公开(公告)号：US20130119540A1

公开(公告)日：2013-05-16

申请号：US13362048

申请日：2012-01-31

申请人： Jong Kuk Hong ,  Keung Jin Sohn ,  Jung Hwan Park

发明人： Jong Kuk Hong ,  Keung Jin Sohn ,  Jung Hwan Park

IPC分类号： H01L23/498 ,  H01L21/50 ,  H01L23/48

CPC分类号： H01L21/50 ,  H01L23/3121 ,  H01L23/48 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed herein are a semiconductor package and a method for manufacturing the same. The method includes preparing a substrate having one surface and the other surface; mounting a semiconductor device mounted on one surface of the substrate; forming external connection terminals on the other surface of the substrate; forming a warpage preventing layer formed on one surface of the substrate or the other surface of the substrate; and performing a reflow process on the substrate.

摘要翻译： 本文公开了一种半导体封装及其制造方法。 该方法包括制备具有一个表面和另一个表面的基底; 安装安装在所述基板的一个表面上的半导体器件; 在所述基板的另一个表面上形成外部连接端子; 形成在所述基板或所述基板的另一表面的一个表面上形成的翘曲防止层; 并在衬底上进行回流处理。

公开(公告)号：US20090288293A1

公开(公告)日：2009-11-26

申请号：US12232995

申请日：2008-09-26

申请人： Sang Youp Lee ,  Keung Jin Sohn ,  Joung Gul Ryu ,  Jung Hwan Park ,  Ho Sik Park ,  Jun Hyeong Park

发明人： Sang Youp Lee ,  Keung Jin Sohn ,  Joung Gul Ryu ,  Jung Hwan Park ,  Ho Sik Park ,  Jun Hyeong Park

IPC分类号： H01R43/16

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K2201/0355 ,  H05K2203/1189 ,  H05K2203/1461 ,  Y10T29/49204

摘要： A metal core package substrate and a method for manufacturing the same. A method for manufacturing a metal core package substrate may include: forming a plurality of holes in a metal core; forming a plurality of paste bumps piercing into insulation layers of a first copper foil layer and a second copper foil layer; positioning the first and second copper foil layers at positions corresponding to the holes of the metal core so that the paste bumps are opposed to each other around the metal core; allowing each paste bump to pierce into the holes of the metal core by pressing the first and second copper foil layers; and forming inner circuits in the metal core pierced with the paste bumps.

摘要翻译： 金属芯封装基板及其制造方法。 金属芯封装基板的制造方法可以包括：在金属芯中形成多个孔; 形成穿过第一铜箔层和第二铜箔层的绝缘层的多个焊料凸块; 将第一和第二铜箔层定位在与金属芯的孔对应的位置处，使得焊膏凸起彼此围绕金属芯相对; 通过按压第一和第二铜箔层，允许每个焊膏凸起穿入金属芯的孔中; 并且在金属芯中形成用该焊膏凸起的内部电路。

公开(公告)号：US20110139858A1

公开(公告)日：2011-06-16

申请号：US12721544

申请日：2010-03-10

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

IPC分类号： B23K31/02 ,  B32B15/01

CPC分类号： H05K3/4644 ,  H05K3/0097 ,  H05K2203/1536 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/12986

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

摘要翻译： 这里公开了一种用于制造基板的载体，包括：两个绝缘层，每个绝缘层的一侧上设置有第一金属层，在另一侧上设置有第二金属层; 以及第三金属层，其具有比所述第一金属层低的熔点，并且形成在分别形成在所述两个绝缘层上的所述两个第一金属层之间，使得所述两个第一金属层彼此附接。 载体的优点在于，可以通过加热第三金属层来分离载体，使得在分离载体时基板的尺寸不变，从而保持基板和制造设备之间的相容性。

公开(公告)号：US08344261B2

公开(公告)日：2013-01-01

申请号：US12805586

申请日：2010-08-06

申请人： Suk Won Lee ,  Keung Jin Sohn ,  Chang Gun Oh

发明人： Suk Won Lee ,  Keung Jin Sohn ,  Chang Gun Oh

IPC分类号： H05K1/09 ,  H05K1/11

CPC分类号： H05K3/007 ,  H05K3/0097 ,  H05K3/428 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/12569 ,  Y10T428/12583 ,  Y10T428/2839

摘要： Disclosed are a carrier substrate including an insulating base material with a copper foil layer formed on at least one surface thereof, a metal layer formed on the copper layer and having a length shorter than that of the copper foil layer, and an insulating layer formed on the metal layer, a fabrication method thereof, a printed circuit board (PCB) using the same, and a fabrication method thereof. Because there is no land at the via and core in the substrate, because a circuit pattern connected with the via can be formed to be finer, so the circuit pattern can be highly integrated and the substrate can become thinner. Thus, a printed circuit board (PCB) having a smaller size and reduced number of layers can be fabricated.

