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公开(公告)号：US07649314B2
公开(公告)日：2010-01-19
申请号：US11371521
申请日：2006-03-08
IPC分类号： H01J17/49
CPC分类号： H01J11/12 , H01J11/36 , H01J11/54 , H01J2211/365 , H01J2211/368
摘要： A plasma display panel reduces a resonance space between a frit and dummy partition walls so as to suppress noise and smoothly supply and exhaust a discharge gas. The plasma display panel includes a front substrate and a rear substrate that face each other, address electrodes and display electrodes that are spaced apart from each other and each extend along directions intersecting each other between the front substrate and the rear substrate, and partition walls that form a display region while partitioning a plurality of discharge cells and form a non-display region along a periphery of the display region between the front substrate and the rear substrate. The non-display region includes a first dummy area in which dummy cells are partitioned by dummy partition walls extending from partition walls disposed in the display region, and a second dummy area in which dummy cells are partitioned by dummy partition walls spaced apart from the first dummy area.
摘要翻译： 等离子体显示面板减少玻璃料和虚拟隔壁之间的共振空间，以便抑制噪声并平稳地供应和排出放电气体。 等离子体显示面板包括彼此面对的前基板和后基板，地址电极和显示电极，它们彼此间隔开并且各自沿着前基板和后基板之间相交的方向延伸，分隔壁 在分隔多个放电单元的同时形成显示区域，并且沿着前基板和后基板之间的显示区域的周边形成非显示区域。 非显示区域包括第一虚拟区域，虚拟单元被设置在显示区域中的分隔壁延伸的虚拟分隔壁分隔开，虚拟单元被虚拟分隔壁与第一虚拟区隔开， 虚拟区域。
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公开(公告)号：US20060232517A1
公开(公告)日：2006-10-19
申请号：US11371521
申请日：2006-03-08
IPC分类号： G09G3/28
CPC分类号： H01J11/12 , H01J11/36 , H01J11/54 , H01J2211/365 , H01J2211/368
摘要： A plasma display panel reduces a resonance space between a frit and dummy partition walls so as to suppress noise and smoothly supply and exhaust a discharge gas. The plasma display panel includes a front substrate and a rear substrate that face each other, address electrodes and display electrodes that are spaced apart from each other and each extend along directions intersecting each other between the front substrate and the rear substrate, and partition walls that form a display region while partitioning a plurality of discharge cells and form a non-display region along a periphery of the display region between the front substrate and the rear substrate. The non-display region includes a first dummy area in which dummy cells are partitioned by dummy partition walls extending from partition walls disposed in the display region, and a second dummy area in which dummy cells are partitioned by dummy partition walls spaced apart from the first dummy area.
摘要翻译： 等离子体显示面板减少玻璃料和虚拟隔壁之间的共振空间，以便抑制噪声并平稳地供应和排出放电气体。 等离子体显示面板包括彼此面对的前基板和后基板，地址电极和显示电极，它们彼此间隔开并且各自沿着前基板和后基板之间相交的方向延伸，分隔壁 在分隔多个放电单元的同时形成显示区域，并且沿着前基板和后基板之间的显示区域的周边形成非显示区域。 非显示区域包括第一虚拟区域，虚拟单元被设置在显示区域中的分隔壁延伸的虚拟分隔壁分隔开，虚拟单元被虚拟分隔壁与第一虚拟区隔开， 虚拟区域。
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公开(公告)号：US07501759B2
公开(公告)日：2009-03-10
申请号：US11298595
申请日：2005-12-12
申请人： Seong-Hoon Han , Young-Cheul Kang , Yoon-Soo Han , Jung-Hwan Park , Dong-Min Kim
发明人： Seong-Hoon Han , Young-Cheul Kang , Yoon-Soo Han , Jung-Hwan Park , Dong-Min Kim
IPC分类号： H01J17/49
CPC分类号： H01J11/12 , H01J11/36 , H01J2211/368
摘要： A plasma display panel including a front substrate, a rear substrate, a display area, a non-display area including a dummy region, and a plurality of rib members is provided. The dummy region includes a first barrier rib region extending along a first direction and including portions of at least some of the plurality of barrier rib members, a second barrier rib region extending along a second direction and including portions of at least some of the plurality of barrier rib members, and at least one sector region. The sector region includes at least one sector barrier rib member extending along a direction other than the first direction and the second direction and connecting at least one portion of at least one of the barrier rib portions in the first barrier rib region to at least one of the barrier rib portions in the second barrier rib region.
