公开(公告)号：US06642478B2

公开(公告)日：2003-11-04

申请号：US10251820

申请日：2002-09-23

申请人： Kanji Nishida ,  Hitoshi Ishizaka ,  Atsushi Hino

发明人： Kanji Nishida ,  Hitoshi Ishizaka ,  Atsushi Hino

IPC分类号： B23K2638

CPC分类号： B23K26/0626 ,  B23K26/06 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/40 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/427 ,  H05K2203/108

摘要： An ultraviolet beam with high energy density is applied for forming an opening in an electric conductor layer 1 in a flexible wiring board whereas an ultraviolet beam with low energy density is applied for forming an opening in an electrically insulating layer 2 in the flexible wiring board. As a result, excessive heat energy applied for forming a via hole can be reduced, so that the problems can be reduced. In this manner, high quality of the via hole and delicate and accurate processability due to use of the ultraviolet laser beam can be combined to achieve formation of fine patterns densely in the flexible wiring board.

公开(公告)号：US06168910A

公开(公告)日：2001-01-02

申请号：US09334643

申请日：1999-06-17

申请人： Atsushi Hino ,  Hitoshi Ishizaka

发明人： Atsushi Hino ,  Hitoshi Ishizaka

IPC分类号： G03F726

CPC分类号： H05K3/0026 ,  B08B7/0042 ,  B23K26/066 ,  B23K26/067 ,  B23K26/0676 ,  H05K3/0035 ,  H05K2203/0557 ,  Y10S430/146 ,  Y10S438/94 ,  Y10S438/945

摘要： A method is disclosed for removing a decomposition residue and/or a processing residue, of a material of a resin layer, which is attached to the periphery and inside of holes formed in the resin layer of a printed board. The method provides shooting a laser beam having a wavelength for laser ablation at the holes to thereby remove the decomposition residue and/or the processing residue; reshaping the sectional shape perpendicular to the direction of advance of the laser beam by beam reshaping optics; and shooting the reshaped laser beam to shoot simultaneously all the holes formed in the resin layer and vicinity thereof, wherein the total irradiated area on the printed board is 200%-10,000% of the total sectional area of the holes formed in the printed board. Also disclosed is a method for producing a printed board having holes that provides for: forming holes in a resin layer of a printed board by laser processing and removing a decomposition residue and/or a processing residue, of a material of the resin layer, which is attached to the periphery and inside of the holes.

摘要翻译： 公开了一种用于除去附着在形成在印刷电路板的树脂层中的孔的周边和内部的树脂层的材料的分解残渣和/或加工残留物的方法。 该方法提供了在孔处拍摄具有用于激光消融的波长的激光束，从而去除分解残余物和/或加工残留物; 通过光束整形光学器件重新形成垂直于激光束前进方向的截面形状; 并拍摄重新设置的激光束同时拍摄树脂层及其附近形成的所有孔，其中印刷电路板上的总照射面积为形成在印刷电路板上的孔的总截面积的200％-10,000％。 还公开了一种具有孔的印刷电路板的制造方法，所述印刷电路板具有：通过激光加工在印刷电路板的树脂层上形成孔，除去树脂层的材料的分解残渣和/或加工残渣， 附着在孔的周边和内部。

公开(公告)号：US5691210A

公开(公告)日：1997-11-25

申请号：US728076

申请日：1996-10-09

申请人： Yoshihisa Mori ,  Atsushi Hino ,  Hitoshi Ishizaka

发明人： Yoshihisa Mori ,  Atsushi Hino ,  Hitoshi Ishizaka

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R1/06 ,  G01R1/073 ,  H01L21/66

CPC分类号： G01R1/07314 ,  G01R1/0483

摘要： A method for fabrication of a probe structure comprising a circuit substrate comprising a circuit pattern formed on one side or inside of an insulating substrate and a positioning member formed on either side of said insulating substrate, said positioning member being capable of positioning and retaining a test target at a testing position of the probe structure, and the circuit pattern and the positioning member being in a positional relationship which establishes a continuity between the circuit pattern and a bump contact, which method comprises determining, on the same side of the substrate on which the positioning member has been formed, the position of the bump contact according to the position of the positioning member as a reference position, and forming the bump contact capable of establishing continuity with the circuit pattern. According to the method of the present invention, a probe structure can be obtained which is capable of positioning bump contacts and test target highly accurately as compared to conventional methods. In addition, since conventional production method can be applied to the manufacture of positioning member and bump contacts, highly precise products can be produced economically. The circuit substrate of the present invention which comprises a positioning member can be beneficially used for the production of the probe structure of the present invention.

