公开(公告)号：US08072073B2

公开(公告)日：2011-12-06

申请号：US12210702

申请日：2008-09-15

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Masaya Kawano ,  Kouji Soejima

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Masaya Kawano ,  Kouji Soejima

IPC分类号： H01L29/40 ,  H01L21/44

CPC分类号： H01L23/5283 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/5329 ,  H01L24/05 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/29099 ,  H01L2924/00

摘要： A highly reliable semiconductor device in which connection reliability is assured at very small vias comprises: a semiconductor substrate; a first wiring structure placed on the semiconductor substrate and having one or more first wiring layers, one or more insulating layers and a first via; a second wiring structure placed on the first wiring structure and having one or more second wiring layers, one or more second insulating layers, a second via and a third via; and an external terminal provided on the second wiring structure. The second via, which is connected to the second wiring layer of the second wiring structure and to the external terminal, has a connection interface disposed at an end of the via that is on the side of the external terminal.

摘要翻译： 在非常小的通孔中确保连接可靠性的高度可靠的半导体器件包括：半导体衬底; 放置在半导体衬底上并具有一个或多个第一布线层，一个或多个绝缘层和第一通孔的第一布线结构; 放置在第一布线结构上并具有一个或多个第二布线层，一个或多个第二绝缘层，第二通孔和第三通孔的第二布线结构; 以及设置在第二布线结构上的外部端子。 连接到第二布线结构的第二布线层和外部端子的第二通孔具有布置在位于外部端子一侧的通孔的端部处的连接接口。

公开(公告)号：US08552570B2

公开(公告)日：2013-10-08

申请号：US12811733

申请日：2009-01-06

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Masaya Kawano ,  Kouji Soejima ,  Yoichiro Kurita

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Masaya Kawano ,  Kouji Soejima ,  Yoichiro Kurita

IPC分类号： H01L29/40

CPC分类号： H05K3/4647 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/113 ,  H05K3/108 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2203/0733 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In the wiring board, insulating layers and wiring layers are alternately laminated, and the wiring layers are electrically connected by the vias. The wiring board includes first terminals arranged in a first surface and embedded in an insulating layer, second terminals arranged in a second surface opposite to the first surface and embedded in an insulating layer, and lands arranged in an insulating layer and in contact with the first terminals. The vias electrically connect the lands and the wiring layers laminated alternately with the insulating layers. No connecting interface is formed at an end of each of the vias on the land side but a connecting interface is formed at an end of each of the vias on the wiring layer side.

摘要翻译： 在布线板中，绝缘层和布线层交替层叠，并且布线层通过通孔电连接。 布线基板包括布置在第一表面中并嵌入绝缘层中的第一端子，布置在与第一表面相对的第二表面中并嵌入绝缘层中的第二端子，以及布置在绝缘层中并与第一端子接触的焊盘 终端。 通孔将焊盘和与绝缘层交替层压的布线层电连接。 在接地侧的每个通孔的端部没有形成连接接口，但是在布线层侧的每个通孔的端部形成有连接接口。

公开(公告)号：US20100295191A1

公开(公告)日：2010-11-25

申请号：US12811733

申请日：2009-01-06

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Masaya Kawano ,  Kouji Soejima ,  Yoichiro Kurita

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Masaya Kawano ,  Kouji Soejima ,  Yoichiro Kurita

IPC分类号： H01L23/49 ,  H01L21/60 ,  H05K1/11 ,  H01R43/00

CPC分类号： H05K3/4647 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/113 ,  H05K3/108 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2203/0733 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In the wiring board, insulating layers and wiring layers are alternately laminated, and the wiring layers are electrically connected by the vias. The wiring board includes first terminals arranged in a first surface and embedded in an insulating layer, second terminals arranged in a second surface opposite to the first surface and embedded in an insulating layer, and lands arranged in an insulating layer and in contact with the first terminals. The vias electrically connect the lands and the wiring layers laminated alternately with the insulating layers. No connecting interface is formed at an end of each of the vias on the land side but a connecting interface is formed at an end of each of the vias on the wiring layer side.

