公开(公告)号：US20160127688A1

公开(公告)日：2016-05-05

申请号：US14924942

申请日：2015-10-28

申请人： Koichi INOUE ,  Takahiro ASAI ,  Yoshikazu GOTO

发明人： Koichi INOUE ,  Takahiro ASAI ,  Yoshikazu GOTO

IPC分类号： H04N7/15

CPC分类号： H04N7/152 ,  H04L12/1813 ,  H04L12/1822 ,  H04L65/1059 ,  H04L65/1089 ,  H04L65/403 ,  H04M3/567

摘要： An information processing apparatus includes one or more processors configured to receive image data from another information processing apparatus. The processor includes a reception unit that receives call information from the other information processing apparatus when the processor is in a state of receiving at least the image data from the other information processing apparatus, and a calling sound output unit that outputs a calling sound upon reception of the call information by the reception unit.

摘要翻译： 信息处理装置包括被配置为从另一个信息处理装置接收图像数据的一个或多个处理器。 处理器包括接收单元，当处理器处于至少接收到来自其他信息处理设备的图像数据的状态时，接收来自其他信息处理设备的呼叫信息;以及呼叫声输出单元，其在接收时输出呼叫声音 的接收单元的呼叫信息。

公开(公告)号：US20170374111A1

公开(公告)日：2017-12-28

申请号：US15700540

申请日：2017-09-11

申请人： Hiroshi HINOHARA ,  Hiroyuki KANDA ,  Takahiro ASAI ,  Koichi INOUE

发明人： Hiroshi HINOHARA ,  Hiroyuki KANDA ,  Takahiro ASAI ,  Koichi INOUE

IPC分类号： H04L29/06 ,  H04L12/26

CPC分类号： H04L65/1069 ,  H04L43/0852 ,  H04L65/403 ,  H04N7/15

摘要： A communication control apparatus control establishment of sessions for transmitting content data between communication terminals in a communication system having relay management apparatuses for relaying the content data transmitted from the communication terminals, includes a route setter configured to select one or more relay management apparatuses to set a route for transmitting the content data, based on delay information for each of the sessions, a selector to select, from the selected relay management apparatuses, a relay management apparatus to synthesize the content data to transmit the synthesized content data to the communication terminals that join the session, and a transmitter to transmit selection information indicating the selected relay management apparatus to, among the communication terminals that join the established session, at least one communication terminal coupled to a relay management apparatus differing from the selected relay management apparatus.

公开(公告)号：US20220070231A1

公开(公告)日：2022-03-03

申请号：US17458539

申请日：2021-08-27

申请人： Takashi HASEGAWA ,  Koichi INOUE ,  Takafumi TAKEDA

发明人： Takashi HASEGAWA ,  Koichi INOUE ,  Takafumi TAKEDA

IPC分类号： H04L29/06 ,  G06Q10/06 ,  G06Q10/10

摘要： A communication method executed by an information processing device is provided. The information processing device is configured to communicate with a second information processing device associated with a first user via a network, and includes a processor and a memory storing programmed instructions that, when executed by the processor, are operable for performing the communication method. The communication method includes causing the information processing device to display a list of second users while a call is in progress with the second information processing device; causing the information processing device to receive a selection of one of the second users displayed on the list; and causing the information processing device to transmit a request for participation in the call with the second information processing device to a third information processing device, the third information processing device being associated with the selected one of the second users.

公开(公告)号：US20120126381A1

公开(公告)日：2012-05-24

申请号：US13298687

申请日：2011-11-17

申请人： Daisuke UENDA ,  Takeshi MATSUMURA ,  Koichi INOUE ,  Miki MORITA

发明人： Daisuke UENDA ,  Takeshi MATSUMURA ,  Koichi INOUE ,  Miki MORITA

IPC分类号： H01L23/552 ,  B32B7/12

CPC分类号： H01L25/0657 ,  C09J7/28 ,  C09J2203/326 ,  H01L21/6836 ,  H01L23/552 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/16225 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An object of the present invention is to decrease the influence of an electromagnetic wave emitted from one semiconductor chip on other semiconductor chips in the same package, amounted substrate, adjacent devices, and the package. The present invention provides an adhesive film for a semiconductor device having an adhesive layer and an electromagnetic wave shielding layer, in which the attenuation of the electromagnetic wave that penetrates the adhesive film for a semiconductor device is 3 dB or more in at least a portion of the frequency range of 50 MHz to 20 GHz.

