ,  G01F11/18 ,  G07F11/18 ,  G07F17/00

摘要： A charcoal dispensing apparatus dispenses charcoal into a bag. The apparatus includes a base and a post attached to and extending upwardly from the base. A drawer frame is coupled to a top end edge of the post. A hopper is attached to the drawer frame and is configured to store and dispense a plurality of charcoal briquettes. A slot is positioned in the drawer frame. A second drawer is slidably insertable into the slot and is configured to receive charcoal from the hopper when the second drawer is positioned within the slot. The second drawer is configured to dispense charcoal outwardly therefrom when the second drawer is extended outwardly of the drawer frame.

摘要翻译： 木炭分配装置将木炭分配到袋中。 该装置包括底座和附接到基座并从基座向上延伸的柱。 抽屉框架联接到柱的顶端边缘。 料斗安装在抽屉框架上，用于储存和分配多个木炭块。 插槽位于抽屉框架中。 第二抽屉可滑动地插入槽中，并且构造成当第二抽屉位于槽内时从料斗接收木炭。 第二抽屉构造成当第二抽屉从抽屉框架向外延伸时从其向外分配木炭。

公开(公告)号：US5622745A

公开(公告)日：1997-04-22

申请号：US374449

申请日：1995-01-18

申请人： James W. Sloan ,  Charles Papciak ,  William A. Conard

发明人： James W. Sloan ,  Charles Papciak ,  William A. Conard

IPC分类号： A61J1/00 ,  A61J1/14 ,  B32B15/08 ,  A01N1/02 ,  B09D5/00

CPC分类号： B32B15/08 ,  A61J1/1425 ,  A61J1/18 ,  B65D51/002 ,  A61J1/1468 ,  Y10T428/1355

摘要： A method is provided for reducing particle formation during manufacture of shell caps for containers such as pharmaceutical containers. The method entails providing a solid polymeric coating on substantially all surfaces of the shell caps to form coated shell caps before permitting the coated shell caps to contact each other or other objects. A pharmaceutical container which employs the shell caps also is provided. The container comprises a vial for storing medicinal compositions therein and a shell cap for sealing the vial. The shell cap includes a hollow metallic preform and a solid polymeric coating which substantially completely encapsulates the preform.

摘要翻译： 提供了一种用于在用于诸如药物容器的容器的壳盖的制造期间减少颗粒形成的方法。 该方法需要在壳盖的基本上所有表面上提供固体聚合物涂层，以在允许涂覆的壳盖彼此接触或其它物体之前形成涂覆的外壳盖。 还提供了采用壳帽的药物容器。 容器包括用于储存药物组合物的小瓶和用于密封小瓶的壳盖。 壳盖包括中空金属预制件和基本上完全包封预成型件的固体聚合物涂层。

公开(公告)号：US5334857A

公开(公告)日：1994-08-02

申请号：US864246

申请日：1992-04-06

申请人： Timothy J. Mennitt ,  John P. Warren ,  James W. Sloan

发明人： Timothy J. Mennitt ,  John P. Warren ,  James W. Sloan

IPC分类号： H01L21/66 ,  G01R31/28 ,  H01L23/055 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01L23/02

CPC分类号： H01L22/32 ,  G01R31/2884 ,  H01L23/055 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor device has test-only contacts to reduce the size of the device and eliminate unnecessary external contacts. In one form of the invention, a semiconductor device (30) is provided with solder balls (26) which are electrically coupled to those portions of a semiconductor die (20) that are necessary for device operation. The device also includes test pads (32) formed on a package substrate (12) which are electrically coupled to those portions of the die which are necessary only for a manufacturer's testing purposes. In another form, a semiconductor device (10) includes external test-only solder balls along the periphery of the package substrate, for example solder balls between boundaries A and B. After testing is complete, the package substrate is excised along boundary A, thereby eliminating solder balls which are not needed by the device user. A combination of the two techniques may also be used.

摘要翻译： 半导体器件具有仅测试触点，以减小器件的尺寸并消除不必要的外部触点。 在本发明的一种形式中，半导体器件（30）设置有焊料球（26），其电耦合到器件操作所需的半导体管芯（20）的那些部分。 该装置还包括形成在封装基板（12）上的测试焊盘（32），其被电耦合到仅为了制造商的测试目的而必需的模具的那些部分。 在另一种形式中，半导体器件（10）包括沿着封装衬底的外围的外部仅测试焊球，例如边界A和B之间的焊球。测试完成后，封装衬底沿边界A被切除，由此 消除设备用户不需要的焊球。 也可以使用这两种技术的组合。