摘要翻译： 在布线板中，绝缘层和布线层交替层叠，并且布线层通过通孔电连接。 布线基板包括布置在第一表面中并嵌入绝缘层中的第一端子，布置在与第一表面相对的第二表面中并嵌入绝缘层中的第二端子，以及布置在绝缘层中并与第一端子接触的焊盘 终端。 通孔将焊盘和与绝缘层交替层压的布线层电连接。 在接地侧的每个通孔的端部没有形成连接接口，但是在布线层侧的每个通孔的端部形成有连接接口。

公开(公告)号：US20090072404A1

公开(公告)日：2009-03-19

申请号：US12210702

申请日：2008-09-15

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Masaya Kawano ,  Kouji Soejima

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Masaya Kawano ,  Kouji Soejima

IPC分类号： H01L23/52 ,  H01L21/4763

CPC分类号： H01L23/5283 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/5329 ,  H01L24/05 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/29099 ,  H01L2924/00

摘要： A highly reliable semiconductor device in which connection reliability is assured at very small vias comprises: a semiconductor substrate; a first wiring structure placed on the semiconductor substrate and having one or more first wiring layers, one or more insulating layers and a first via; a second wiring structure placed on the first wiring structure and having one or more second wiring layers, one or more second insulating layers, a second via and a third via; and an external terminal provided on the second wiring structure. The second via, which is connected to the second wiring layer of the second wiring structure and to the external terminal, has a connection interface disposed at an end of the via that is on the side of the external terminal.

摘要翻译： 在非常小的通孔中确保连接可靠性的高度可靠的半导体器件包括：半导体衬底; 放置在半导体衬底上并具有一个或多个第一布线层，一个或多个绝缘层和第一通孔的第一布线结构; 放置在第一布线结构上并具有一个或多个第二布线层，一个或多个第二绝缘层，第二通孔和第三通孔的第二布线结构; 以及设置在第二布线结构上的外部端子。 连接到第二布线结构的第二布线层和外部端子的第二通孔具有布置在位于外部端子一侧的通孔的端部处的连接接口。

公开(公告)号：US20090001604A1

公开(公告)日：2009-01-01

申请号：US11817669

申请日：2006-03-01

申请人： Daisuke Tanaka ,  Shintaro Yamamichi ,  Hideya Murai ,  Tadanori Shimoto ,  Kaichirou Nakano ,  Katsumi Maeda ,  Katsumi Kikuchi ,  Yoichiro Kurita ,  Kouji Soejima

发明人： Daisuke Tanaka ,  Shintaro Yamamichi ,  Hideya Murai ,  Tadanori Shimoto ,  Kaichirou Nakano ,  Katsumi Maeda ,  Katsumi Kikuchi ,  Yoichiro Kurita ,  Kouji Soejima

IPC分类号： H01L23/485 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/00

摘要： An oxide layer and a metal layer composed of a gold- or platinum-group metal are formed in the stated order on a substrate. A wiring body having a wiring layer, insulating layer, via, and electrode is formed on the metal layer. A semiconductor element is then connected as a flip chip via solder balls on the wiring body electrode, and underfill is introduced between the semiconductor element and the wiring body. Subsequently, a sealing resin layer is formed so as to cover the semiconductor element and the surface of the wiring body on which the semiconductor element is mounted, thus producing a semiconductor package. A high-density, detailed, thin semiconductor package can thereby be realized.

