Photoelectric conversion element and power generation system using the
same
    5.
    发明授权
    Photoelectric conversion element and power generation system using the same 失效
    光电转换元件和使用相同的发电系统

    公开(公告)号:US5429685A

    公开(公告)日:1995-07-04

    申请号:US150813

    申请日:1993-11-12

    摘要: The present invention provides a photovoltaic element in which the open-circuit voltage and the path length of holes are improved by preventing the recombination of photoexcited carriers.The p-i-n junction type photovoltaic element is composed of a p-type layer, an i-type layer of a laminated structure consisting of an i-type layer formed by RF plasma CVD on the p-type layer side and an i-type layer formed by microwave (.mu.W) CVD on the n-type layer side, or an i-type layer formed by microwave (.mu.W) plasma CVD on the p-type layer side and an i-type layer formed by RF plasma CVD on the n-type layer side, characterized in that the i-type layer formed by .mu.W plasma CVD is formed by a process in which a lower .mu.W energy and a higher RF energy than the .mu.W energy needed to decompose 100% of the source gas are simultaneously applied to a source gas containing Si and Ge at a pressure of 50 mTorr or less, such that the minimum value of the bandgap is shifted toward the p-type layer side, away from the center of the i-type layer, and the i-type layer formed by RF plasma CVD is formed 30 nm thick or less by using a source gas containing a silicon-containing gas at a deposition rate of 2 nm/sec or less.

    摘要翻译: 本发明提供一种光电元件,其中通过防止光激发载流子的复合,提高了开路电压和空穴的路径长度。 pin结型光电元件由p型层,由p型层侧的RF等离子体CVD形成的i型层构成的层叠结构的i型层和形成为i型层的i型层构成 通过在n型层侧的微波(μW)CVD或在p型层侧由微波(μW)等离子体CVD形成的i型层和通过RF等离子体CVD形成的i型层 n型层侧,其特征在于,通过以下步骤形成由μW等离子体CVD形成的i型层,其中相比于分解100%的源所需的μW能量较低的μW能量和较高的RF能量 在50mTorr以下的压力下将气体同时施加到含有Si和Ge的源气体,使得带隙的最小值朝着p型层侧偏离i型层的中心, 通过使用含有含硅气体的源气体,通过RF等离子体CVD形成的i型层形成为30nm以下 速度为2nm / sec以下。

    Photoelectrical conversion device and generating system using the same
    7.
    发明授权
    Photoelectrical conversion device and generating system using the same 失效
    光电转换装置及使用其的发电系统

    公开(公告)号:US5563425A

    公开(公告)日:1996-10-08

    申请号:US149749

    申请日:1993-11-10

    摘要: An object of the present invention is to provide a photoelectrical conversion device in which recombination of carriers excited by light is prevented and the open voltage and the carrier range of positive holes are improved and to provide a generating system using the photoelectrical conversion device. The photoelectrical conversion device includes a p-layer, an i-layer, and an n-layer, wherein the photoelectrical conversion device being formed by stacking the p-layer, the i-layer and the n-layer each of which is made of non-single-crystal silicon semiconductor, the i-layer contains germanium atoms, the band gap of the i-layer is smoothly changed in a direction of the thickness of the i-layer, the minimum value of the band gap is positioned adjacent to the p-layer from the central position of the i-layer and both of a valence control agent to serve as a donor and another valence control agent to serve as an acceptor are doped into the i-layer. Further, at least either of the p-layer or the n-layer is formed into a stacked structure consisting of a layer mainly composed of group III elements of the periodic table and/or group V elements of the same and a layer containing the valence control agent and mainly composed of silicon atoms.

    摘要翻译: 本发明的目的是提供一种光电转换装置,其中防止由光激发的载流子的复合,并且改善了空穴的开路电压和载流子范围,并提供了使用光电转换装置的发电系统。 所述光电转换装置包括p层,i层和n层,其中所述光电转换装置通过层叠p层,i层和n层而形成,所述p层,i层和n层由 非单晶硅半导体,i层含有锗原子,i层的带隙在i层的厚度方向上平滑地变化,带隙的最小值位于 i层的中心位置的p层和作为供体的价电子控制剂以及用作受体的另一价电子控制剂都掺杂到i层中。 此外,p层或n层中的至少任一层形成为由主要由周期表的III族元素和/或其V族元素组成的层和包含该价电子层的层 控制剂主要由硅原子组成。

    Method for repairing an electrically short-circuited semiconductor
device, and process for producing a semiconductor device utilizing said
method
    10.
    发明授权
    Method for repairing an electrically short-circuited semiconductor device, and process for producing a semiconductor device utilizing said method 失效
    用于修复电短路的半导体器件的方法,以及利用所述方法制造半导体器件的工艺

    公开(公告)号:US5281541A

    公开(公告)日:1994-01-25

    申请号:US755439

    申请日:1991-09-05

    摘要: A method for repairing a defective semiconductor device, the defective semiconductor device including a semiconductor thin film and a conductive thin film, disposed in the named order, on a conductive surface of a substrate, such that the conductive thin film and the conductive surface of the substrate are electrically short-circuited at a pinhole occurring in the semiconductor thin film to form an electrically short-circuited portion. The method includes the steps of applying desired a voltage through an electrode positioned above a surface of the defective semiconductor device, and moving the electrode along the surface of the defective semiconductor device while maintaining a distance between the electrode and the conductive thin film sufficient to allow a discharge to occur when the electrode is above the electrically short-circuited portion, such that the discharge modifies a region of the conductive thin film which is in electrical contact with the conductive surface of the substrate, to establish an electrically noncontacted state between the conductive thin film and the conductive surface of the substrate.

    摘要翻译: 一种用于修复有缺陷的半导体器件的方法,所述有缺陷的半导体器件包括半导体薄膜和导电薄膜,其以所述的顺序设置在衬底的导电表面上,使得导电薄膜和导电薄膜的导电表面 衬底在半导体薄膜中出现的针孔处电短路以形成电短路部分。 该方法包括以下步骤:通过位于缺陷半导体器件的表面上方的电极施加所需的电压,并且沿着有缺陷的半导体器件的表面移动电极,同时保持电极和导电薄膜之间的距离足以允许 当电极在电气短路部分之上时,发生放电,使得放电改变与衬底的导电表面电接触的导电薄膜的区域,以在导电之间建立电非接触状态 薄膜和基板的导电表面。