-
公开(公告)号：US20100230142A1
公开(公告)日：2010-09-16
申请号：US12739369
申请日：2008-10-23
申请人： Keita Bamba , Tadahiro Yokozawa , Hideaki Watanabe
发明人： Keita Bamba , Tadahiro Yokozawa , Hideaki Watanabe
CPC分类号： H05K3/0055 , H05K3/025 , H05K3/421 , H05K3/427 , H05K2203/025 , H05K2203/0361 , H05K2203/1383 , H05K2203/1388
摘要： Disclosed is a method for producing a printed wiring board having high dimensional stability with high productivity. The production method comprising the steps of: providing a metal laminate in which a metal layer having an inner metal layer portion and a protection layer portion is laminated on at least one side of an insulating resin layer in such a manner that the inner metal layer portion is arranged on the side of the insulating resin layer; forming a via hole on the metal layer and the insulating resin layer; performing blast processing after forming the via hole; and removing the protection layer portion after performing blast processing.
摘要翻译： 公开了一种生产高尺寸稳定性的印刷线路板的制造方法。 该制造方法包括以下步骤：提供一种金属层压体，其中具有内金属层部分和保护层部分的金属层层压在绝缘树脂层的至少一侧上，使得内金属层部分 布置在绝缘树脂层的侧面上; 在金属层和绝缘树脂层上形成通孔; 在形成通孔之后执行鼓风处理; 并且在执行喷射处理之后去除保护层部分。
-
公开(公告)号：US20090266589A1
公开(公告)日：2009-10-29
申请号：US12090245
申请日：2006-10-13
申请人： Hiroto Shimokawa , Nobu Iizumi , keita Bamba , Tadahiro Yokozawa
发明人： Hiroto Shimokawa , Nobu Iizumi , keita Bamba , Tadahiro Yokozawa
CPC分类号： H05K3/388 , H05K1/036 , H05K3/067 , H05K3/108 , H05K3/26 , H05K3/386 , H05K3/389 , H05K2201/0154 , H05K2201/0761
摘要： Is disclosed a process for producing a metal wiring substrate comprising a heat resistant resin substrate and a metal wiring which is laminated on the substrate and in which a surface laminated with the substrate is surface-treated with at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals (hereafter, the metal used for the surface-treatment is referred to as a surface-treatment metal). This process comprises the steps of forming the metal wiring on the resin substrate, and washing at least a surface of the resin substrate with an etching solution capable of removing the surface-treatment metal to increase adhesion of the surface of the resin substrate. The produced metal wiring substrate has excellent adhesion with adhesives for affixing anisotropic conductive films and IC chips to films.
摘要翻译： 公开了一种制造金属布线基板的方法，该金属布线基板包括耐热树脂基板和金属布线，该金属布线基板和金属布线层叠在基板上，其中与基板层压的表面用至少一种选自Ni，Cr， Co，Zn，Sn和Mo或包含这些金属中的至少一种的合金（以下将用于表面处理的金属称为表面处理金属）。 该方法包括以下步骤：在树脂基板上形成金属布线，并用能够除去表面处理金属的蚀刻溶液至少洗涤树脂基板的表面以提高树脂基板的表面的粘合力。 所生产的金属布线基板具有优异的粘合性，用于将各向异性导电膜和IC芯片固定到膜上。
-
公开(公告)号：US20090211786A1
公开(公告)日：2009-08-27
申请号：US12090251
申请日：2006-10-13
申请人： Keita Bamba , Tadahiro Yokozawa , Hiroto Shimokawa , Nobu Iizumi
发明人： Keita Bamba , Tadahiro Yokozawa , Hiroto Shimokawa , Nobu Iizumi
IPC分类号： H05K1/00 , H05K3/06 , H05K3/26 , H01L21/288
CPC分类号： H05K3/067 , H05K3/025 , H05K3/108 , H05K3/244 , H05K3/26 , H05K3/384 , H05K2201/0355 , H05K2201/0761 , H05K2203/1476 , Y10T29/49155 , Y10T29/49156
摘要： Is disclosed a process for producing a copper-wiring polyimide film from a carrier-accompanied copper foil laminated polyimide film by a subtractive method or a semi-additive method. Washing the polyimide surface exposed by etching the copper foil with a etching solution capable of removing mainly at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals used for a surface treatment of the copper foil restrains an anomalous deposition of plating substances when the copper wiring is plated with tin.