摘要翻译： 一种用于制造探针结构的方法，其包括电路基板，该电路基板包括形成在绝缘基板的一侧或内侧上的电路图案和形成在所述绝缘基板两侧的定位部件，所述定位部件能够定位和保持测试 目标在探针结构的测试位置，并且电路图案和定位构件处于建立电路图案和凸块接触之间的连续性的位置关系，该方法包括在衬底的同一侧上确定 已经形成了定位构件，根据定位构件的位置作为基准位置的凸起接触的位置，并且形成能够与电路图案建立连续性的凸点接触。 根据本发明的方法，与传统方法相比，可以获得能够高度准确地定位凸块接触和测试目标的探针结构。 此外，由于可以将传统的制造方法应用于定位构件和凸起接触的制造，因此可以经济地制造高精度的产品。 包括定位构件的本发明的电路基板可有利地用于制造本发明的探针结构。

公开(公告)号：US06373709B1

公开(公告)日：2002-04-16

申请号：US09556123

申请日：2000-04-20

申请人： Atsushi Hino ,  Hitoshi Ishizaka

发明人： Atsushi Hino ,  Hitoshi Ishizaka

IPC分类号： H05K100

CPC分类号： B82Y25/00 ,  B82Y10/00 ,  G11B5/3903 ,  G11B5/40 ,  G11B5/455 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/486 ,  G11B2005/3996 ,  H05K1/0256 ,  H05K1/0259 ,  H05K1/0268 ,  H05K1/0293 ,  H05K1/118 ,  H05K3/28 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09972 ,  H05K2203/175

摘要： A flexible wiring board that can bridge wires and also can prevent production of conductive foreign materials in use, to secure good performance of a magnetic head. The flexible wiring board for connecting therethrough a suspension substrate having mounted thereon a magnetic head of a hard disk drive and a control circuit substrate for actuating the magnetic head includes a short-circuit forming portion for forming a shorting portion for bridging wires to prevent electrostatic destruction of the magnetic head; and a cut for removing the shorting portion. When the flexible wiring board is cut along the cut, the shorting portion can be removed without producing conductive foreign material resulting from the cutting off of the shorting portion.

摘要翻译： 可以桥接电线的柔性布线板，也可以防止使用中导电异物的生产，以确保磁头的良好性能。 用于通过其安装有硬盘驱动器的磁头和用于致动磁头的控制电路基板的悬置基板的柔性布线板包括短路形成部分，用于形成用于桥接电线的短路部分以防止静电破坏 的磁头; 以及用于去除短路部的切口。 当沿着切口切割柔性布线板时，可以去除短路部分而不会由于短路部分的切断而产生导电异物。

公开(公告)号：US08697300B2

公开(公告)日：2014-04-15

申请号：US12935369

申请日：2009-03-18

申请人： Masakazu Sugimoto ,  Masaya Yano ,  Hitoshi Ishizaka

发明人： Masakazu Sugimoto ,  Masaya Yano ,  Hitoshi Ishizaka

IPC分类号： H01M8/18 ,  H01M8/06 ,  H01M8/24 ,  H01M2/38 ,  H01M2/40

CPC分类号： H01M8/2475 ,  C01B3/065 ,  C01B3/08 ,  C01B2203/0405 ,  C01B2203/0465 ,  C01B2203/066 ,  H01M8/04089 ,  H01M8/0606 ,  H01M8/065 ,  H01M8/241 ,  H01M8/242 ,  Y02E60/362 ,  Y02P70/56

摘要： A fuel cell of the present invention comprises a power generating cell (C), which has at least two surfaces, a fuel gas being supplied through one of the surfaces and oxygen being supplied through the other surface, thereby generating electric power, a cell holder (6) that holds the power generating cell (c) to face the one of the surfaces inward, whereby forming an inner space together with the power generating cell (C), and a fuel generating section (B) that is arranged in the inner space of the cell holder (6) and generates the fuel gas.

摘要翻译： 本发明的燃料电池包括具有至少两个表面的发电电池（C），通过一个表面供给的燃料气体和通过另一个表面供给的氧气，从而产生电力，电池座 （6），其保持所述发电单元（c）向内面对所述一个表面，由此与所述发电单元（C）一起形成内部空间;以及燃料生成部（B），其布置在所述内部 电池座（6）的空间并产生燃料气体。

公开(公告)号：US20090242506A1

公开(公告)日：2009-10-01

申请号：US12457183

申请日：2009-06-03

申请人： Kei Nakamura ,  Hitoshi Ishizaka

发明人： Kei Nakamura ,  Hitoshi Ishizaka

IPC分类号： H05K3/06

CPC分类号： H05K1/0269 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/056 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

摘要： A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

公开(公告)号：US07561434B2

公开(公告)日：2009-07-14

申请号：US11595984

申请日：2006-11-13

申请人： Kei Nakamura ,  Hitoshi Ishizaka

发明人： Kei Nakamura ,  Hitoshi Ishizaka

IPC分类号： H05K1/00 ,  H01L23/52

CPC分类号： H05K1/0269 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/544 ,  H01L24/86 ,  H01L2223/54473 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/056 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

摘要： A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.

