METHOD FOR THE REDUCTION OF GRAPHENE FILM THICKNESS AND THE REMOVAL AND TRANSFER OF EPITAXIAL GRAPHENE FILMS FROM SiC SUBSTRATES
    3.
    发明申请
    METHOD FOR THE REDUCTION OF GRAPHENE FILM THICKNESS AND THE REMOVAL AND TRANSFER OF EPITAXIAL GRAPHENE FILMS FROM SiC SUBSTRATES 有权
    用于减少石墨膜厚度的方法以及从SiC衬底去除和转移外延石墨膜

    公开(公告)号:US20110048625A1

    公开(公告)日:2011-03-03

    申请号:US12855692

    申请日:2010-08-12

    IPC分类号: B44C1/10

    摘要: A method for reducing graphene film thickness on a donor substrate and transferring graphene films from a donor substrate to a handle substrate includes applying a bonding material to the graphene on the donor substrate, releasing the bonding material from the donor substrate thereby leaving graphene on the bonding material, applying the bonding material with graphene onto the handle substrate, and releasing the bonding material from the handle substrate thereby leaving the graphene on the handle substrate. The donor substrate may comprise SiC, metal foil or other graphene growth substrate, and the handle substrate may comprise a semiconductor or insulator crystal, semiconductor device, epitaxial layer, flexible substrate, metal film, or organic device.

    摘要翻译: 一种用于降低施主衬底上的石墨烯膜厚度并将石墨烯膜从施主衬底转移到处理衬底的方法包括将施焊材料施加在施主衬底上的石墨烯上,从施主衬底上释放粘结材料,从而在结合物上留下石墨烯 材料,将具有石墨烯的接合材料施加到手柄基板上,以及从手柄基板释放接合材料,从而将石墨烯留在手柄基板上。 施主衬底可以包括SiC,金属箔或其它石墨烯生长衬底,并且手柄衬底可以包括半导体或绝缘体晶体,半导体器件,外延层,柔性衬底,金属膜或有机器件。

    Method for the reduction of graphene film thickness and the removal and transfer of epitaxial graphene films from SiC substrates
    4.
    发明授权
    Method for the reduction of graphene film thickness and the removal and transfer of epitaxial graphene films from SiC substrates 有权
    用于降低石墨烯膜厚度以及从SiC衬底去除和转移外延石墨烯膜的方法

    公开(公告)号:US08753468B2

    公开(公告)日:2014-06-17

    申请号:US12855692

    申请日:2010-08-12

    摘要: A method for reducing graphene film thickness on a donor substrate and transferring graphene films from a donor substrate to a handle substrate includes applying a bonding material to the graphene on the donor substrate, releasing the bonding material from the donor substrate thereby leaving graphene on the bonding material, applying the bonding material with graphene onto the handle substrate, and releasing the bonding material from the handle substrate thereby leaving the graphene on the handle substrate. The donor substrate may comprise SiC, metal foil or other graphene growth substrate, and the handle substrate may comprise a semiconductor or insulator crystal, semiconductor device, epitaxial layer, flexible substrate, metal film, or organic device.

    摘要翻译: 一种用于降低施主衬底上的石墨烯膜厚度并将石墨烯膜从施主衬底转移到处理衬底的方法包括将施焊材料施加在施主衬底上的石墨烯上,从施主衬底上释放粘结材料,从而在结合物上留下石墨烯 材料,将具有石墨烯的接合材料施加到手柄基板上,以及从手柄基板释放接合材料,从而将石墨烯留在手柄基板上。 施主衬底可以包括SiC,金属箔或其它石墨烯生长衬底,并且手柄衬底可以包括半导体或绝缘体晶体,半导体器件,外延层,柔性衬底,金属膜或有机器件。