摘要翻译： 公开了通过减色法或半添加法从载体伴随铜箔层压聚酰亚胺膜制造铜布聚酰亚胺膜的方法。 通过用能够主要去除选自Ni，Cr，Co，Zn，Sn和Mo中的至少一种金属的蚀刻溶液蚀刻铜箔来清洗聚酰亚胺表面，或者包含用于表面处理的这些金属中的至少一种的合金 的铜箔在铜布镀锡时抑制电镀物质的异常沉积。
-
4.发明授权Production of via hole in a flexible printed circuit board by applying a laser or punch 失效通过施加激光或冲孔在柔性印刷电路板中制造通孔公开(公告)号：US07918021B2
公开(公告)日：2011-04-05
申请号：US12169850
申请日：2008-07-09
CPC分类号： H05K3/0055 , H05K1/0393 , H05K3/0035 , H05K2201/0154 , H05K2201/0209 , H05K2203/025 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole.
摘要翻译： 柔性电路可印刷板可以通过以下步骤有利地产生：在每个表面侧上具有金属涂层的聚酰亚胺膜中形成穿透至少一个金属涂层的通孔和聚酰亚胺膜的步骤; 以及将压力下的液体和磨粒的混合物施加到通孔上，由此平滑通孔的边缘并清洁通孔。
-
公开(公告)号：US20050162835A1
公开(公告)日：2005-07-28
申请号：US10512204
申请日：2003-04-24
IPC分类号： C25D5/34 , C25D7/00 , H05K1/00 , H05K3/00 , H05K3/06 , H05K3/26 , H05K3/28 , H05K3/42 , H05K7/20 , H05K1/14
CPC分类号： H05K3/0055 , H05K1/0393 , H05K3/0035 , H05K2201/0154 , H05K2201/0209 , H05K2203/025 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole.
摘要翻译： 柔性电路可印刷板可以通过以下步骤有利地产生：在每个表面侧上具有金属涂层的聚酰亚胺膜中形成穿透至少一个金属涂层的通孔和聚酰亚胺膜的步骤; 以及将压力下的液体和磨粒的混合物施加到通孔上，由此平滑通孔的边缘并清洁通孔。
-
公开(公告)号：US5403520A
公开(公告)日：1995-04-04
申请号：US144215
申请日：1993-10-27
CPC分类号： G02F1/3511 , G02F1/361 , G02F3/00 , G02F2203/07
摘要： The nonlinear optical device of the present invention comprises a nonlinear optical element comprised of a chiral compound having a third-order nonlinearity. Further, the optical signal processing unit comprises a laser light source, the above-described nonlinear optical device, and a photodetector.
摘要翻译： 本发明的非线性光学器件包括由具有三阶非线性的手性化合物组成的非线性光学元件。 此外，光信号处理单元包括激光源，上述非线性光学装置和光电检测器。
-
公开(公告)号：US20100252309A1
公开(公告)日：2010-10-07
申请号：US12671011
申请日：2008-07-25
CPC分类号： H05K3/068 , B29K2079/08 , C08J5/18 , C08J2379/08 , H01L21/4846 , H01L23/4985 , H01L2924/0002 , H05K1/0346 , H05K3/007 , H05K3/022 , H05K2201/0154 , H05K2201/068 , Y10T428/31663 , Y10T428/31721 , H01L2924/00
摘要： The polyimide film of the present invention is to be used for the production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film.
摘要翻译： 本发明的聚酰亚胺膜用于制造具有通过在聚酰亚胺膜的一侧（B侧）上形成金属层并蚀刻金属层而形成的金属布线的布线基板; 聚酰亚胺膜向B侧相反侧（A侧）卷曲; 并且控制聚酰亚胺膜的卷曲，以便减少其上形成有金属布线的布线板的下垂。 通过使用聚酰亚胺膜可以提高IC芯片安装的处理特性和生产率。
-
公开(公告)号：US20090242411A1
公开(公告)日：2009-10-01
申请号：US12465922
申请日：2009-05-14
申请人： Tadahiro Yokozawa , Hiroaki Yamaguchi , Keita Banba , Masao Okubo , Sumiko Okubo
发明人： Tadahiro Yokozawa , Hiroaki Yamaguchi , Keita Banba , Masao Okubo , Sumiko Okubo
CPC分类号： H05K3/38 , H05K1/0346 , H05K3/181 , H05K3/426 , H05K2201/0154 , H05K2201/0175 , Y10T428/24917 , Y10T428/31721
摘要： A process for producing a polyimide-metal laminated body includes forming a metal conductive layer on a polyimide film having a ceramic-modified or pseudoceramic-modified surface with a wet plating process which includes forming at least a ground treatment layer by electroless plating, conducting electroless metal plating and conducting electrolytic copper plating.
