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公开(公告)号：US5177324A
公开(公告)日：1993-01-05
申请号：US747090
申请日：1991-08-19
CPC分类号： H05K1/0218 , H05K9/0039 , H05K2201/0715 , H05K3/4644
摘要： A printed circuit board providing RF shielding. An electrically insulating material serves as a substrate (10) with two opposed sides. At least one side of the substrate (10) has an electrically conductive layer (12) formed in a pattern that defines a printed circuit. An insulating dielectric layer (14) covers at least a portion of the printed circuitry, leaving at least one portion (16) of the circuitry exposed. A radio frequency (RF) shielding layer (18) is formed by depositing an electrically conductive polymer on at least a portion of the insulating dielectric layer. The RF shielding layer (18) also lies over a portion of the exposed electrical circuitry (16), providing electrical connection to the electrically conductive layer (12). The RF shielding layer (18) is formed from a silverfilled polymer thick film ink and is applied by screen printing, stencilling, roller coating, spraying, or other equivalent methods.
摘要翻译： 提供RF屏蔽的印刷电路板。 电绝缘材料用作具有两个相对侧面的基底（10）。 衬底（10）的至少一侧具有以限定印刷电路的图案形成的导电层（12）。 绝缘电介质层（14）覆盖印刷电路的至少一部分，留下电路的至少一部分（16）暴露。 通过在绝缘介电层的至少一部分上沉积导电聚合物形成射频（RF）屏蔽层（18）。 RF屏蔽层（18）也位于暴露的电路（16）的一部分上，提供与导电层（12）的电连接。 RF屏蔽层（18）由银填充的聚合物厚膜油墨形成，并通过丝网印刷，压光，辊涂，喷涂或其它等效方法施加。
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公开(公告)号：US5381307A
公开(公告)日：1995-01-10
申请号：US129010
申请日：1993-09-29
CPC分类号： B23K1/20 , H05K1/111 , H05K13/046 , H05K3/3436 , B23K2201/40 , H01L2224/13012 , H01L2224/1403 , H01L2224/14051 , H05K2201/094 , H05K2201/10719 , H05K2201/10734 , H05K2203/048 , H05K2203/166 , Y02P70/611 , Y02P70/613
摘要： A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the area having four outside corners. The first pad array includes contact pads (502) arranged in a first linear grid pattern, and eight aligning pads (504,506,510,514,518), larger than the contact pads (502). Two aligning pads (504,506,510,514,518) are near each of the four outside corners. Each aligning pad (504,506,510,514,518) is positioned off center with respect to the first linear grid pattern such that a tangential line (608,610,612,614) can be drawn between an innermost point of the aligning pad (504,506,510,514,518) and corresponding innermost points of the contact pads (502) that are collinear on the first linear grid pattern. A second pad array (406) is disposed on the surface mount component and arranged in a second linear grid pattern that aligns with the first linear grid pattern. Eight pads of the second pad array (406) also align with points of intersection of the first linear grid pattern that fall within each of the eight aligning pads (504,506,510,514,518). Each pad of the second pad array (406) is equal in size to any other pad of the second pad array (406). Solder (312) is disposed between and contacting each pad of the first and second pad arrays.
摘要翻译： 安装垫装置（图5）提高了表面安装部件的放置的可靠性。 第一衬垫阵列设置在衬底（202）的表面（308）上的整个区域中，该区域具有四个外角。 第一焊盘阵列包括以第一线性栅格图案布置的接触焊盘（502）和大于接触焊盘（502）的八个对准焊盘（504,506,510,514,518）。 两个对准垫（504,506,510,514,518）靠近四个外角中的每一个。 每个对准衬垫（504,506,510,514,518）相对于第一线性网格图案偏离中心，使得切向线（608,610,612,614）可以在对准衬垫（504,506,510,514,518）的最内点和接触垫（502）的相应最内点之间绘制 ），其在第一线性网格图案上是共线的。 第二衬垫阵列（406）设置在表面安装部件上并且以与第一线性网格图案对准的第二线性网格图案布置。 第二焊盘阵列（406）的八个焊盘还与落在八个对准焊盘（504,506,510,514,518）的每一个内的第一线性栅格图案的交点相对准。 第二焊盘阵列（406）的每个焊盘的大小与第二焊盘阵列（406）的任何其他焊盘相同。 焊料（312）设置在第一和第二焊盘阵列之间并接触第一和第二焊盘阵列的每个焊盘。
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公开(公告)号：US5369399A
公开(公告)日：1994-11-29
申请号：US921784
申请日：1992-07-30
CPC分类号： G08B3/1058
摘要： An electronic device (100) comprises a housing (222), a circuit supporting substrate (454, 456) within the housing and mechanically coupled thereto, and electronic circuitry (744, 746, 748, 750, 752) mechanically coupled to the circuit supporting substrate (454, 456). The electronic device (100) further comprises a mechanical shock isolation member (760, 762, 1312) within the housing (222) and mechanically coupled to the circuit supporting substrate (454, 456) for substantially increasing the natural mechanical frequency of vibration of the circuit supporting substrate (454, 456). The mechanical shock isolation member (760, 762, 1312) comprises an element (1313) having a planar surface (1315). The mechanical shock isolation member (760, 762, 1312) further comprises protuberances (1314) mechanically coupled to and extending perpendicularly from the planar surface (1315) for absorbing a tolerance build-up.