摘要翻译： 公开了一种载体基板，其包括在其至少一个表面上形成有铜箔层的绝缘基材，在铜层上形成的长度短于铜箔层的金属层，以及形成在 金属层，其制造方法，使用其的印刷电路板（PCB）及其制造方法。 由于在基板中的通孔和芯部没有焊盘，因为可以形成与通孔连接的电路图案更细，所以电路图案可以高度集成，并且基板可以变薄。 因此，可以制造具有更小尺寸和更少层数的印刷电路板（PCB）。

公开(公告)号：US20110155429A1

公开(公告)日：2011-06-30

申请号：US12805586

申请日：2010-08-06

申请人： Suk Won Lee ,  Keung Jin Sohn ,  Chang Gun Oh

发明人： Suk Won Lee ,  Keung Jin Sohn ,  Chang Gun Oh

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K3/10

CPC分类号： H05K3/007 ,  H05K3/0097 ,  H05K3/428 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/12569 ,  Y10T428/12583 ,  Y10T428/2839

摘要： Disclosed are a carrier substrate including an insulating base material with a copper foil layer formed on at least one surface thereof, a metal layer formed on the cooper layer and having a length shorter than that of the copper foil layer, and an insulating layer formed on the metal layer, a fabrication method thereof, a printed circuit board (PCB) using the same, and a fabrication method thereof. Because there is no land at the via and core in the substrate, because a circuit pattern connected with the via can be formed to be finer, so the circuit pattern can be highly integrated and the substrate can become thinner. Thus, a printed circuit board (PCB) having a smaller size and reduced number of layers can be fabricated.

摘要翻译： 公开了一种载体基板，其包括在其至少一个表面上形成有铜箔层的绝缘基材，在铜层上形成的长度短于铜箔层的金属层，以及形成在 金属层，其制造方法，使用其的印刷电路板（PCB）及其制造方法。 由于在基板中的通孔和芯部没有焊盘，因为可以形成与通孔连接的电路图案更细，所以电路图案可以高度集成，并且基板可以变薄。 因此，可以制造具有更小尺寸和更少层数的印刷电路板（PCB）。

公开(公告)号：US20110138615A1

公开(公告)日：2011-06-16

申请号：US12753697

申请日：2010-04-02

申请人： Keung Jin Sohn ,  Chang Gun Oh ,  Tae Eun Chang

发明人： Keung Jin Sohn ,  Chang Gun Oh ,  Tae Eun Chang

IPC分类号： H05K3/00 ,  B23P17/04 ,  B23P19/00

CPC分类号： H05K3/0097 ,  H05K3/4682 ,  H05K2201/0215 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/104 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53265

摘要： Disclosed herein is a carrier for manufacturing a printed circuit board, including: a magnetic sheet; and a metal layer attached to at least one side of the magnetic sheet by magnetic properties of the magnetic sheet. The carrier is advantageous in that its structure can be simplified without performing a vacuum or releasing process at the time of the attachment and separation of the carrier, thus reducing process cost and process time and maintaining the size of a printed circuit board.

摘要翻译： 本文公开了一种用于制造印刷电路板的载体，包括：磁性片; 以及通过磁性片的磁性能而附着在磁性片的至少一侧的金属层。 载体的优点在于，可以简化其结构，而不会在载体的附着和分离时执行真空或释放过程，从而降低工艺成本和加工时间并保持印刷电路板的尺寸。

公开(公告)号：US08415200B2

公开(公告)日：2013-04-09

申请号：US13007444

申请日：2011-01-14

申请人： Mi Sun Hwang ,  Keung Jin Sohn ,  Eung Suek Lee ,  Myung Sam Kang

发明人： Mi Sun Hwang ,  Keung Jin Sohn ,  Eung Suek Lee ,  Myung Sam Kang

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2203/0384 ,  H01L2924/00015 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.

摘要翻译： 本发明公开了一种半导体封装件的制造方法，该半导体封装件使用基片120，其中第一金属层113，阻挡层115和第二金属层117依次以两个表面层叠在第一金属层113，阻挡层115和第二金属层117上， 同时通过单片工艺制造两个印刷电路板，从而可以提高制造效率; 通过焊料凸块250将半导体芯片300电连接到印刷电路板，从而可以实现高密度封装基板; 并且形成金属柱140而不是层间电路连接所需的通孔，从而可以降低通孔的加工/电镀所需的成本。

公开(公告)号：US08156635B2

公开(公告)日：2012-04-17

申请号：US12720567

申请日：2010-03-09

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

IPC分类号： B23P19/00

CPC分类号： H05K3/0097 ,  B32B15/20 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/047 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/5313 ,  Y10T428/12493 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

摘要翻译： 本文公开了一种用于制造衬底的载体，包括：绝缘层，其包括在其一侧或两侧形成的第一金属层; 形成在所述第一金属层的一侧上的第二金属层; 以及形成在所述第二金属层的一侧上的第三金属层，其中所述第二金属层具有比所述第一金属层或所述第三金属层低的熔点。 载体的优点在于可以通过加热将载置层与载体分离，从而不需要布线过程，结果是当构建层与载体分离时，基底的尺寸不变化 从而重新使用载体并保持基板和制造设备之间的兼容性。