摘要翻译： 提供了包括前基板，后基板，显示区域，包括虚拟区域的非显示区域和多个肋构件的等离子体显示面板。 虚拟区域包括沿着第一方向延伸并且包括多个隔壁构件中的至少一些的第一阻挡肋区域，第二阻挡肋区域沿着第二方向延伸并且包括多个阻挡肋构件中的至少一些的部分 隔离肋构件和至少一个扇区区域。 扇形区域包括至少一个沿第一方向和第二方向以外的方向延伸的扇形障壁构件，并且将第一隔壁区域中的至少一个障壁部分的至少一部分连接到第一隔壁区域中的至少一个 第二隔壁区域中的隔壁部分。
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公开(公告)号：US20060125396A1
公开(公告)日：2006-06-15
申请号：US11298595
申请日：2005-12-12
申请人： Seong-Hoon Han , Young-Cheul Kang , Yoon-Soo Han , Jung-Hwan Park , Dong-Min Kim
发明人： Seong-Hoon Han , Young-Cheul Kang , Yoon-Soo Han , Jung-Hwan Park , Dong-Min Kim
IPC分类号： H01J17/49
CPC分类号： H01J11/12 , H01J11/36 , H01J2211/368
摘要： A plasma display panel including a front substrate, a rear substrate, a display area, a non-display area including a dummy region, and a plurality of rib members is provided. The dummy region includes a first barrier rib region extending along a first direction and including portions of at least some of the plurality of barrier rib members, a second barrier rib region extending along a second direction and including portions of at least some of the plurality of barrier rib members, and at least one sector region. The sector region includes at least one sector barrier rib member extending along a direction other than the first direction and the second direction and connecting at least one portion of at least one of the barrier rib portions in the first barrier rib region to at least one of the barrier rib portions in the second barrier rib region.
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公开(公告)号：US08690865B2
公开(公告)日：2014-04-08
申请号：US11597969
申请日：2005-05-31
CPC分类号： A61K9/0004 , A61B5/14514 , A61B18/082 , A61B18/10 , A61B2018/00005 , A61B2018/00613 , A61K9/7023 , A61K41/0047 , A61M37/0015 , A61M37/0092 , A61M2037/0007 , A61M2037/0046 , A61N1/0412 , A61N1/0476 , A61N1/0492 , A61N1/327
摘要： The present invention comprises methods and devices for thermal treatment of a barrier to increase the permeability of the barrier. One form of increasing the permeability of the barrier comprises forming micropores which may be used for administration of active agents across the barrier, or may be used for sampling or collecting fluids, or may be used for detecting, measuring or determining analytes, or may be used for monitoring of physiological or other conditions. Devices of the present invention may comprise microheaters that are activated by inductive or ohmic heating power supply components.
摘要翻译： 本发明包括用于热处理屏障以增加屏障的渗透性的方法和装置。 增加屏障渗透性的一种形式包括形成微孔，该微孔可用于通过阻挡层施用活性剂，或可用于取样或收集流体，或可用于检测，测量或确定分析物，或者可以是 用于监测生理或其他条件。 本发明的装置可以包括由电感或欧姆加热电源部件激活的微热电。
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公开(公告)号：US08450618B2
公开(公告)日：2013-05-28
申请号：US13137656
申请日：2011-08-31
申请人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
发明人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
CPC分类号： H05K1/0366 , C08J5/046 , H05K2201/0116 , H05K2201/0129 , H05K2201/0141 , H05K2201/0293 , Y10T29/49126 , Y10T29/49156
摘要： A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.
摘要翻译： 印刷电路板包括： 一种热塑性增强材料，其具有通过热塑性聚合物粘合剂固定并具有形成在其中的孔的纤维; 热塑性树脂层，其具有浸渍有热塑性树脂的热塑性增强材料; 以及形成在热塑性树脂层上的电路图案，其中，热塑性增强材料和热塑性树脂层的厚度比（热塑性增强材料的厚度÷热塑性树脂层的厚度）为0.9以上。
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7.发明授权Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method 失效制造具有第一板的半导体封装的方法，与第一板的两侧电连接的第二板以及通过倒装芯片方法连接到第一板的至少一个部件公开(公告)号：US08174128B2
公开(公告)日：2012-05-08
申请号：US12805292
申请日：2010-07-22
申请人： Nobuyuki Ikeguchi , Keungjin Sohn , JoonSik Shin , Jung-Hwan Park
发明人： Nobuyuki Ikeguchi , Keungjin Sohn , JoonSik Shin , Jung-Hwan Park
CPC分类号： H05K1/144 , H01L23/13 , H01L23/145 , H01L23/5385 , H01L2224/16 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H05K1/0366 , H05K1/056 , H05K1/182 , H05K3/4608 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674
摘要： A method of manufacturing a semiconductor package that includes: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.