摘要翻译： 电子设备（100）包括壳体（222），壳体内的电路支撑衬底（454,456）并机械耦合到壳体，以及电子电路（744,746,748,750,752），机电耦合到电路支撑 基底（454,456）。 电子设备（100）还包括在壳体（222）内的机械震动隔离构件（760,762,1312），并且机械地联接到电路支撑衬底（454,456），用于基本上增加天线的振动的机械频率 电路支撑衬底（454,456）。 机械冲击隔离构件（760,762,1312）包括具有平坦表面（1315）的元件（1313）。 机械冲击隔离构件（760,762,1312）还包括机械联接到平面表面（1315）并垂直于其延伸的凸起（1314），用于吸收容差积聚。
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公开(公告)号：US5317308A
公开(公告)日：1994-05-31
申请号：US878126
申请日：1992-05-04
申请人： David A. Tribbey , Allen D. Hertz , Mario A. Rivas
发明人： David A. Tribbey , Allen D. Hertz , Mario A. Rivas
CPC分类号： G08B3/1058
摘要： An electronic device (100) includes a housing (222), a circuit supporting substrate (902) within the housing (222) and mechanically coupled thereto, and electronic circuitry (904) mechanically coupled to the circuit supporting substrate (902). A mechanical shock isolator (502) is located within the housing (222), and is mechanically coupled to the circuit supporting substrate (902) for substantially increasing the natural mechanical frequency of vibration of the circuit supporting substrate (902). The mechanical shock isolator (502) includes an electrically conductive structure (504) that is electrically coupled to the electronic circuitry (904). Additionally, a method is provided for sensing the integrity of an electrical loop formed between the electrically conductive structure (504) and the electronic circuitry (904).
摘要翻译： 电子设备（100）包括壳体（222），壳体（222）内的机械耦合的电路支撑衬底（902）和机械耦合到电路支撑衬底（902）的电子电路（904）。 机械冲击隔离器（502）位于壳体（222）内，并且机械耦合到电路支撑衬底（902），用于基本上增加电路支撑衬底（902）的振动的自然机械频率。 机械防震隔离器（502）包括电耦合到电子电路（904）的导电结构（504）。 另外，提供了一种用于感测在导电结构（504）和电子电路（904）之间形成的电气回路的完整性的方法。
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5.发明授权
公开(公告)号：US5311405A
公开(公告)日：1994-05-10
申请号：US100834
申请日：1993-08-02
CPC分类号： H05K1/111 , B23K1/0016 , H05K13/0465 , H05K3/3442 , B23K2201/36 , H05K2201/0939 , H05K2201/0989 , H05K2201/10636 , H05K2203/048 , H05K2203/0545 , Y02P70/611 , Y02P70/613
摘要： A method and an apparatus align and attach a leadless surface mount component (402) including a termination at each end of the component (402). The termination has bottom (704) and end (702) portions for attaching to a corresponding pad on a substrate (102) by a reflow solder process (1200). A pad arrangement (100) is formed including two opposite pads (108), each pad (108) occupying a tri-oval-shaped area. The tri-oval-shaped area includes an elliptical area (110) substantially centered under the bottom portion (704) of the corresponding termination of the component (402) when the component (402) is aligned with the pad arrangement (100), and an arcuate area (112) contiguous with the elliptical area (110) and extending towards the opposite pad (108) in a central lengthwise direction. A solder paste (202) is applied to the elliptical area (110), and thereafter reflowed, whereby solder (302) in the solder paste (202) liquefies and flows onto the arcuate area (112), thereby facilitating alignment of the component (402) with the pad arrangement (100).
