公开(公告)号：US5304512A

公开(公告)日：1994-04-19

申请号：US994888

申请日：1992-12-22

申请人： Katsuo Arai ,  Sumio Okada ,  Takashi Ooba ,  Kazuya Takahashi ,  Mayumi Kaneko

发明人： Katsuo Arai ,  Sumio Okada ,  Takashi Ooba ,  Kazuya Takahashi ,  Mayumi Kaneko

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： H01L21/56 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/50 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  Y10T29/49121

摘要： A chip 12 having an electric circuit and a plurality of leads 8 connected electrically with the chip 12 are molded in a resin-sealed package 46 by a molding material containing a main component of a resin, by introducing a molding compound sheet 20 into the cavities 33 of molds 31, 32 before the molds are clamped, by melting the molding compound sheet 20 in the cavities 33 into a liquid molding material 45 after the mold clamping action to pressure fill up the inside of the cavities 33, and by setting the liquid molding material 45 integrally.

摘要翻译： 具有电路的芯片12和与芯片12电连接的多个引线8通过包含树脂的主要成分的模制材料在树脂密封封装46中模制，通过将模塑复合片20引入到模腔 在模具被夹紧之前，通过在模具夹紧动作之后将空腔33中的模塑复合材料片20熔化成液体模制材料45以将压力填满空腔33的内部，并且通过将液体 一体成型材料45。

公开(公告)号：US5150193A

公开(公告)日：1992-09-22

申请号：US653244

申请日：1991-02-11

申请人： Toshihiro Yasuhara ,  Masachika Masuda ,  Gen Murakami ,  Kunihiko Nishi ,  Masanori Sakimoto ,  Ichio Shimizu ,  Akio Hoshi ,  Sumio Okada ,  Tooru Nagamine

发明人： Toshihiro Yasuhara ,  Masachika Masuda ,  Gen Murakami ,  Kunihiko Nishi ,  Masanori Sakimoto ,  Ichio Shimizu ,  Akio Hoshi ,  Sumio Okada ,  Tooru Nagamine

IPC分类号： H01L23/495

CPC分类号： H01L24/85 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/48824 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01205 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351

摘要： The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.

摘要翻译： 本发明的特征在于，在芯片焊盘或突片中设置大面积的贯通孔，防止树脂在气相成膜用高温焊接气氛中的表面封装树脂封装的背面开裂， 相回流等，由此提供了高可靠性的树脂模制表面封装IC。

公开(公告)号：US4920074A

公开(公告)日：1990-04-24

申请号：US160177

申请日：1988-02-25

申请人： Ichio Shimizu ,  Akio Hoshi ,  Sumio Okada ,  Soichiro Nakamura

发明人： Ichio Shimizu ,  Akio Hoshi ,  Sumio Okada ,  Soichiro Nakamura

IPC分类号： H01L21/48 ,  H01L23/495 ,  H05K3/34

CPC分类号： H01L24/85 ,  H01L21/4821 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L24/97 ,  H05K3/3426 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48799 ,  H01L2224/48824 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01205 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20753 ,  H01L2924/351 ,  H05K2201/10689 ,  H05K2201/1084 ,  H05K2201/10924 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49172

摘要： The present invention provides a surface mount Gull-Wing type resin-encapsulating package for encapsulating a semiconductor chip, wherein the cut face (outer tip end) of each outer lead is formed to have a smaller cross-sectional area than that of each outer lead, for improving the extension of solder to the cut face of that lead. Such relatively smaller cross-sectional area of the outer tip end of each outer lead reduces the exposed area of the lead material when disconnecting the leads from the frame in separating the device from the frame.

摘要翻译： 本发明提供了一种用于封装半导体芯片的表面贴装鸥翼型树脂封装封装，其中每个外部引线的切割面（外部末端）形成为具有比每个外部引线更小的横截面积 ，用于改善焊料对该引线的切割面的延伸。 当将装置与框架分离时，每个外引线的外尖端的相对较小的横截面面积减小了引线材料的暴露面积。