摘要翻译： 提供了一种布线电路板，其上形成有高可靠性导电图案并且以高精度安装电子部件，并且提供了制造布线电路板并将电子部件安装在其上的方法。 包括安装部分的绝缘层形成在入射角为45°的镜面光泽度为150至500％的金属支撑层上。 在绝缘层上形成导电图案。 通过反射型光学传感器检查导电图案的不良形状。 然后，通过蚀刻金属支撑层的与安装部分重叠的部分形成开口，使得通过蚀刻暴露的绝缘层的安装部分的雾度值为20-50％，由此获得TAB带载体 。 此后，电子部件通过反射型光学传感器与安装部对准，使得电子部件安装在安装部上。

公开(公告)号：US07358619B2

公开(公告)日：2008-04-15

申请号：US11467437

申请日：2006-08-25

申请人： Hitoshi Ishizaka

发明人： Hitoshi Ishizaka

IPC分类号： H01L23/544 ,  H01L23/58 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/0097 ,  G03F9/7076 ,  G03F9/7084 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/544 ,  H01L2924/0002 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/108 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/0152 ,  H05K2203/1545 ,  H05K2203/166 ,  H01L2924/00

摘要： A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides of each of the exposure regions, alignment marks and identification marks are formed. The alignment marks are used for alignment during the exposure. The identification marks are used for specifying positions of the respective exposure regions on the tape carrier.

摘要翻译： 用于TAB的带状带状载体包括多个安装部件。 在各个安装部分中，形成了电子部件的接合电极的布线图案。 每个曝光区域包括预定数量的安装部件。 在每个曝光区域的两侧形成对准标记和识别标记。 对准标记用于曝光期间的对准。 识别标记用于指定带状载体上各个曝光区域的位置。

公开(公告)号：US20070045790A1

公开(公告)日：2007-03-01

申请号：US11467437

申请日：2006-08-25

申请人： Hitoshi Ishizaka

发明人： Hitoshi Ishizaka

IPC分类号： H01L23/495

CPC分类号： H05K3/0097 ,  G03F9/7076 ,  G03F9/7084 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/544 ,  H01L2924/0002 ,  H05K1/0266 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/108 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/0152 ,  H05K2203/1545 ,  H05K2203/166 ,  H01L2924/00

摘要： A striped tape carrier for TAB includes a plurality of mounting parts. In the respective mounting parts, wiring patterns to bond electrodes of electronic components are formed. Each of exposure regions includes a predetermined number of mounting parts. On both sides of each of the exposure regions, alignment marks and identification marks are formed. The alignment marks are used for alignment during the exposure. The identification marks are used for specifying positions of the respective exposure regions on the tape carrier.

摘要翻译： 用于TAB的带状带状载体包括多个安装部件。 在各个安装部分中，形成了电子部件的接合电极的布线图案。 每个曝光区域包括预定数量的安装部件。 在每个曝光区域的两侧形成对准标记和识别标记。 对准标记用于曝光期间的对准。 识别标记用于指定带状载体上各个曝光区域的位置。

公开(公告)号：US20050026028A1

公开(公告)日：2005-02-03

申请号：US10891565

申请日：2004-07-15

申请人： Kazuo Ouchi ,  Hitoshi Ishizaka

发明人： Kazuo Ouchi ,  Hitoshi Ishizaka

IPC分类号： H01M8/02 ,  H01M8/10 ,  H01M8/24

CPC分类号： H01M8/0256 ,  H01M8/0206 ,  H01M8/0228 ,  H01M8/2418 ,  H01M8/242

摘要： The present invention provides, as a separator for fuel cell which is lightweight, can be easily made thin, and which has superior corrosion resistance and shape stability, a fuel cell 100 containing a separator for fuel cell 10, wherein a conductor pattern 2 is formed on one principal plane 1A of an insulation layer 1 to form a groove for a gas flow path 3 sectioned by the conductor pattern 2 on this principal plane, a conductor terminal 4 is formed on the other principal plane 1B of the insulation layer 1, and this conductor terminal 4 and the conductor pattern 2 are electrically connected by a via hole 5 penetrating the insulation layer 1, and a membrane electrode assembly (complex having an electrolyte membrane and an electrode (fuel electrode, oxygen electrode) laminated thereon) 14 having the separator for fuel cell disposed on both surfaces.

摘要翻译： 本发明提供一种轻质的燃料电池用隔板，能够容易地变薄，耐腐蚀性和形状稳定性优异的燃料电池100，其具有形成有导体图案2的燃料电池100 在绝缘层1的一个主平面1A上，在该主平面上形成由导体图案2分割的气体流路3的槽，在绝缘层1的另一主面1B上形成导体端子4， 该导体端子4和导体图案2通过穿过绝缘层1的通孔5电连接，并且膜电极组件（具有层压在其上的电解质膜和电极（燃料电极，氧电极）的复合体）14具有 用于燃料电池的分离器设置在两个表面上。