公开(公告)号：US20160240395A1

公开(公告)日：2016-08-18

申请号：US15139265

申请日：2016-04-26

申请人： Intel Corporation

发明人： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/29

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L24/13 ,  H01L2224/16225 ,  H01L2224/29647 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括用硫醇粘合促进剂，唑偶合剂，表面改性填料和基于过氧化物的交联聚合物化学物质之一改性底部填充材料，以便利用本文的实施方案极大地增强包装结构中的粘合性。

公开(公告)号：US20170053858A1

公开(公告)日：2017-02-23

申请号：US14831528

申请日：2015-08-20

申请人： INTEL CORPORATION

发明人： Jan Krajniak ,  Carl L. Deppisch ,  Kabirkumar J. Mirpuri ,  Hongjin Jiang ,  Fay Hua ,  Yuying Wei ,  Beverly J. Canham ,  Jiongxin Lu ,  Mukul P. Renavikar

IPC分类号： H01L23/498 ,  B23K1/20 ,  B23K35/02 ,  H01L21/48 ,  B23K35/26 ,  B23K35/30 ,  H01L23/00 ,  B23K1/00 ,  B23K35/36

CPC分类号： H01L23/49833 ,  B23K1/0016 ,  B23K3/0623 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  H01L21/4867 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/1339 ,  H01L2224/13565 ,  H01L2224/136 ,  H01L2224/1369 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16227 ,  H01L2224/81594 ,  H01L2224/816 ,  H01L2224/81611 ,  H01L2224/8169 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/15331 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  H05K1/141 ,  H05K3/363 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01025 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01038 ,  H01L2924/01024 ,  H01L2924/01022 ,  H01L2924/05341 ,  H01L2924/0665 ,  H01L2924/00012

摘要： Embodiments herein may relate to a patch on interposer (PoINT) architecture. In embodiments, the PoINT architecture may include a plurality of solder joints between a patch and an interposer. The solder joints may include a relatively high temperature solder ball and a relatively low temperature solder paste that at least partially surrounds the solder ball. Other embodiments may be described and/or claimed.

摘要翻译： 这里的实施例可以涉及内插器（PoINT）架构上的补丁。 在实施例中，PoINT架构可以包括贴片和插入器之间的多个焊接点。 焊点可以包括相对高温的焊球和至少部分地围绕焊料球的相对低温的焊膏。 可以描述和/或要求保护其他实施例。

公开(公告)号：US10115606B2

公开(公告)日：2018-10-30

申请号：US15139265

申请日：2016-04-26

申请人： Intel Corporation

发明人： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/28 ,  H01L21/56 ,  H01L23/29 ,  H01L23/00

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

公开(公告)号：US11776821B2

公开(公告)日：2023-10-03

申请号：US17669288

申请日：2022-02-10

申请人： Intel Corporation

发明人： Ziyin Lin ,  Vipul Mehta ,  Edvin Cetegen ,  Yuying Wei ,  Sushrutha Gujjula ,  Nisha Ananthakrishnan ,  Shan Zhong

IPC分类号： H01L21/56 ,  H01L21/67 ,  H01L23/00 ,  H01L23/31 ,  H01L23/13

CPC分类号： H01L21/563 ,  H01L21/67126 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/564 ,  H05K2201/09045

摘要： A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. An encapsulant is over the protrusion of the substrate, the encapsulant extending beneath the first die, and the encapsulant extending beneath the second die.

公开(公告)号：US11282717B2

公开(公告)日：2022-03-22

申请号：US15942109

申请日：2018-03-30

申请人： Intel Corporation

发明人： Ziyin Lin ,  Vipul Mehta ,  Edvin Cetegen ,  Yuying Wei ,  Sushrutha Gujjula ,  Nisha Ananthakrishnan ,  Shan Zhong

IPC分类号： H01L21/56 ,  H01L21/67 ,  H01L23/13 ,  H01L23/31 ,  H01L23/00

摘要： A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. The substrate protrusion can enable void-free underfill.