公开(公告)号：US07071090B2

公开(公告)日：2006-07-04

申请号：US11073714

申请日：2005-03-08

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/44

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US06207549B1

公开(公告)日：2001-03-27

申请号：US08940981

申请日：1997-09-30

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L2144

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US06894387B2

公开(公告)日：2005-05-17

申请号：US09768246

申请日：2001-01-25

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US20050146029A1

公开(公告)日：2005-07-07

申请号：US11073714

申请日：2005-03-08

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44 ,  H01L23/52

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

公开(公告)号：US5686353A

公开(公告)日：1997-11-11

申请号：US576160

申请日：1995-12-21

申请人： Yoshihiko Yagi ,  Kazushi Higashi ,  Norihito Tsukahara ,  Koichi Kumagai ,  Takahiro Yonezawa

发明人： Yoshihiko Yagi ,  Kazushi Higashi ,  Norihito Tsukahara ,  Koichi Kumagai ,  Takahiro Yonezawa

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14

摘要： An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.

摘要翻译： 设置在半导体芯片（4）的表面上的电极端子（5）在平面图中具有正方形形状。 此外，设置在电极端子（5）上的突起（8）的突出顶部（8a）定向到电极端子（5）的角部（5a）。 因此，通过熔化通过毛细管（1）供给的金线（2）的下端部形成的金球（2a）与电极端子（5）接合，然后将毛细管（1）移动到 方形电极（5）的对角线方向。 因此，金线（2）的主要部分与金球（2a）分离，从而形成凸块（8）。

公开(公告)号：US06566165B1

公开(公告)日：2003-05-20

申请号：US09417307

申请日：1999-10-13

申请人： Hiroyuki Otani ,  Yoshihiko Yagi ,  Kenichi Yamamoto

发明人： Hiroyuki Otani ,  Yoshihiko Yagi ,  Kenichi Yamamoto

IPC分类号： H01L2144

CPC分类号： H01L24/16 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.

摘要翻译： 对应于半导体芯片上的非操作电极，在半导体芯片安装板上形成加强焊盘。 加强层和非操作电极彼此接合，从而提高半导体芯片和半导体芯片安装板之间的接合强度。

公开(公告)号：US06651320B1

公开(公告)日：2003-11-25

申请号：US09509693

申请日：2000-03-20

申请人： Yoshihiko Yagi ,  Hiroyuki Otani

发明人： Yoshihiko Yagi ,  Hiroyuki Otani

IPC分类号： H05K334

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/11 ,  H01L24/13 ,  H01L24/32 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/29007 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/3511 ,  H05K3/305 ,  H05K3/321 ,  H05K13/0469 ,  H05K2201/0125 ,  H05K2201/0187 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49171 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention provides a method for mounting a semiconductor element to a circuit board and a semiconductor device whereby connection reliability and connection strength in bonding of the semiconductor element and circuit board are enhanced and a connection resistance value is stabilized low. An insulating adhesive is applied to an opposite face of a circuit board. The circuit board is then connected with a semiconductor element by a conductive adhesive and the insulating adhesive which are interposed between an electrode on the circuit board and the projecting electrode and set in the same process. The circuit board and semiconductor element are connected by the insulating adhesive in addition to the conductive adhesive, so that connection reliability and connection strength are high and a connection resistance value is stabilized low.

摘要翻译： 本发明提供一种用于将半导体元件安装到电路板和半导体器件的方法，由此提高了半导体元件和电路板的接合的连接可靠性和连接强度，并且连接电阻值稳定在低。 将绝缘粘合剂施加到电路板的相对面上。 然后将电路板通过导电粘合剂和绝缘粘合剂与半导体元件连接，绝缘粘合剂介于电路板上的电极和突出电极之间，并以相同的工艺设置。 电路板和半导体元件除了导电粘合剂之外还通过绝缘粘合剂连接，使得连接可靠性和连接强度高，并且连接电阻值稳定在低。

公开(公告)号：US06787922B2

公开(公告)日：2004-09-07

申请号：US10361605

申请日：2003-02-11

申请人： Hiroyuki Otani ,  Yoshihiko Yagi ,  Kenichi Yamamoto

发明人： Hiroyuki Otani ,  Yoshihiko Yagi ,  Kenichi Yamamoto

IPC分类号： H01L2940

CPC分类号： H01L24/16 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.

摘要翻译： 在与半导体芯片上的非操作电极对应的半导体芯片安装板上形成有强化焊盘。 加强焊盘和非操作电极彼此接合，从而提高半导体芯片和半导体芯片安装板之间的接合强度。

公开(公告)号：US6061248A

公开(公告)日：2000-05-09

申请号：US897085

申请日：1997-07-18

申请人： Hiroyuki Otani ,  Yoshihiko Yagi ,  Kenichi Yamamoto

发明人： Hiroyuki Otani ,  Yoshihiko Yagi ,  Kenichi Yamamoto

IPC分类号： H05K3/34 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/498 ,  H05K1/18 ,  H05K7/02

CPC分类号： H01L24/16 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3511

摘要： A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby to improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.

摘要翻译： 在与半导体芯片上的非操作电极对应的半导体芯片安装板上形成有强化焊盘。 加强焊盘和非操作电极彼此接合，从而提高半导体芯片和半导体芯片安装板之间的接合强度。

公开(公告)号：US08575751B2

公开(公告)日：2013-11-05

申请号：US12522239

申请日：2008-03-04

申请人： Daisuke Sakurai ,  Yoshihiko Yagi

发明人： Daisuke Sakurai ,  Yoshihiko Yagi

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/12 ,  B33Y80/00 ,  G03F7/0037 ,  G03F7/0047 ,  H01L24/11 ,  H01L24/16 ,  H01L24/742 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11552 ,  H01L2224/11554 ,  H01L2224/11901 ,  H01L2224/13012 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13171 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  Y10T29/49213 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2224/13099 ,  H01L2924/00

摘要： A conductive bump formed on an electrode surface of an electronic component. This conductive bump is composed of a plurality of photosensitive resin layers having different conductive filler contents. Consequently, this conductive bump is able to realize conflicting functions, namely, improvement in adhesion strength with the electrode and reduction of contact resistance.

摘要翻译： 形成在电子部件的电极表面上的导电凸块。 该导电凸块由具有不同导电填料含量的多个感光性树脂层构成。 因此，该导电凸块能够实现冲突的功能，即提高与电极的粘合强度和降低接触电阻。