公开(公告)号：US20050026028A1

公开(公告)日：2005-02-03

申请号：US10891565

申请日：2004-07-15

申请人： Kazuo Ouchi ,  Hitoshi Ishizaka

发明人： Kazuo Ouchi ,  Hitoshi Ishizaka

IPC分类号： H01M8/02 ,  H01M8/10 ,  H01M8/24

CPC分类号： H01M8/0256 ,  H01M8/0206 ,  H01M8/0228 ,  H01M8/2418 ,  H01M8/242

摘要： The present invention provides, as a separator for fuel cell which is lightweight, can be easily made thin, and which has superior corrosion resistance and shape stability, a fuel cell 100 containing a separator for fuel cell 10, wherein a conductor pattern 2 is formed on one principal plane 1A of an insulation layer 1 to form a groove for a gas flow path 3 sectioned by the conductor pattern 2 on this principal plane, a conductor terminal 4 is formed on the other principal plane 1B of the insulation layer 1, and this conductor terminal 4 and the conductor pattern 2 are electrically connected by a via hole 5 penetrating the insulation layer 1, and a membrane electrode assembly (complex having an electrolyte membrane and an electrode (fuel electrode, oxygen electrode) laminated thereon) 14 having the separator for fuel cell disposed on both surfaces.

摘要翻译： 本发明提供一种轻质的燃料电池用隔板，能够容易地变薄，耐腐蚀性和形状稳定性优异的燃料电池100，其具有形成有导体图案2的燃料电池100 在绝缘层1的一个主平面1A上，在该主平面上形成由导体图案2分割的气体流路3的槽，在绝缘层1的另一主面1B上形成导体端子4， 该导体端子4和导体图案2通过穿过绝缘层1的通孔5电连接，并且膜电极组件（具有层压在其上的电解质膜和电极（燃料电极，氧电极）的复合体）14具有 用于燃料电池的分离器设置在两个表面上。

公开(公告)号：US07632599B2

公开(公告)日：2009-12-15

申请号：US10891565

申请日：2004-07-15

申请人： Kazuo Ouchi ,  Hitoshi Ishizaka

发明人： Kazuo Ouchi ,  Hitoshi Ishizaka

IPC分类号： H01M8/02 ,  H01M8/10 ,  H01M2/00 ,  H01M8/24

CPC分类号： H01M8/0256 ,  H01M8/0206 ,  H01M8/0228 ,  H01M8/2418 ,  H01M8/242

摘要： The present invention provides, as a separator for fuel cell which is lightweight, can be easily made thin, and which has superior corrosion resistance and shape stability, a fuel cell 100 containing a separator for fuel cell 10, wherein a conductor pattern 2 is formed on one principal plane 1A of an insulation layer 1 to form a groove for a gas flow path 3 sectioned by the conductor pattern 2 on this principal plane, a conductor terminal 4 is formed on the other principal plane 1B of the insulation layer 1, and this conductor terminal 4 and the conductor pattern 2 are electrically connected by a via hole 5 penetrating the insulation layer 1, and a membrane electrode assembly (complex having an electrolyte membrane and an electrode (fuel electrode, oxygen electrode) laminated thereon) 14 having the separator for fuel cell disposed on both surfaces.

摘要翻译： 本发明提供一种轻质的燃料电池用隔板，能够容易地变薄，耐腐蚀性和形状稳定性优异的燃料电池100，其具有形成有导体图案2的燃料电池100 在绝缘层1的一个主平面1A上，在该主平面上形成由导体图案2分割的气体流路3的槽，在绝缘层1的另一主面1B上形成导体端子4， 该导体端子4和导体图案2通过穿过绝缘层1的通孔5电连接，并且膜电极组件（具有层压在其上的电解质膜和电极（燃料电极，氧电极）的复合体）14具有 用于燃料电池的分离器设置在两个表面上。

公开(公告)号：US08697300B2

公开(公告)日：2014-04-15

申请号：US12935369

申请日：2009-03-18

申请人： Masakazu Sugimoto ,  Masaya Yano ,  Hitoshi Ishizaka

发明人： Masakazu Sugimoto ,  Masaya Yano ,  Hitoshi Ishizaka

IPC分类号： H01M8/18 ,  H01M8/06 ,  H01M8/24 ,  H01M2/38 ,  H01M2/40

CPC分类号： H01M8/2475 ,  C01B3/065 ,  C01B3/08 ,  C01B2203/0405 ,  C01B2203/0465 ,  C01B2203/066 ,  H01M8/04089 ,  H01M8/0606 ,  H01M8/065 ,  H01M8/241 ,  H01M8/242 ,  Y02E60/362 ,  Y02P70/56

摘要： A fuel cell of the present invention comprises a power generating cell (C), which has at least two surfaces, a fuel gas being supplied through one of the surfaces and oxygen being supplied through the other surface, thereby generating electric power, a cell holder (6) that holds the power generating cell (c) to face the one of the surfaces inward, whereby forming an inner space together with the power generating cell (C), and a fuel generating section (B) that is arranged in the inner space of the cell holder (6) and generates the fuel gas.

