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    Method for assembling integral type electronic component and integral type electronic component
    6.
    发明授权
    Method for assembling integral type electronic component and integral type electronic component 失效
    集成型电子元件和整体式电子元器件的组装方法

    公开(公告)号：US06825055B2

    公开(公告)日：2004-11-30

    申请号：US09940876

    申请日：2001-08-29

    申请人： Kazushi Higashi ,  Hiroyuki Otani ,  Norihito Tsukahara

    发明人： Kazushi Higashi ,  Hiroyuki Otani ,  Norihito Tsukahara

    IPC分类号： H01L2100

    CPC分类号： H01L25/50 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K1/145 ,  H05K7/1061 ,  H05K13/0482 ,  H01L2224/0401

    摘要： An integral type electronic component is formed of a first board and a second board by storing and holding electronic components to component storage parts of the first board and electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on the basis of an arrangement accuracy of the component storage parts, and the electronic components stored in the component storage parts are limited in motion. The electronic components can be arranged highly accurately and simply at low costs in a short time in comparison with the conventional art by being simply inserted to the component storage parts.

    摘要翻译： 整体式电子部件由第一基板和第二基板形成，通过将电子部件收容并保持在第一基板的部件收纳部上，将第二基板电连接到电子部件。 电子部件的配置精度基于部件存储部的配置精度来确定，并且存储在部件存储部中的电子部件的运动受到限制。 与传统技术相比，通过简单地插入到部件存储部件中，电子部件可以在短时间内以低成本高度精确和简单地布置。

    Multilayered circuit board forming method and multilayered circuit board
    8.
    发明授权
    Multilayered circuit board forming method and multilayered circuit board 失效
    多层电路板成型方法和多层电路板

    公开(公告)号：US06971167B2

    公开(公告)日：2005-12-06

    申请号：US10611868

    申请日：2003-07-03

    申请人： Kazuhiro Nishikawa ,  Norihito Tsukahara ,  Hiroyuki Otani

    发明人： Kazuhiro Nishikawa ,  Norihito Tsukahara ,  Hiroyuki Otani

    IPC分类号： H05K3/46 ,  H05K3/00 ,  H01K3/10

    CPC分类号： H05K3/0017 ,  H05K3/002 ,  H05K3/0041 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/0376 ,  H05K2203/0278 ,  H05K2203/0582 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A multilayered circuit board and a method of forming the multilayered circuit board are provided. In a first circuit forming process, a first circuit is formed on an insulating board with a conductor; in a circuit embedding process, the first circuit is embedded in the insulating board so as to have a predetermined surface flatness and a predetermined parallelism; in a masking process, a pilot hole for a via hole is masked at a part of a surface of the circuit; in an insulating layer forming process P5p, an insulating material is applied as a layer to the surface except that portion thereof covered by the mask; in an insulating material layer flattening process, the surface of the insulating material layer is flattened so as to have the predetermined surface flatness and the predetermined parallelism; and in a pilot hole forming process, the mask is removed.

    摘要翻译： 提供多层电路板和形成多层电路板的方法。 在第一电路形成工艺中，在具有导体的绝缘板上形成第一电路; 在电路嵌入处理中，第一电路被嵌入绝缘板中以具有预定的表面平坦度和预定的平行度; 在掩模处理中，用于通孔的导向孔在电路的表面的一部分被掩蔽; 在绝缘层形成工艺P 5 p中，除了被掩模覆盖的部分之外，绝缘材料作为层施加到表面; 在绝缘材料层平坦化处理中，绝缘材料层的表面被平坦化以具有预定的表面平坦度和预定的平行度; 并且在导向孔形成处理中，去除掩模。

    STORAGE MEDIUM WITH BUILT-IN ANTENNA
    9.
    发明申请
    STORAGE MEDIUM WITH BUILT-IN ANTENNA 失效
    存储天线与内置天线

    公开(公告)号：US20100052996A1

    公开(公告)日：2010-03-04

    申请号：US11993734

    申请日：2006-07-10

    申请人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

    发明人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

    IPC分类号： H01Q7/06 ,  H01Q1/24

    CPC分类号： H05K1/16 ,  G06K19/07732 ,  G06K19/07767 ,  H01Q1/2275 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/056 ,  H05K2201/10674

    摘要： A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

    摘要翻译： 具有内置天线的存储介质包括其上放置有半导体元件的电路板，夹持半导体元件和电路板的第一和第二磁性层以及设置在第一和第二磁性层上的第一和第二天线线圈。 第一和第二天线线圈并联连接在柔性片上。 第一和第二天线线圈分别在第一和第二磁性层的侧面折叠并电连接到半导体元件。

    Wiring board and method of manufacturing the same
    10.
    发明授权
    Wiring board and method of manufacturing the same 失效
    接线板及其制造方法

    公开(公告)号：US07381902B2

    公开(公告)日：2008-06-03

    申请号：US10951620

    申请日：2004-09-29

    申请人： Norihito Tsukahara ,  Kazuhiro Nishikawa

    发明人： Norihito Tsukahara ,  Kazuhiro Nishikawa

    IPC分类号： H05K1/09

    CPC分类号： H05K3/249 ,  H05K1/095 ,  H05K3/207 ,  H05K2201/035

    摘要： A wiring board comprises a patterned wiring formed of electrically conductive resin composed primarily of silver and embedded into a substrate in a manner that a surface thereof is exposed above the substrate, and a covering conductor formed primarily of carbon covering the surface of the patterned wiring. The wiring board of this structure is superior in resistance to moisture absorption and water, prevents silver migration attributable to the moisture, and reduces contact resistance in the connection between a terminal portion of the wiring board and an external apparatus.

    摘要翻译： 布线板包括由主要由银构成并以其表面暴露在基板上方的方式嵌入到基板中的导电树脂形成的图案布线，以及主要由覆盖图案化布线表面的碳形成的覆盖导体。 该结构的布线基板具有优异的耐吸湿性和防水性，防止由于水分引起的银迁移，并且降低了布线板的端子部分与外部设备之间的连接中的接触电阻。