公开(公告)号：US20130166093A1

公开(公告)日：2013-06-27

申请号：US13617262

申请日：2012-09-14

申请人： Jae Choon Kim ,  Jichul Kim ,  Hyunggil Baek ,  Eunseok Cho

发明人： Jae Choon Kim ,  Jichul Kim ,  Hyunggil Baek ,  Eunseok Cho

IPC分类号： G05D23/00

CPC分类号： H01L23/34 ,  G06F1/203 ,  G06F1/206 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic device may be operated in any of a plurality of heat-dissipation modes to accommodate temperature rises, including rapid temperature rises, while allowing an electronic device to continue operating. A parameter such as clock frequency, a supply voltage, current consumption, the number of applications running, or other operating parameter, may be manipulated to control internal heat dissipation and thereby accommodate factors, such as external temperature rises. One operation mode may be a maximum operation mode in which clock(s) operate at their highest frequencies and power is supplied at its highest level. A shut-down operation mode, in which a processor cuts power to electronic components, may be entered when a temperature of interest exceeds a predetermined threshold.

摘要翻译： 电子设备可以以多种散热模式中的任何一种操作，以适应包括快速升温的温度上升，同时允许电子设备继续操作。 可以操纵诸如时钟频率，电源电压，电流消耗，运行数量或其他操作参数的参数以控制内部散热，从而适应诸如外部温度升高的因素。 一个操作模式可以是其中时钟以其最高频率操作并且在其最高电平提供功率的最大操作模式。 当感兴趣的温度超过预定阈值时，可以进入处理器切断电子部件的电源的关闭操作模式。

公开(公告)号：US09228763B2

公开(公告)日：2016-01-05

申请号：US13692394

申请日：2012-12-03

申请人： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

发明人： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

IPC分类号： H01L35/32 ,  F25B21/02

CPC分类号： F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L35/32 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.

摘要翻译： 提供热电冷却封装及其热管理方法。 该方法可以包括测量包括半导体芯片和热电冷却器的热电冷却封装的温度，将热电冷却封装的温度与目标温度进行比较，当热电冷却封装的温度高于 目标温度，并且当热电冷却封装的温度变得低于目标温度时，停止热电冷却器的操作。

公开(公告)号：US09030826B2

公开(公告)日：2015-05-12

申请号：US13535967

申请日：2012-06-28

申请人： Jichul Kim ,  Jae Choon Kim ,  Young-deuk Kim ,  Eunseok Cho

发明人： Jichul Kim ,  Jae Choon Kim ,  Young-deuk Kim ,  Eunseok Cho

IPC分类号： H05K7/20 ,  H01L23/34 ,  H01L23/498 ,  H01L23/36 ,  H01L23/373

CPC分类号： H01L23/4985 ,  H01L23/36 ,  H01L23/3736 ,  H01L2224/16225

摘要： Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided.

摘要翻译： 提供片上胶卷包装。 片上胶片包装包括具有彼此相对的第一表面和第二表面的膜基材，第一表面上的半导体芯片和与第二表面相邻的热变形部件。 热变形构件具有使其形状根据温度变形的结构。 还提供了相关的设备和设备组件。

公开(公告)号：US09606591B2

公开(公告)日：2017-03-28

申请号：US13617619

申请日：2012-09-14

申请人： Heungkyu Kwon ,  Jae Choon Kim ,  Eunseok Cho ,  Jichul Kim

发明人： Heungkyu Kwon ,  Jae Choon Kim ,  Eunseok Cho ,  Jichul Kim

IPC分类号： G06F1/20

CPC分类号： G06F1/206 ,  G01J5/10 ,  G05B15/02

摘要： A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.

公开(公告)号：US08692349B2

公开(公告)日：2014-04-08

申请号：US13240574

申请日：2011-09-22

申请人： Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

发明人： Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

IPC分类号： H01L31/058

CPC分类号： G05F1/463 ,  H01L23/34 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L25/16 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00

摘要： An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.

