Semiconductor light emitting device and method of manufacturing the same
    4.
    发明授权
    Semiconductor light emitting device and method of manufacturing the same 失效
    半导体发光器件及其制造方法

    公开(公告)号:US07968893B2

    公开(公告)日:2011-06-28

    申请号:US12210472

    申请日:2008-09-15

    CPC分类号: H01L33/40 H01L33/32

    摘要: Disclosed are a semiconductor light emitting device, which can improve characteristics of the semiconductor light emitting device such as a forward voltage characteristic and a turn-on voltage characteristic, increase light emission efficiency by lowering an input voltage, and increase reliability of the semiconductor light emitting device by a low-voltage operation, and a method of manufacturing the same. The semiconductor light emitting device includes: an n-type GaN semiconductor layer; an active layer formed on a gallium face of the n-type GaN semiconductor layer; a p-type semiconductor layer formed on the active layer; and an n-type electrode formed on a nitrogen face of the n-type GaN semiconductor layer and including a lanthanum (La)-nickel (Ni) alloy.

    摘要翻译: 公开了一种半导体发光器件,其能够提高半导体发光器件的特性,例如正向电压特性和导通电压特性,通过降低输入电压来提高发光效率,并提高半导体发光器件的可靠性 器件的低压工作及其制造方法。 半导体发光器件包括:n型GaN半导体层; 形成在所述n型GaN半导体层的镓面上的有源层; 形成在有源层上的p型半导体层; 以及形成在n型GaN半导体层的氮面上并包含镧(La) - 镍(Ni)合金的n型电极。