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公开(公告)号：US20050064726A1
公开(公告)日：2005-03-24
申请号：US10796286
申请日：2004-03-10
申请人： Jason Reid , Nigel Hacker , Nina Pirila , Juha Rantala , William McLaughlin
发明人： Jason Reid , Nigel Hacker , Nina Pirila , Juha Rantala , William McLaughlin
IPC分类号： H01L21/312 , H01L21/314 , B32B9/04 , C22C29/00 , H01L21/31
CPC分类号： H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02274 , H01L21/02282 , H01L21/02318 , H01L21/3121 , Y10T428/31663 , Y10T428/31678
摘要： A method of forming a low dielectric constant structure. The method comprises providing at a first temperature a dielectric material having a first dielectric constant and a first elastic modulus, and curing the dielectric material by a thermal curing process, in which the material is heated to a second temperature by increasing the temperature at an average rate of at least 1° C. per second. As a result a densified, dielectric material is obtained which has a low dielectric constant.
摘要翻译： 一种形成低介电常数结构的方法。 该方法包括在第一温度下提供具有第一介电常数和第一弹性模量的介电材料，并通过热固化工艺固化介电材料，其中通过以平均值升高温度将材料加热至第二温度 速率至少为1℃/秒。 结果获得了具有低介电常数的致密的介电材料。
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公开(公告)号：US20050032357A1
公开(公告)日：2005-02-10
申请号：US10886061
申请日：2004-07-08
申请人： Juha Rantala , Nigel Hacker , Jason Reid , William McLaughlin , Teemu Tormanen
发明人： Juha Rantala , Nigel Hacker , Jason Reid , William McLaughlin , Teemu Tormanen
IPC分类号： G01N27/00
CPC分类号： H01L21/3122 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/76802 , H01L21/76808 , H01L21/7681 , H01L21/76829 , H01L21/76835 , H01L23/5329 , H01L2221/1031 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： An integrated circuit device is provided having a substrate and areas of electrically insulating and electrically conductive material, where the electrically insulating material is a hybrid organic-inorganic material that requires no or minimal CMP and which can withstand subsequent processing steps at temperatures of 450° C. or more.
摘要翻译： 提供了具有基板和电绝缘和导电材料的区域的集成电路器件，其中电绝缘材料是不需要或最小CMP的混合有机 - 无机材料，并且其可以承受450℃温度下的后续加工步骤 。 或者更多。
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公开(公告)号：US07622399B2
公开(公告)日：2009-11-24
申请号：US10796286
申请日：2004-03-10
申请人： Jason Reid , Nigel Hackera , Nina Pirilä , Juha Rantala , William McLaughlin
发明人： Jason Reid , Nigel Hackera , Nina Pirilä , Juha Rantala , William McLaughlin
IPC分类号： H01L21/469
CPC分类号： H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02274 , H01L21/02282 , H01L21/02318 , H01L21/3121 , Y10T428/31663 , Y10T428/31678
摘要： A method of forming a low dielectric constant structure. The method comprises providing at a first temperature a dielectric material having a first dielectric constant and a first elastic modulus, and curing the dielectric material by a thermal curing process, in which the material is heated to a second temperature by increasing the temperature at an average rate of at least 1° C. per second. As a result a densified, dielectric material is obtained which has a low dielectric constant.
摘要翻译： 一种形成低介电常数结构的方法。 该方法包括在第一温度下提供具有第一介电常数和第一弹性模量的介电材料，并通过热固化工艺固化介电材料，其中通过以平均值升高温度将材料加热至第二温度 速率至少为1℃/秒。 结果获得了具有低介电常数的致密的介电材料。
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公开(公告)号：US20090278254A1
公开(公告)日：2009-11-12
申请号：US12292968
申请日：2008-12-01
IPC分类号： H01L23/522 , H01L21/768 , H01L21/3105
CPC分类号： H01L21/3122 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/76802 , H01L21/76808 , H01L21/7681 , H01L21/76829 , H01L21/76835 , H01L23/5329 , H01L2221/1031 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： An integrated circuit device is provided having a substrate and areas of electrically insulating and electrically conductive material, where the electrically insulating material is a hybrid organic-inorganic material that requires no or minimal CMP and which can withstand subsequent processing steps at temperatures of 450° C. or more.
