摘要:
The present disclosure describes self-biasing radio frequency circuitry. In some aspects a radio frequency (RF) signal is amplified via a circuit having a first transistor configured to source current to an output of the circuit and a second transistor configured to sink current from the output of the circuit, and another signal is provided, without active circuitry, from the output of the circuit to a gate of the first transistor effective to bias a voltage at the output of the circuit. By so doing, the output of the circuit can be biased without active circuitry which can reduce design complexity of and substrate area consumed by the circuit.
摘要:
Disclosed is a transmit/receive circuit arrangement wherein a transceiver circuit including a transmit/receive switch is fabricated on an integrated circuit chip. A matching network is wholly disposed off-chip relative to the integrated circuit chip. In embodiments, at least a portion of the matching network is formed off-chip and a portion of the matching network is formed on-chip.
摘要:
The present disclosure describes self-biasing radio frequency circuitry. In some aspects a radio frequency (RF) signal is amplified via a circuit having a first transistor configured to source current to an output of the circuit and a second transistor configured to sink current from the output of the circuit, and another signal is provided, without active circuitry, from the output of the circuit to a gate of the first transistor effective to bias a voltage at the output of the circuit. By so doing, the output of the circuit can be biased without active circuitry which can reduce design complexity of and substrate area consumed by the circuit.
摘要:
Disclosed is a transmit/receive circuit arrangement wherein a transceiver circuit including a transmit/receive switch is fabricated on an integrated circuit chip. A matching network is wholly disposed off-chip relative to the integrated circuit chip. In embodiments, at least a portion of the matching network is formed off-chip and a portion of the matching network is formed on-chip.
摘要:
A two-pin transmit/receive switch design includes a switching component configured to selectively switch in elements for a transmit signal path and elements for a receive signal path. A capacitor in the transmit signal path may be switched out when receiving signals on the receive signal path. Being able to selectively switch out the capacitor allows the capacitor value to be selected for optimal operation during transmit mode. For example, insertion loss may be minimized. In addition, elements in the receive signal path may be optimized (e.g., impedance matching) without being affected by or affecting the optimization that was performed for the transmit signal path.
摘要:
Disclosed are various exemplary embodiments of a clock recovery apparatus for recovering clock signals of multiple data channels. In one exemplary embodiment a clock recovery apparatus for a plurality of data channels may include a plurality of channel blocks, where each channel block may include a frequency detection block configured to generate an intermediate signal based on a respective data signal received from a respective data channel and a global signal, and a recovery block configured to recover a clock signal for the respective data channel in response to the respective data signal and the global signal. The apparatus may also include a global signal generation block configured to receive and combine the intermediate signals from the plurality of channel blocks to generate the global signal.
摘要:
A conductive via of a semiconductor device is provided extending in a vertical direction through a substrate, a first end of the conductive via extending through a first surface of the substrate, so that the first end protrudes in the vertical direction relative to the first surface of the substrate. An insulating layer is provided on the first end of the conductive via and on the first surface of the substrate. An upper portion of a mask layer pattern is removed so that a capping portion of the insulating layer that is on the first end of the conductive via is exposed. A portion of the insulating layer at a side of, and spaced apart from, the conductive via, is removed, to form a recess in the insulating layer. The capping portion of the insulating layer on the first end of the conductive via is simultaneously removed.
摘要:
An organic light emitting diode display and a method of manufacturing the same are disclosed. The organic light emitting diode display includes a substrate, a first electrode positioned on the substrate, an organic light emitting layer positioned on the first electrode, and a second electrode positioned on the organic light emitting layer. The organic light emitting layer includes an inorganic oxide layer between a light emitting layer and a common layer.
摘要:
Provided are a metal interconnect of a semiconductor device and a method of fabricating the metal interconnect. The metal interconnect includes a metal line having a first end and a second end disposed on an opposite side to the first end, a via electrically connected to the metal line, and a non-active segment extending from the first end and including a void. Tensile stress is decreased to prevent a void from occurring under the via. Accordingly, line breakage due to electromigration is substantially prevented, thus improving electrical characteristics of the device.
摘要:
A conductive via of a semiconductor device is provided extending in a vertical direction through a substrate, a first end of the conductive via extending through a first surface of the substrate, so that the first end protrudes in the vertical direction relative to the first surface of the substrate. An insulating layer is provided on the first end of the conductive via and on the first surface of the substrate. An upper portion of a mask layer pattern is removed so that a capping portion of the insulating layer that is on the first end of the conductive via is exposed. A portion of the insulating layer at a side of, and spaced apart from, the conductive via, is removed, to form a recess in the insulating layer. The capping portion of the insulating layer on the first end of the conductive via is simultaneously removed.