摘要翻译： 一种聚酰亚胺 - 金属层叠体的制造方法，其特征在于，在具有陶瓷改性或假陶瓷改性面的聚酰亚胺膜上形成金属导电层，其中，所述湿式电镀工艺包括通过无电镀形成至少一层地面处理层， 金属电镀和导电电解镀铜。
-
公开(公告)号：US20080286538A1
公开(公告)日：2008-11-20
申请号：US10585533
申请日：2005-01-11
申请人： Tadahiro Yokozawa , Hiroaki Yamaguchi , Keita Banba , Masao Okubo , Sumiko Okubo
发明人： Tadahiro Yokozawa , Hiroaki Yamaguchi , Keita Banba , Masao Okubo , Sumiko Okubo
CPC分类号： H05K3/38 , H05K1/0346 , H05K3/181 , H05K3/426 , H05K2201/0154 , H05K2201/0175 , Y10T428/24917 , Y10T428/31721
摘要： A polyimide-metal laminated body obtained by forming a metal conductive layer on a polyimide film, which has been ceramic-modified or pseudoceramic-modified on at least the surface, by a wet plating process capable of accomplishing metal plating on ceramic. A polyimide-metal laminated body and polyimide circuit board having satisfactory cohesion in wet plating steps, maintain practical cohesion even after high temperature aging treatment, and exhibiting satisfactory electrical insulating reliability, can be obtained.
摘要翻译： 在聚酰亚胺膜上形成金属导电层的聚酰亚胺 - 金属层叠体，其通过能够在陶瓷上进行金属电镀的湿式电镀法在至少表面进行陶瓷改性或者假陶瓷改性。 在湿式电镀步骤中具有令人满意的内聚力的聚酰亚胺 - 金属层压体和聚酰亚胺电路板，即使在高温时效处理之后也能保持实用的内聚力，并且可以获得令人满意的电绝缘可靠性。
-
10.发明申请POLYIMIDE FILM, POLYIMIDE LAMINATE COMPRISING SAME, AND POLYIMIDE/METAL LAMINATE COMPRISING SAME 审中-公开聚酰亚胺膜，包含该聚酰亚胺膜的聚酰亚胺层压体和包含其的聚酰亚胺/金属层压板公开(公告)号：US20120308816A1
公开(公告)日：2012-12-06
申请号：US13577900
申请日：2011-02-10
申请人： Shin-ichiro Kohama , Nobuharu Hisano , Hiroaki Yamaguchi , Yoshiyuki Oishi , Toru Miura , Tadahiro Yokozawa , Masafumi Kohda , Kosuke Oishi
发明人： Shin-ichiro Kohama , Nobuharu Hisano , Hiroaki Yamaguchi , Yoshiyuki Oishi , Toru Miura , Tadahiro Yokozawa , Masafumi Kohda , Kosuke Oishi
CPC分类号： B32B15/08 , B32B7/12 , B32B15/088 , B32B27/06 , B32B27/28 , B32B27/34 , B32B2379/08 , B32B2457/202 , C08G73/0273 , C08G73/0644 , C08G73/1085 , C08J5/128 , C08J2379/08 , C08J2479/08 , C09D179/08 , H05K1/0346 , Y10T428/2848 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： Disclosed is a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer. The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) formed contacting the polyimide layer (b), wherein the polyimide layer (a) is a polyimide formed from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1): wherein R1 denotes a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aryl group, and R2 denotes an alkyl group having 1 to 12 carbon atoms or an aryl group.
摘要翻译： 公开了具有改进的粘合剂粘附性和/或与金属层的粘附性的聚酰亚胺膜。 聚酰亚胺膜至少具有聚酰亚胺层（b）和与聚酰亚胺层（b）接触形成的聚酰亚胺层（a），其中聚酰亚胺层（a）是由四羧酸二酐组分形成的聚酰亚胺和含有 由通式（1）表示的二胺化合物：其中R1表示氢原子，具有1至12个碳原子的烷基或芳基，R2表示具有1至12个碳原子的烷基或芳基。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.022 秒)