摘要翻译： 本发明的一个目的是减少在同一封装，基片，相邻器件和封装中的一个半导体芯片发射的电磁波对其它半导体芯片的影响。 本发明提供一种具有粘合层和电磁波屏蔽层的半导体装置用粘合膜，其中贯穿半导体装置用粘合膜的电磁波的衰减在至少一部分中为3dB以上 频率范围为50 MHz至20 GHz。

公开(公告)号：US20100108301A1

公开(公告)日：2010-05-06

申请号：US12263872

申请日：2008-11-03

申请人： Satoshi HIRAOKA ,  Koichi INOUE

发明人： Satoshi HIRAOKA ,  Koichi INOUE

IPC分类号： F28D5/02 ,  F28D7/10

CPC分类号： F28D1/04 ,  F02C7/143 ,  F28D5/02 ,  F28D7/1638 ,  F28F17/005

摘要： Cooling performance of a cooler for pre-cooling humid gas supplied to a gas turbine power generation plant, etc. is improved by increasing heat transfer efficiency between the humid gas and cooling liquid flowing in heat exchanger tubes with utilization of condensed liquid generated due to the cooling of the humid gas. In a heat exchanger for cooling humid gas a flowing surrounding heat exchanger tubes 8 of the tube groups 9a and 9b by flowing cooling liquid r in the tubes, the liquid droplets cl generated by condensation of moisture contained in the humid gas are gathered and sprinkled or fallen in drops on a part of the heat exchanger tube group 9b, which results in increased heat exchange efficiency.

摘要翻译： 通过提高湿气与在热交换器管中流动的冷却液之间的传热效率，可以提高用于预冷却供给到燃气轮机发电厂的湿气的冷却器的冷却性能，利用由于 冷却潮湿气体。 在用于通过使冷却液体r流入管中的情况下，使管道组9a和9b的流动的周围的热交换器管8冷却湿气的热交换器中收集并喷洒由湿气中包含的水分的冷凝产生的液滴cl， 在热交换器管组9b的一部分上滴落，这导致增加的热交换效率。

公开(公告)号：US20160014119A1

公开(公告)日：2016-01-14

申请号：US14793940

申请日：2015-07-08

申请人： Koichi INOUE ,  Osamu TAKAYASU

发明人： Koichi INOUE ,  Osamu TAKAYASU

IPC分类号： H04L29/06

CPC分类号： H04L63/0853 ,  H04L63/0807 ,  H04L63/108

摘要： An authentication system includes a storage unit that stores a service expiration date of a service provided by a client; a reception unit that receives from the client a request to issue an access token used to authorize use of the service; an issuing unit that issues, in response to the reception of the request, the access token based on the service expiration date to the client; and a determining unit that, in response to the issued access token transmitted by the client, determines that the access token is valid if the current date and time does not exceed the service expiration date of the service, or determines that the access token is not valid if the current date and time exceeds the service expiration date.

摘要翻译： 验证系统包括存储由客户端提供的服务的服务到期日的存储单元; 接收单元，从客户端接收发出用于授权使用该服务的访问令牌的请求; 发出单元，响应于所述请求的接收，基于所述客户端的所述服务到期日发出所述访问令牌; 以及确定单元，如果当前日期和时间不超过服务的服务有效期限，则响应于客户端发送的发出的访问令牌，确定访问令牌是有效的，或者确定访问令牌不是 如果当前日期和时间超过服务有效期限，则有效。

公开(公告)号：US20120126379A1

公开(公告)日：2012-05-24

申请号：US13298613

申请日：2011-11-17

申请人： Daisuke UENDA ,  Takeshi MATSUMURA ,  Koichi INOUE ,  Miki MORITA

发明人： Daisuke UENDA ,  Takeshi MATSUMURA ,  Koichi INOUE ,  Miki MORITA

IPC分类号： H01L23/552 ,  B32B37/14 ,  B32B37/12 ,  C23C16/44 ,  B32B7/12 ,  C09J7/02

CPC分类号： H01L24/27 ,  C09J7/28 ,  C09J2203/326 ,  H01L21/6836 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/29 ,  H01L2224/29083 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83091 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/85097 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0665 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T156/10 ,  Y10T428/2804 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A semiconductor device having an electromagnetic wave shielding layer can be manufactured without decreasing productivity. The present invention provides a die bond film including an adhesive layer and an electromagnetic wave shielding layer made of a metal foil or a die bond film including an adhesive layer and an electromagnetic wave shielding layer formed by vapor deposition.