摘要翻译： 在基板上按规定的顺序形成由金或铂族金属构成的氧化物层和金属层。 具有布线层，绝缘层，通孔和电极的布线体形成在金属层上。 然后，半导体元件作为倒装芯片通过布线体电极上的焊球连接，底部填充物被引入到半导体元件与布线体之间。 随后，形成密封树脂层，以覆盖半导体元件和安装有半导体元件的布线体的表面，从而制造半导体封装。 由此可以实现高密度，详细，薄的半导体封装。

公开(公告)号：US08030201B2

公开(公告)日：2011-10-04

申请号：US12635160

申请日：2009-12-10

申请人： Koji Soejima ,  Yoichiro Kurita ,  Masaya Kawano ,  Shintaro Yamamichi ,  Katsumi Kikuchi

发明人： Koji Soejima ,  Yoichiro Kurita ,  Masaya Kawano ,  Shintaro Yamamichi ,  Katsumi Kikuchi

IPC分类号： H01L21/44

CPC分类号： H01L21/563 ,  H01L21/6835 ,  H01L24/81 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first electronic circuit component and a second electronic circuit component are electrically connected to an electro-conductive member via a first solder and a second solder, respectively. The electro-conductive member is formed in a resin film. The electro-conductive member is configured as containing a second diffusion barrier metal film. The second diffusion barrier metal film prevents diffusion of the second solder. Between the electro-conductive member and the first solder, a first diffusion barrier metal film is provided. The first diffusion barrier metal film prevents diffusion of the first solder. On the first surface of the resin film and on the electro-conductive member, an adhesive metal film is formed so as to contact with the resin film and the electro-conductive member. The adhesive metal film has stronger adhesiveness to the resin film than either of those of the first solder and the first diffusion barrier metal film.

摘要翻译： 第一电子电路部件和第二电子电路部件分别经由第一焊料和第二焊料电连接到导电部件。 导电构件形成在树脂膜中。 导电构件被构造成包含第二扩散阻挡金属膜。 第二扩散阻挡金属膜防止第二焊料的扩散。 在导电构件和第一焊料之间设置有第一扩散阻挡金属膜。 第一扩散阻挡金属膜防止第一焊料的扩散。 在树脂膜的第一表面和导电部件上形成粘接金属膜，以与树脂膜和导电部件接触。 粘合金属膜比第一焊料和第一扩散阻挡金属膜中的任一种具有比树脂膜更强的粘附性。

公开(公告)号：US20090283895A1

公开(公告)日：2009-11-19

申请号：US12446899

申请日：2007-10-09

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/82

摘要： A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame.

摘要翻译： 一种半导体器件，包括具有穿透开口的金属框架; 设置在开口内的半导体芯片; 绝缘层，设置在金属框架的上表面上，使得绝缘层覆盖作为半导体芯片的电路形成表面的上表面; 互连层，其仅在金属框架的上表面侧设置，并且绝缘材料的介入并且电连接到半导体芯片的电路; 设置在所述半导体芯片的上表面上的通孔导体，以电连接半导体芯片的电路和互连层; 以及设置在金属框架的下表面上的树脂层。

公开(公告)号：US20080136020A1

公开(公告)日：2008-06-12

申请号：US11790155

申请日：2007-04-24

申请人： Koji Soejima ,  Yoichiro Kurita ,  Masaya Kawano ,  Shintaro Yamamichi ,  Katsumi Kikuchi

发明人： Koji Soejima ,  Yoichiro Kurita ,  Masaya Kawano ,  Shintaro Yamamichi ,  Katsumi Kikuchi

IPC分类号： H01L23/488 ,  H01L21/44

CPC分类号： H01L21/563 ,  H01L21/6835 ,  H01L24/81 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first electronic circuit component and a second electronic circuit component are electrically connected to an electro-conductive member via a first solder and a second solder, respectively. The electro-conductive member is formed in a resin film. The electro-conductive member is configured as containing a second diffusion barrier metal film. The second diffusion barrier metal film prevents diffusion of the second solder. Between the electro-conductive member and the first solder, a first diffusion barrier metal film is provided. The first diffusion barrier metal film prevents diffusion of the first solder. On the first surface of the resin film and on the electro-conductive member, an adhesive metal film is formed so as to contact with the resin film and the electro-conductive member. The adhesive metal film has stronger adhesiveness to the resin film than either of those of the first solder and the first diffusion barrier metal film.