摘要翻译： 提供了具有基板和电绝缘和导电材料的区域的集成电路器件，其中电绝缘材料是不需要或最小CMP的混合有机 - 无机材料，并且其可以承受450℃温度下的后续加工步骤 。 或者更多。
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公开(公告)号：US09564339B2
公开(公告)日：2017-02-07
申请号：US13638075
申请日：2010-03-29
IPC分类号： H01L21/311 , H01L21/308 , C23C18/12
CPC分类号： H01L21/3081 , C23C18/1216 , G03F7/039 , G03F7/162 , G03F7/168 , G03F7/20 , G03F7/32 , H01L21/0276 , H01L21/3065 , H01L21/308 , H01L21/3085 , H01L21/3086 , H01L21/76898
摘要： Method of forming a protective hard mask layer on a substrate in a semiconductor etch process, comprising the step of applying by solution deposition on the substrate a solution or colloidal dispersion of an alumina polymer, said solution or dispersion being obtained by hydrolysis and condensation of monomers of at least one aluminum oxide precursor in a solvent or a solvent mixture in the presence of water and a catalyst. The invention can be used for making a hard mask in a TSV process to form a high aspect ratio via a structure on a semiconductor substrate.
摘要翻译： 在半导体蚀刻工艺中在衬底上形成保护性硬掩模层的方法，包括以下步骤：通过溶液沉积在衬底上施加氧化铝聚合物的溶液或胶体分散体，所述溶液或分散体通过单体的水解和缩合获得 的至少一种氧化铝前体在溶剂或溶剂混合物中，在水和催化剂的存在下。 本发明可以用于在TSV工艺中制造硬掩模，以通过半导体衬底上的结构形成高纵横比。
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公开(公告)号：US20130143408A1
公开(公告)日：2013-06-06
申请号：US13638075
申请日：2010-03-29
IPC分类号： H01L21/308
CPC分类号： H01L21/3081 , C23C18/1216 , G03F7/039 , G03F7/162 , G03F7/168 , G03F7/20 , G03F7/32 , H01L21/0276 , H01L21/3065 , H01L21/308 , H01L21/3085 , H01L21/3086 , H01L21/76898
摘要： Method of forming a protective hard mask layer on a substrate in a semiconductor etch process, comprising the step of applying by solution deposition on the substrate a solution or colloidal dispersion of an alumina polymer, said solution or dispersion being obtained by hydrolysis and condensation of monomers of at least one aluminium oxide precursor in a solvent or a solvent mixture in the presence of water and a catalyst. The invention can be used for making a hard mask in a TSV process to form a high aspect ratio via a structure on a semiconductor substrate.
摘要翻译： 在半导体蚀刻工艺中在衬底上形成保护性硬掩模层的方法，包括以下步骤：通过溶液沉积在衬底上施加氧化铝聚合物的溶液或胶体分散体，所述溶液或分散体通过单体的水解和缩合获得 的至少一种氧化铝前体在溶剂或溶剂混合物中，在水和催化剂的存在下。 本发明可以用于在TSV工艺中制造硬掩模，以通过半导体衬底上的结构形成高纵横比。
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公开(公告)号：US20110203495A1
公开(公告)日：2011-08-25
申请号：US12712896
申请日：2010-02-25
申请人： William McLaughlin
发明人： William McLaughlin
CPC分类号： A47B91/024
摘要： A top access leveler assembly for leveling a table by use of a pedestal guide barrel, a leveling adjustment screw, and an adjustment driver. The leveling adjustment screw has a lower end with a foot pad and an upper end that can be rotated by the use of an adjustment driver. The adjustment driver is positioned within a cavity of the pedestal guide barrel and is further operated by a knob guide barrel that employs the use of alignment channels to allow the knob guide barrel to be twisted into a position where a spring biases the knob upward to allow ease of rotation. Once the knob is raised, the leveling adjustment screw is accessed from the top wherein the alignment channels allow rotation of the adjustment driver in either a clockwise or counterclockwise direction for use in extending the foot pad beneath the base of the table. The alignment guides further allow for the depressing of the guide barrel into the cavity and with a slight rotation places the guide barrel in a recessed position when not in use. The knob guide barrel includes a knob having an upper surface that is designed to be flush with an upper surface of the pedestal base when not in use and extends above the upper surface of the pedestal base to allow ease of rotation.
