公开(公告)号：US5686353A

公开(公告)日：1997-11-11

申请号：US576160

申请日：1995-12-21

申请人： Yoshihiko Yagi ,  Kazushi Higashi ,  Norihito Tsukahara ,  Koichi Kumagai ,  Takahiro Yonezawa

发明人： Yoshihiko Yagi ,  Kazushi Higashi ,  Norihito Tsukahara ,  Koichi Kumagai ,  Takahiro Yonezawa

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14

摘要： An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.

摘要翻译： 设置在半导体芯片（4）的表面上的电极端子（5）在平面图中具有正方形形状。 此外，设置在电极端子（5）上的突起（8）的突出顶部（8a）定向到电极端子（5）的角部（5a）。 因此，通过熔化通过毛细管（1）供给的金线（2）的下端部形成的金球（2a）与电极端子（5）接合，然后将毛细管（1）移动到 方形电极（5）的对角线方向。 因此，金线（2）的主要部分与金球（2a）分离，从而形成凸块（8）。

公开(公告)号：US06207549B1

公开(公告)日：2001-03-27

申请号：US08940981

申请日：1997-09-30

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L2144

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US07071090B2

公开(公告)日：2006-07-04

申请号：US11073714

申请日：2005-03-08

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/44

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US06894387B2

公开(公告)日：2005-05-17

申请号：US09768246

申请日：2001-01-25

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

摘要翻译： 在IC电极上形成突起电极的方法包括以下步骤：通过引线接合装置在IC电极上形成球接合，向上移动接合毛细管，向上移动接合毛细管然后向下移动接合毛细管，将Au线接合到 球接合部分，并切割Au线。 通过将接合毛细管的下降位置预设为高于形成球形接合位置的位置，可防止Au线与球接合部分以外的球接合部分周围接触。

公开(公告)号：US20050146029A1

公开(公告)日：2005-07-07

申请号：US11073714

申请日：2005-03-08

申请人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

发明人： Kazushi Higashi ,  Norihito Tsukahara ,  Takahiro Yonezawa ,  Yoshihiko Yagi ,  Yoshifumi Kitayama ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44 ,  H01L23/52

CPC分类号： H01L24/78 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78303 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

公开(公告)号：US06332268B1

公开(公告)日：2001-12-25

申请号：US09254687

申请日：1999-03-16

申请人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

发明人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

IPC分类号： H05K330

CPC分类号： H01L21/67132 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

摘要： An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).

摘要翻译： IC芯片（2）可以在被保持在带状支撑构件（5）的同时被提供到预安装工艺，而不从带状支撑构件（5）取出。

公开(公告)号：US06825055B2

公开(公告)日：2004-11-30

申请号：US09940876

申请日：2001-08-29

申请人： Kazushi Higashi ,  Hiroyuki Otani ,  Norihito Tsukahara

发明人： Kazushi Higashi ,  Hiroyuki Otani ,  Norihito Tsukahara

IPC分类号： H01L2100

CPC分类号： H01L25/50 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K1/145 ,  H05K7/1061 ,  H05K13/0482 ,  H01L2224/0401

摘要： An integral type electronic component is formed of a first board and a second board by storing and holding electronic components to component storage parts of the first board and electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on the basis of an arrangement accuracy of the component storage parts, and the electronic components stored in the component storage parts are limited in motion. The electronic components can be arranged highly accurately and simply at low costs in a short time in comparison with the conventional art by being simply inserted to the component storage parts.

摘要翻译： 整体式电子部件由第一基板和第二基板形成，通过将电子部件收容并保持在第一基板的部件收纳部上，将第二基板电连接到电子部件。 电子部件的配置精度基于部件存储部的配置精度来确定，并且存储在部件存储部中的电子部件的运动受到限制。 与传统技术相比，通过简单地插入到部件存储部件中，电子部件可以在短时间内以低成本高度精确和简单地布置。

公开(公告)号：US20050001315A1

公开(公告)日：2005-01-06

申请号：US10902135

申请日：2004-07-30

申请人： Kazushi Higashi ,  Hiroyuki Otani ,  Norihito Tsukahara

发明人： Kazushi Higashi ,  Hiroyuki Otani ,  Norihito Tsukahara

IPC分类号： H05K3/32 ,  H01L21/98 ,  H01L25/16 ,  H01L33/30 ,  H01L33/34 ,  H01L33/62 ,  H05K1/14 ,  H05K1/18 ,  H05K7/10 ,  H05K13/04 ,  H01L23/48

CPC分类号： H01L25/50 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K1/145 ,  H05K7/1061 ,  H05K13/0482 ,  H01L2224/0401

摘要： An integral type electronic device is formed from a first board and a second board by storing and holding electronic components in component storage parts of the first board, and then electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on a basis of an arrangement accuracy of the component storage parts, and the electronic components stored and held in the component storage parts are limited in motion.

摘要翻译： 一体式电子设备由第一板和第二板通过在第一板的组件存储部分中存储和保持电子元件，然后将第二板电连接到电子元件而形成。 基于部件存储部件的配置精度来确定电子部件的布置精度，并且保持在部件收纳部中的电子部件的运动受到限制。

公开(公告)号：US06481616B2

公开(公告)日：2002-11-19

申请号：US09978872

申请日：2001-10-17

申请人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

发明人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

IPC分类号： B23K3102

CPC分类号： H01L21/68 ,  H01L21/321 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00

摘要： To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

摘要翻译： 为了消除电子零件的破损或接合不良，提高电子零件的可靠性，在凸块焊接装置中调节电子部件。 一种凸块接合装置，包括用于安装和加热电子部件的台架1和包括具有用于定位电子部件的侧面的可旋转调节板2的位置调节装置，具有用于与电子部件配合的侧面的板4 调节板和用于向调节板施加调节力以便将电子部件按压到板4的调节弹簧5。

公开(公告)号：US06328196B1

公开(公告)日：2001-12-11

申请号：US09202567

申请日：1998-12-17

申请人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

发明人： Makoto Imanishi ,  Akihiro Yamamoto ,  Hiroyuki Otani ,  Shinzo Eguchi ,  Takahiro Yonezawa ,  Kazushi Higashi ,  Koichi Yoshida ,  Kouji Hirotani

IPC分类号： B23Q900

CPC分类号： H01L21/68 ,  H01L21/321 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00

摘要： To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

摘要翻译： 为了消除电子零件的破损或接合不良，提高电子零件的可靠性，在凸块焊接装置中调节电子部件。 一种凸块接合装置，包括用于安装和加热电子部件的台架1和包括具有用于定位电子部件的侧面的可旋转调节板2的位置调节装置，具有用于与电子部件配合的侧面的板4 调节板和用于向调节板施加调节力以便将电子部件按压到板4的调节弹簧5。