摘要翻译： 示例性实施例涉及一种包括半导体封装的半导体器件，其中半导体芯片安装在封装衬底上。 半导体封装可以包括温度测量装置和温度控制电路。 温度测量装置可以测量半导体封装的温度。 温度控制电路可以基于由温度测量装置测量的半导体封装的温度来改变半导体封装的操作速度。

公开(公告)号：US20120133427A1

公开(公告)日：2012-05-31

申请号：US13240574

申请日：2011-09-22

申请人： Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

发明人： Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

IPC分类号： H01L27/00

CPC分类号： G05F1/463 ,  H01L23/34 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L25/16 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00

摘要： An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.

摘要翻译： 示例性实施例涉及一种包括半导体封装的半导体器件，其中半导体芯片安装在封装衬底上。 半导体封装可以包括温度测量装置和温度控制电路。 温度测量装置可以测量半导体封装的温度。 温度控制电路可以基于由温度测量装置测量的半导体封装的温度来改变半导体封装的操作速度。

公开(公告)号：US08988645B2

公开(公告)日：2015-03-24

申请号：US13596647

申请日：2012-08-28

申请人： Jichul Kim ,  Young-Deuk Kim ,  Eunseok Cho ,  Mi-Na Choi

发明人： Jichul Kim ,  Young-Deuk Kim ,  Eunseok Cho ,  Mi-Na Choi

IPC分类号： G02F1/1345 ,  G06F13/00 ,  G02F1/1333 ,  G06F3/038 ,  G06F13/14

CPC分类号： G06F13/00 ,  G09G3/3648 ,  G09G2300/0426

摘要： A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis.

摘要翻译： 显示装置包括包括由数据线和栅极线限定的像素的面板，覆盖面板的侧壁和边缘的壳体底板，面板下面的印刷电路板，印刷电路板包括被配置为产生至少一个 数据信号，门信号和控制信号，将印刷电路板连接到面板上的片上胶片，壳体底板和面板侧壁之间的芯片，安装在芯片上的驱动器集成电路 并且被配置为响应于控制信号并且驱动施加到数据线和栅极线的数据信号和栅极信号中的至少一个;以及连接单元，将膜上的芯片附接到壳体底座并且散发产生的热量 由驱动器集成电路到外壳底盘。

公开(公告)号：US20110018119A1

公开(公告)日：2011-01-27

申请号：US12801274

申请日：2010-06-01

申请人： Yonghoon Kim ,  Heeseok Lee ,  Eunseok Cho ,  Hyuna Kim ,  Soyoung Lim ,  PaLan Lee

发明人： Yonghoon Kim ,  Heeseok Lee ,  Eunseok Cho ,  Hyuna Kim ,  Soyoung Lim ,  PaLan Lee

IPC分类号： H01L23/34 ,  H01L23/488

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/642 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate.

摘要翻译： 半导体封装可以包括安装在基板上的至少一个半导体芯片，适于模制至少一个半导体芯片的模制层，在模制层上的具有其中在导体之间提供电介质的结构的热块，以及 通过将热块电连接到基底的通孔。

公开(公告)号：US08269342B2

公开(公告)日：2012-09-18

申请号：US12801274

申请日：2010-06-01

申请人： Yonghoon Kim ,  Heeseok Lee ,  Eunseok Cho ,  Hyuna Kim ,  Soyoung Lim ,  PaLan Lee

发明人： Yonghoon Kim ,  Heeseok Lee ,  Eunseok Cho ,  Hyuna Kim ,  Soyoung Lim ,  PaLan Lee

IPC分类号： H01L23/34

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/642 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate.

摘要翻译： 半导体封装可以包括安装在基板上的至少一个半导体芯片，适于模制至少一个半导体芯片的模制层，在模制层上的具有其中在导体之间提供电介质的结构的热块，以及 通过将热块电连接到基底的通孔。