利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

59 条记录 (耗时 0.021 秒)

    Method of manufacturing semiconductor package
    2.
    发明申请
    Method of manufacturing semiconductor package 失效
    制造半导体封装的方法

    公开(公告)号：US20100291737A1

    公开(公告)日：2010-11-18

    申请号：US12805292

    申请日：2010-07-22

    申请人： Nobuyuki Ikeguchi ,  Keungjin Sohn ,  JoonSik Shin ,  Jung-Hwan Park

    发明人： Nobuyuki Ikeguchi ,  Keungjin Sohn ,  JoonSik Shin ,  Jung-Hwan Park

    IPC分类号： H01L21/60

    CPC分类号： H05K1/144 ,  H01L23/13 ,  H01L23/145 ,  H01L23/5385 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/182 ,  H05K3/4608 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10674

    摘要： A method of manufacturing a semiconductor package that includes: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.

    摘要翻译： 一种制造半导体封装的方法，包括：形成第一板; 在其中形成有至少一个空腔的第二板; 将第二板连接到第一板的两侧，使得第二板与第一板电连接; 以及通过将所述部件嵌入所述空腔中，通过倒装芯片方法将至少一个部件与所述第一板连接。 该方法可以防止对半导体芯片的损坏并降低制造成本，同时连接材料还可以减轻应力，防止板和半导体芯片中的开裂，同时​​防止诸如弯曲和翘曲的缺陷。 也可以避免温度变化引起的缺陷。 此外，不需要在半导体芯片与印刷电路板连接的部分中使用底部填充，这允许更容易的返工和降低成本。

    Method of manufacturing semiconductor package and semiconductor plastic package using the same
    3.
    发明授权
    Method of manufacturing semiconductor package and semiconductor plastic package using the same 有权
    使用其制造半导体封装和半导体塑料封装的方法

    公开(公告)号：US08030752B2

    公开(公告)日：2011-10-04

    申请号：US12213796

    申请日：2008-06-24

    申请人： Nobuyuki Ikeguchi ,  Keungjin Sohn ,  JoonSik Shin ,  Jung-Hwan Park

    发明人： Nobuyuki Ikeguchi ,  Keungjin Sohn ,  JoonSik Shin ,  Jung-Hwan Park

    IPC分类号： H01L23/04 ,  H01L23/12

    CPC分类号： H05K1/144 ,  H01L23/13 ,  H01L23/145 ,  H01L23/5385 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/182 ,  H05K3/4608 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10674

    摘要： A method of manufacturing a semiconductor package may include: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.

    摘要翻译： 制造半导体封装的方法可以包括：形成第一板; 在其中形成有至少一个空腔的第二板; 将第二板连接到第一板的两侧，使得第二板与第一板电连接; 以及通过将所述部件嵌入所述空腔中，通过倒装芯片方法将至少一个部件与所述第一板连接。 该方法可以防止对半导体芯片的损坏并降低制造成本，同时连接材料还可以减轻应力，防止板和半导体芯片中的开裂，同时​​防止诸如弯曲和翘曲的缺陷。 也可以避免温度变化引起的缺陷。 此外，不需要在半导体芯片与印刷电路板连接的部分中使用底部填充，这允许更容易的返工和降低成本。

    Method of manufacturing semiconductor package and semiconductor plastic package using the same
    4.
    发明申请
    Method of manufacturing semiconductor package and semiconductor plastic package using the same 有权
    使用其制造半导体封装和半导体塑料封装的方法

    公开(公告)号：US20090152742A1

    公开(公告)日：2009-06-18

    申请号：US12213796

    申请日：2008-06-24

    申请人： Nobuyuki Ikeguchi ,  Keungjin Sohn ,  JoonSik Shin ,  Jung-Hwan Park

    发明人： Nobuyuki Ikeguchi ,  Keungjin Sohn ,  JoonSik Shin ,  Jung-Hwan Park

    IPC分类号： H01L23/52 ,  H01L21/00

    CPC分类号： H05K1/144 ,  H01L23/13 ,  H01L23/145 ,  H01L23/5385 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/182 ,  H05K3/4608 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10674

    摘要： A method of manufacturing a semiconductor package may include: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically connected with the first board; and connecting at least one component with the first board by a flip chip method by embedding the component in the cavity. The method can prevent damage to the semiconductor chips and lower manufacturing costs, while the connection material may also mitigate stresses, to prevent cracking in the boards and semiconductor chips, while preventing defects such as bending and warpage. Defects caused by temperature changes may also be avoided. Furthermore, it is not necessary to use an underfill in the portions where the semiconductor chips are connected with the printed circuit board, which allows for easier reworking and lower costs.

    摘要翻译： 制造半导体封装的方法可以包括：形成第一板; 在其中形成有至少一个空腔的第二板; 将第二板连接到第一板的两侧，使得第二板与第一板电连接; 以及通过将所述部件嵌入所述空腔中，通过倒装芯片方法将至少一个部件与所述第一板连接。 该方法可以防止对半导体芯片的损坏并降低制造成本，同时连接材料还可以减轻应力，防止板和半导体芯片中的开裂，同时​​防止诸如弯曲和翘曲的缺陷。 也可以避免温度变化引起的缺陷。 此外，不需要在半导体芯片与印刷电路板连接的部分中使用底部填充，这允许更容易的返工和降低成本。