摘要翻译： 一种方法和装置将包括在组件（402）的每个端部处的端接件的无引线表面安装部件（402）对准和附接。 终端具有底部（704）和端部（702）部分，用于通过回流焊接工艺（1200）附接到衬底（102）上的对应衬垫。 形成包括两个相对的焊盘（108）的焊盘装置（100），每个焊盘（108）占据三椭圆形的区域。 当所述部件（402）与所述垫装置（100）对准时，所述三椭圆形区域包括基本上位于所述部件（402）的相应终端的底部（704）下方的中心的椭圆形区域（110），以及 与椭圆形区域（110）相邻并在中心纵向方向上朝向相对的垫（108）延伸的弧形区域（112）。 将焊膏（202）施加到椭圆形区域（110）上，然后回流焊接，由此焊膏（202）中的焊料（302）液化并流到弧形区域（112），从而有助于部件 402）。
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公开(公告)号：US5418688A
公开(公告)日：1995-05-23
申请号：US38423
申请日：1993-03-29
IPC分类号： G06K19/077 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36
CPC分类号： H05K1/186 , G06K19/077 , H05K1/144 , H05K3/368 , H05K1/182 , H05K2201/09536 , H05K2201/096 , H05K2201/10666 , H05K2203/087 , H05K3/341 , H05K3/3436 , H05K3/3489 , H05K3/3494 , H05K3/462
摘要： An electronic device (100) comprises a first substrate (102) having a first circuit pattern disposed thereon which is selectively processed to provide pretinned connection pads (108, 116, 124, 132, 140) for connection to at least one electronic component (142) and a second circuit pattern disposed on a second substrate (104). The second circuit pattern disposed on the second substrate (104) is selectively processed to further provide pretinned connection pads (110, 118, 126) for connection to the first circuit pattern, and the second substrate (104) further has relief provided within a portion thereof to position the at least one electronic component (142) with respect to the pretinned connection pads (108, 116, 124, 132, 140) on the first circuit pattern. The pretinned connection pads (108, 116, 124, 132, 140, 110, 118, 126) are processed using a low residue fluxing agent to enable processing of the first (102) and second (104) substrates and the at least one electronic component (142) in a single operation through an envelope heating device without a requirement for cleaning after reflow.
摘要翻译： 电子设备（100）包括第一衬底（102），其具有布置在其上的第一电路图案，其被选择性地处理以提供用于连接到至少一个电子部件（142）的预先安装的连接焊盘（108,116,124,132,140） ）和设置在第二基板（104）上的第二电路图案。 布置在第二基板（104）上的第二电路图案被选择性地处理以进一步提供用于连接到第一电路图案的预先安装的连接焊盘（110,118,126），并且第二基板（104）还具有设置在第一基板 以相对于第一电路图案上的预先设计的连接焊盘（108,116,124,132,140）定位所述至少一个电子部件（142）。 使用低残留助熔剂处理预先安装的连接焊盘（108,116,124,132,140,110,118,126），以使得能够处理第一（102）和第二（104）衬底和至少一个电子 组件（142）通过信封加热装置进行单次操作，而不需要在回流之后进行清洁。
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公开(公告)号：US5159171A
公开(公告)日：1992-10-27
申请号：US753540
申请日：1991-09-03
CPC分类号： B23K1/0056 , B23K3/06 , H05K3/3484 , H05K2203/0278 , H05K2203/0425 , H05K2203/043 , H05K2203/0485 , H05K2203/0723 , H05K2203/107 , H05K3/3494
摘要： A method for solder deposition by the use of a laser (24), comprises the steps of applying a predetermined thickness of solder (6) to a substrate (2) including over a printed circuitry pattern (4) on the substrate, laser printing (24) to a reflow temperature the solder on the printed circuitry pattern, leaving an un-reflowed portion (9) and then removing (26) the un-reflowed portion of the substrate, leaving solidified solder (7) on the printed circuitry pattern of the substrate. Additionally, if desired, a part (12) having solder pads (14) can be placed on the solder (7) after tack media (13) is placed on the solder. Then the part (12) and substrate can be reflowed in an oven (34).