摘要翻译： 一种用于通过使用基座引导筒，调平螺丝和调节驱动器来平整工作台的顶部接近调平器组件。 调平螺丝具有带脚垫的下端和可通过使用调节驱动器旋转的上端。 调节驱动器定位在基座引导筒的空腔内，并且由旋钮引导筒进一步操作，该推钮引导筒采用对准通道，以允许把手引导筒扭转到弹簧向上偏置旋钮的位置，以允许 易于旋转 一旦旋钮升起，调平调节螺钉从顶部进入，其中对准通道允许调节驱动器以顺时针或逆时针方向旋转，用于将脚垫延伸到桌子底部。 对准引导件进一步允许将引导筒压入空腔中并且稍微旋转时，在不使用时将引导筒放置在凹陷位置。 旋钮导向筒包括具有上表面的旋钮，该上表面被设计成在不使用时与底座基座的上表面齐平并且在基座底座的上表面上方延伸以允许容易旋转。
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公开(公告)号：US20050045823A1
公开(公告)日：2005-03-03
申请号：US10961851
申请日：2004-10-08
CPC分类号： A63B43/00 , A63B24/0021 , A63B43/06 , A63B71/06 , A63B2024/0053 , A63B2102/32
摘要： An item that might be lost is provided with a badge featuring an array of glass beads. In seeking to retrieve such a lost item, an atmospheric-penetrating beam of laser is directed into the search area, and the signals from a reflectometer are monitored. The item having the badge of the array of glass beads is more easily retrievable when lost or mislaid than an item without such badge.
摘要翻译： 可能会丢失的物品提供有一系列玻璃珠的徽章。 在寻找这样的丢失物品时，大气穿透的激光束被引导到搜索区域中，并且监测来自反射计的信号。 具有玻璃珠阵列徽章的物品比没有这种徽章的物品丢失或误入时更易于检索。
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公开(公告)号：US20060198779A1
公开(公告)日：2006-09-07
申请号：US11353488
申请日：2006-02-13
IPC分类号： B01D53/56
CPC分类号： B01D53/56 , B01D2251/20
摘要： A non-catalytic process for NOx concentrations in process streams wherein a reducing agent and a readily-oxidizable gas are injected into a NOx-containing process stream to reduce the concentration of the NOx-containing process stream while minimizing the carryover of the unreacted reducing agent.
摘要翻译： 在工艺流中的NO x x浓度的非催化方法，其中将还原剂和容易氧化的气体注入含NO x的工艺流中以降低浓度 的含NO x的工艺流，同时最小化未反应的还原剂的残留。
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公开(公告)号：US5888463A
公开(公告)日：1999-03-30
申请号：US2434
申请日：1998-01-02
申请人： William McLaughlin , Terry S. Adams
发明人： William McLaughlin , Terry S. Adams
摘要： Li batteries are cryogenically cooled, comminuted and reacted with water having its pH adjusted with the addition of LiOH. The resulting salts are substantially dewatered and optionally further purified in an electrolytic cell to yield substantially uncontaminated LiOH for reuse.
摘要翻译： 锂电池被低温冷却，粉碎并与添加了LiOH的pH调节的水反应。 所得盐基本上脱水并任选地在电解池中进一步纯化，以产生基本上未被污染的LiOH用于再利用。
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