摘要翻译： 可以在不降低生产率的情况下制造具有电磁波屏蔽层的半导体器件。 本发明提供一种芯片接合膜，其包括粘合层和由金属箔制成的电磁波屏蔽层或包括粘合层的芯片接合膜和通过气相沉积形成的电磁波屏蔽层。

公开(公告)号：US20090100023A1

公开(公告)日：2009-04-16

申请号：US12248468

申请日：2008-10-09

申请人： Koichi INOUE

发明人： Koichi INOUE

IPC分类号： G06F17/30 ,  G06F7/06

CPC分类号： G06F17/2229 ,  G06F17/241

摘要： An information processing apparatus has a document element storing part configured to store a document in a document element storage part for each document element of the document, a comment input part configured to input a comment corresponding to the document element to a comment storing part, and the comment storing part configured to store the comment input by the comment input part corresponding to the document element in a comment storage part in such a manner that the comment is identified as the comment associated with the document element.

摘要翻译： 信息处理装置具有文件单元存储单元，其被配置为将文档存储在文档的每个文档单元的文档单元存储部分中，注释输入部分被配置为将与文档元素相对应的注释输入到注释存储部分，以及 所述注释存储部件被配置为以将所述注释识别为与所述文档元素相关联的注释的方式将由所述文档元素对应的注释输入部分输入的注释存储在注释存储部分中。

公开(公告)号：US20120231557A1

公开(公告)日：2012-09-13

申请号：US13415073

申请日：2012-03-08

申请人： Koichi INOUE ,  Miki MORITA ,  Yuichiro SHISHIDO

发明人： Koichi INOUE ,  Miki MORITA ,  Yuichiro SHISHIDO

IPC分类号： H01L21/66

CPC分类号： H01L21/56 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/83906 ,  H01L2224/85205 ,  H01L2224/9205 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims to provides a method of manufacturing a film for a semiconductor device in which a dicing film, a die bond film, and a protecting film are laminated in this order, including the steps of: irradiating the die bond film with a light ray having a wavelength of 400 to 800 nm to detect the position of the die bond film based on the obtained light transmittance and punching the dicing film out based on the detected position of the die bond film, and in which T2/T1 is 0.04 or more, wherein T1 is the light transmittance of the portion where the dicing film and the protecting film are laminated and T2 is the light transmittance of the portion where the dicing film, the die bond film, and the protecting film are laminated.

摘要翻译： 本发明的目的在于提供一种半导体装置用膜的制造方法，其中切割膜，芯片接合膜和保护膜依次层叠，包括以下步骤：用光照射芯片接合膜 根据获得的透光率检测芯片接合膜的位置，并根据检测到的芯片接合膜的位置对该切割膜进行冲压，其中T2 / T1为0.04或 其中，T1是层叠有切割膜和保护膜的部分的透光率，T2是层叠有切割膜，芯片接合膜和保护膜的部分的透光率。

公开(公告)号：US20120126380A1

公开(公告)日：2012-05-24

申请号：US13298614

申请日：2011-11-17

申请人： Daisuke UENDA ,  Takeshi MATSUMURA ,  Koichi INOUE ,  Miki MORITA

发明人： Daisuke UENDA ,  Takeshi MATSUMURA ,  Koichi INOUE ,  Miki MORITA

IPC分类号： H01L23/552 ,  B05D5/10 ,  B32B27/00

CPC分类号： H01L23/552 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2924/01019 ,  H01L2924/01037 ,  H01L2924/01055 ,  H01L2924/01079 ,  Y10T428/28 ,  H01L2924/00

摘要： An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer.

摘要翻译： 可以在倒装芯片连接到被粘物的半导体元件的背面设置电磁波屏蔽层，并且可以制造具有电磁波屏蔽层的半导体器件，而不会降低生产率。 本发明提供了一种用于倒装芯片型半导体的背面的薄膜，该薄膜将形成在半导体元件的背面，该半导体元件倒装芯片连接到具有粘合剂层和电磁波屏蔽层的被粘物。