摘要翻译： 第一电子电路部件和第二电子电路部件分别经由第一焊料和第二焊料电连接到导电部件。 导电构件形成在树脂膜中。 导电构件被构造成包含第二扩散阻挡金属膜。 第二扩散阻挡金属膜防止第二焊料的扩散。 在导电构件和第一焊料之间设置有第一扩散阻挡金属膜。 第一扩散阻挡金属膜防止第一焊料的扩散。 在树脂膜的第一表面和导电部件上形成粘接金属膜，以与树脂膜和导电部件接触。 粘合金属膜比第一焊料和第一扩散阻挡金属膜中的任一种具有比树脂膜更强的粘附性。

公开(公告)号：US08536691B2

公开(公告)日：2013-09-17

申请号：US12446899

申请日：2007-10-09

申请人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

发明人： Katsumi Kikuchi ,  Shintaro Yamamichi ,  Hideya Murai ,  Katsumi Maeda ,  Takuo Funaya ,  Kentaro Mori ,  Takehiko Maeda ,  Masaya Kawano ,  Yuuji Kayashima

IPC分类号： H01L23/02

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/82

摘要： A semiconductor device including a metal frame having a penetrating opening; a semiconductor chip provided in the opening; an insulating layer provided on the upper surface of the metal frame such that the insulating layer covers the upper surface, which is the circuit-formed surface of the semiconductor chip; an interconnect layer provided only on the upper-surface side of the metal frame with intervention of the insulating material and electrically connected to a circuit of the semiconductor chip; a via conductor provided on the upper surface of said semiconductor chip to electrically connect the circuit of the semiconductor chip and the interconnect layer; and a resin layer provided on the lower surface of the metal frame.

摘要翻译： 一种半导体器件，包括具有穿透开口的金属框架; 设置在开口内的半导体芯片; 绝缘层，设置在金属框架的上表面上，使得绝缘层覆盖作为半导体芯片的电路形成表面的上表面; 互连层，其仅在金属框架的上表面侧设置，并且绝缘材料的介入并且电连接到半导体芯片的电路; 设置在所述半导体芯片的上表面上的通孔导体，以电连接半导体芯片的电路和互连层; 以及设置在金属框架的下表面上的树脂层。

公开(公告)号：US07652375B2

公开(公告)日：2010-01-26

申请号：US11790155

申请日：2007-04-24

申请人： Koji Soejima ,  Yoichiro Kurita ,  Masaya Kawano ,  Shintaro Yamamichi ,  Katsumi Kikuchi

发明人： Koji Soejima ,  Yoichiro Kurita ,  Masaya Kawano ,  Shintaro Yamamichi ,  Katsumi Kikuchi

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L21/563 ,  H01L21/6835 ,  H01L24/81 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first electronic circuit component and a second electronic circuit component are electrically connected to an electro-conductive member via a first solder and a second solder, respectively. The electro-conductive member is formed in a resin film. The electro-conductive member is configured as containing a second diffusion barrier metal film. The second diffusion barrier metal film prevents diffusion of the second solder. Between the electro-conductive member and the first solder, a first diffusion barrier metal film is provided. The first diffusion barrier metal film prevents diffusion of the first solder. On the first surface of the resin film and on the electro-conductive member, an adhesive metal film is formed so as to contact with the resin film and the electro-conductive member. The adhesive metal film has stronger adhesiveness to the resin film than either of those of the first solder and the first diffusion barrier metal film.

摘要翻译： 第一电子电路部件和第二电子电路部件分别经由第一焊料和第二焊料电连接到导电部件。 导电构件形成在树脂膜中。 导电构件被构造成包含第二扩散阻挡金属膜。 第二扩散阻挡金属膜防止第二焊料的扩散。 在导电构件和第一焊料之间设置有第一扩散阻挡金属膜。 第一扩散阻挡金属膜防止第一焊料的扩散。 在树脂膜的第一表面和导电部件上形成粘接金属膜，以与树脂膜和导电部件接触。 粘合金属膜比第一焊料和第一扩散阻挡金属膜中的任一种具有比树脂膜更强的粘附性。