摘要翻译： 本发明的燃料电池包括具有至少两个表面的发电电池（C），通过一个表面供给的燃料气体和通过另一个表面供给的氧气，从而产生电力，电池座 （6），其保持所述发电单元（c）向内面对所述一个表面，由此与所述发电单元（C）一起形成内部空间;以及燃料生成部（B），其布置在所述内部 电池座（6）的空间并产生燃料气体。

公开(公告)号：US20090242506A1

公开(公告)日：2009-10-01

申请号：US12457183

申请日：2009-06-03

申请人： Kei Nakamura ,  Hitoshi Ishizaka

发明人： Kei Nakamura ,  Hitoshi Ishizaka

IPC分类号： H05K3/06

CPC分类号： H05K1/0269 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/056 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

摘要： A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

公开(公告)号：US07561434B2

公开(公告)日：2009-07-14

申请号：US11595984

申请日：2006-11-13

申请人： Kei Nakamura ,  Hitoshi Ishizaka

发明人： Kei Nakamura ,  Hitoshi Ishizaka

IPC分类号： H05K1/00 ,  H01L23/52

CPC分类号： H05K1/0269 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/544 ,  H01L24/86 ,  H01L2223/54473 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/056 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

摘要： A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

摘要翻译： 提供了一种布线电路板，其上形成有高可靠性导电图案并且以高精度安装电子部件，并且提供了制造布线电路板并将电子部件安装在其上的方法。 包括安装部分的绝缘层形成在入射角为45°的镜面光泽度为150至500％的金属支撑层上。 在绝缘层上形成导电图案。 通过反射型光学传感器检查导电图案的不良形状。 然后，通过蚀刻金属支撑层的与安装部分重叠的部分形成开口，使得通过蚀刻暴露的绝缘层的安装部分的雾度值为20-50％，由此获得TAB带载体 。 此后，电子部件通过反射型光学传感器与安装部对准，使得电子部件安装在安装部上。

公开(公告)号：US07358619B2

公开(公告)日：2008-04-15

申请号：US11467437

申请日：2006-08-25

申请人： Hitoshi Ishizaka

发明人： Hitoshi Ishizaka

IPC分类号： H01L23/544 ,  H01L23/58 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/0097 ,  G03F9/7076 ,  G03F9/7084 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/544 ,  H01L2924/0002 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/108 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/0152 ,  H05K2203/1545 ,  H05K2203/166 ,  H01L2924/00

摘要： A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides of each of the exposure regions, alignment marks and identification marks are formed. The alignment marks are used for alignment during the exposure. The identification marks are used for specifying positions of the respective exposure regions on the tape carrier.

摘要翻译： 用于TAB的带状带状载体包括多个安装部件。 在各个安装部分中，形成了电子部件的接合电极的布线图案。 每个曝光区域包括预定数量的安装部件。 在每个曝光区域的两侧形成对准标记和识别标记。 对准标记用于曝光期间的对准。 识别标记用于指定带状载体上各个曝光区域的位置。

公开(公告)号：US20070045790A1

公开(公告)日：2007-03-01

申请号：US11467437

申请日：2006-08-25

申请人： Hitoshi Ishizaka

发明人： Hitoshi Ishizaka

IPC分类号： H01L23/495

CPC分类号： H05K3/0097 ,  G03F9/7076 ,  G03F9/7084 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/544 ,  H01L2924/0002 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/108 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/0152 ,  H05K2203/1545 ,  H05K2203/166 ,  H01L2924/00

摘要： A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides of each of the exposure regions, alignment marks and identification marks are formed. The alignment marks are used for alignment during the exposure. The identification marks are used for specifying positions of the respective exposure regions on the tape carrier.

摘要翻译： 用于TAB的带状带状载体包括多个安装部件。 在各个安装部分中，形成了电子部件的接合电极的布线图案。 每个曝光区域包括预定数量的安装部件。 在每个曝光区域的两侧形成对准标记和识别标记。 对准标记用于曝光期间的对准。 识别标记用于指定带状载体上各个曝光区域的位置。

公开(公告)号：US06642478B2

公开(公告)日：2003-11-04

申请号：US10251820

申请日：2002-09-23

申请人： Kanji Nishida ,  Hitoshi Ishizaka ,  Atsushi Hino

发明人： Kanji Nishida ,  Hitoshi Ishizaka ,  Atsushi Hino

IPC分类号： B23K2638

CPC分类号： B23K26/0626 ,  B23K26/06 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/40 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427 ,  H05K2203/108

摘要： An ultraviolet beam with high energy density is applied for forming an opening in an electric conductor layer 1 in a flexible wiring board whereas an ultraviolet beam with low energy density is applied for forming an opening in an electrically insulating layer 2 in the flexible wiring board. As a result, excessive heat energy applied for forming a via hole can be reduced, so that the problems can be reduced. In this manner, high quality of the via hole and delicate and accurate processability due to use of the ultraviolet laser beam can be combined to achieve formation of fine patterns densely in the flexible wiring board.

公开(公告)号：US20100319151A1

公开(公告)日：2010-12-23

申请号：US12851797

申请日：2010-08-06

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： A47L25/00

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US20070108631A1

公开(公告)日：2007-05-17

申请号：US11595984

申请日：2006-11-13

申请人： Kei Nakamura ,  Hitoshi Ishizaka

发明人： Kei Nakamura ,  Hitoshi Ishizaka

IPC分类号： H01L23/52 ,  H01L21/44

CPC分类号： H05K1/0269 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/544 ,  H01L24/86 ,  H01L2223/54473 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/056 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

摘要： A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

摘要翻译： 提供了一种布线电路板，其具有形成在其上的高可靠性导电图案并且以高精度安装电子部件，并且提供了制造布线电路板并将电子部件安装在其上的方法。 包括安装部分的绝缘层形成在入射角为45°的镜面光泽度为150至500％的金属支撑层上。 在绝缘层上形成导电图案。 通过反射型光学传感器检查导电图案的不良形状。 然后，通过蚀刻金属支撑层的与安装部分重叠的部分形成开口，使得通过蚀刻暴露的绝缘层的安装部分的雾度值为20-50％，由此获得TAB带载体 。 此后，电子部件通过反射型光学传感器与安装部对准，使得电子部件安装在安装部上。