摘要翻译： 一种制造半导体封装的方法，包括：形成第一板; 在其中形成有至少一个空腔的第二板; 将第二板连接到第一板的两侧，使得第二板与第一板电连接; 以及通过将所述部件嵌入所述空腔中，通过倒装芯片方法将至少一个部件与所述第一板连接。 该方法可以防止对半导体芯片的损坏并降低制造成本，同时连接材料还可以减轻应力，防止板和半导体芯片中的开裂，同时防止诸如弯曲和翘曲的缺陷。 也可以避免温度变化引起的缺陷。 此外，不需要在半导体芯片与印刷电路板连接的部分中使用底部填充，这允许更容易的返工和降低成本。
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公开(公告)号：US20120045901A1
公开(公告)日：2012-02-23
申请号：US13212349
申请日：2011-08-18
申请人： JONG-HYUK KIM , Keon-Soo Kim , Kwang-Shik Shin , Hyun-Chul Back , Seong-Soon Cho , Young-Bae Yoon , Jung-Hwan Park
发明人： JONG-HYUK KIM , Keon-Soo Kim , Kwang-Shik Shin , Hyun-Chul Back , Seong-Soon Cho , Young-Bae Yoon , Jung-Hwan Park
IPC分类号： H01L21/311
CPC分类号： H01L21/31144 , H01L21/0337 , H01L21/0338 , H01L21/3086 , H01L21/3088 , H01L21/76816
摘要： In a method of forming a pattern structure, a cut-off portion of the node-separated line of a semiconductor device is formed by a double patterning process by using a connection portion of the sacrificial mask pattern and the mask pattern to thereby improve alignment margin. The alignment margin between the mask pattern and the sacrificial mask pattern is increased to an amount of the length of the connection portion of the sacrificial mask pattern. The lines adjacent to the node-separated line include a protrusion portion protruding toward the cut-off portion of the separated line.
摘要翻译： 在形成图案结构的方法中，通过使用牺牲掩模图案和掩模图案的连接部分的双重图案化工艺来形成半导体器件的节点分离线的截止部分，从而改善对准边缘 。 掩模图案和牺牲掩模图案之间的对准边缘增加到牺牲掩模图案的连接部分的长度的量。 与节点分离线相邻的线包括向分离线的截止部分突出的突出部分。
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公开(公告)号：US20120012379A1
公开(公告)日：2012-01-19
申请号：US13200355
申请日：2011-09-23
申请人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
发明人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
IPC分类号： H05K1/11
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/281 , H05K3/4602 , H05K3/4647 , H05K3/4658 , H05K3/4682 , H05K2201/09481 , H05K2203/0156 , H05K2203/066 , H05K2203/1189 , Y10T29/49124
摘要： A printed circuit board including: an insulation layer; a first pattern buried in one surface of the insulation layer; a first resin layer laminated on one surface of the insulation layer to cover the first pattern; a second pattern buried in the other surface of the insulation layer; a via electrically connecting the first pattern with the second pattern; and a second resin layer laminated on the other surface of the insulation layer to cover the second pattern.
摘要翻译： 一种印刷电路板，包括：绝缘层; 绝缘层的一个表面中的第一图案; 层叠在所述绝缘层的一个表面上以覆盖所述第一图案的第一树脂层; 掩埋在所述绝缘层的另一个表面中的第二图案; 通孔，电连接第一图案与第二图案; 以及层叠在所述绝缘层的另一表面上以覆盖所述第二图案的第二树脂层。
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公开(公告)号：US20110315437A1
公开(公告)日：2011-12-29
申请号：US13137656
申请日：2011-08-31
申请人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
发明人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
IPC分类号： H05K1/00
CPC分类号： H05K1/0366 , C08J5/046 , H05K2201/0116 , H05K2201/0129 , H05K2201/0141 , H05K2201/0293 , Y10T29/49126 , Y10T29/49156
摘要： A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.
摘要翻译： 印刷电路板包括： 一种热塑性增强材料，其具有通过热塑性聚合物粘合剂固定并具有形成在其中的孔的纤维; 热塑性树脂层，其具有浸渍有热塑性树脂的热塑性增强材料; 以及形成在热塑性树脂层上的电路图案，其中热塑性增强材料和热塑性树脂层具有0.9或更高的厚度比（热塑性增强材料的厚度÷热塑性树脂层的厚度）。
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