摘要翻译： 通过使用激光器（24）进行焊料沉积的方法包括以下步骤：将预定厚度的焊料（6）施加到基板（2）上，包括在基板上的印刷电路图案（4）上，激光打印（ 24）将印刷电路图案上的焊料回流到回流温度，留下未回流部分（9），然后去除（26）衬底的未回流部分，留下固化的焊料（7）在印刷电路图案上 底物。 另外，如果需要，在将粘性介质（13）放置在焊料上之后，可以在焊料（7）上放置具有焊盘（14）的部分（12）。 然后，部分（12）和基底可以在烘箱（34）中回流。
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公开(公告)号：US09089184B1
公开(公告)日：2015-07-28
申请号：US14044808
申请日：2013-10-02
申请人： Mary Kiser , Allen D. Hertz
发明人： Mary Kiser , Allen D. Hertz
IPC分类号： A43B3/24
摘要： A pair of foldable footwear, each footwear incorporating a flexible hinge within a sole of the footwear. The flexible hinge consists of a molded flexible hinge section 40, a molded hinge aperture 38, a hinge top slot 34 and a hinge limitation contact section 42. The molded flexible hinge section 40 and molded hinge aperture 38 provides a flexible and reliable member allowing the sole to be folded. The sole can comprise a hinge section along a transverse orientation or a longitudinal orientation about the center of the sole. The hinge limitation contact section 42 ensures that a heel section of the sole remains in a wearable configuration during use.
摘要翻译： 一对可折叠鞋类，每个鞋类在鞋底内装有柔性铰链。 柔性铰链由模制的柔性铰链部分40，模制的铰链孔38，铰链顶部狭槽34和铰链限定接触部分42组成。模制的柔性铰链部分40和模制的铰链孔38提供柔性和可靠的构件， 唯一被折叠。 鞋底可以包括围绕鞋底中心的横向或纵向取向的铰链部分。 铰链限制接触部分42确保在使用期间鞋底的鞋跟部分保持在可穿戴的构造中。
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公开(公告)号：USD508532S1
公开(公告)日：2005-08-16
申请号：US29185653
申请日：2003-07-01
申请人： Allen D. Hertz
设计人： Allen D. Hertz
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10.发明授权Vibrational energy waves for assist in the print release process for screen printing 失效振动能量波，用于帮助丝网印刷的打印释放过程
公开(公告)号：US06138562A
公开(公告)日：2000-10-31
申请号：US208959
申请日：1998-12-10
申请人： Allen D. Hertz , Eric L. Hertz , Dennis D. Epp
发明人： Allen D. Hertz , Eric L. Hertz , Dennis D. Epp
CPC分类号： B23K1/085 , B41F15/12 , B41M1/125 , H05K3/1233 , B23K2201/40 , B41P2215/13 , H05K2203/0264 , H05K2203/0285 , H05K3/3415
摘要： Solder Paste, adhesives and other materials are screen printed onto Printed Circuit Boards (PCB's) during the assembly process for electronic circuit assemblies. Pressure forces may be applied to the material to aid in separating the material from the apertures within the stencil. The pressure forces are created from sound pressure waves generated from a vibrational energy source located some distance from the stencil. Examples of non-contacting vibrational energy sources include Ultrasonic transducers, horns, speakers, and tuning forks. Additional assistance to separate the material from the apertures may be applied by a vibrational source by contacting to the stencil. Examples of the contacting vibrational energy sources may be off-balanced motors, piezo-electric transducers, and mass-resonant vibrators.
摘要翻译： 在电子电路组件的组装过程中，焊膏，粘合剂和其他材料被丝网印刷到印刷电路板（PCB）上。 可以将压力施加到材料上以帮助将材料与模板中的孔分离。 压力由距离模板一定距离的振动能源产生的声压波产生。 非接触振动能源的实例包括超声波换能器，喇叭，扬声器和调音叉。 可以通过与模板接触的振动源来应用从孔中分离材料的附加帮助。 接触振动能源的示例可以是不平衡的电动机，压电换能器和质量共振振动器。
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