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公开(公告)号：US20130075145A1
公开(公告)日：2013-03-28
申请号：US13616348
申请日：2012-09-14
CPC分类号： H05K3/188 , C25D5/022 , H01L21/4857 , H01L21/6835 , H01L23/13 , H01L23/49822 , H01L23/544 , H01L24/16 , H01L24/81 , H01L2221/68345 , H01L2221/68381 , H01L2223/54426 , H01L2223/54486 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/92125 , H01L2924/12042 , H01L2924/15311 , H05K1/113 , H05K3/0017 , H05K3/46 , H05K3/4682 , H05K2201/0376 , H05K2201/09036 , H05K2203/0369 , H05K2203/0376 , H05K2203/06 , Y10T29/49155 , H01L2924/00
摘要： A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.
摘要翻译： 布线基板包括绝缘层，埋置在绝缘层中的连接焊盘，该连接焊盘处于连接焊盘的上表面从绝缘层的上表面露出的状态以及下表面和侧表面的至少一部分 所述连接焊盘与所述绝缘层接触，以及形成在所述绝缘层中的所述连接焊盘的外周部分的凹陷高度差部分，其中所述连接焊盘的上表面和所述绝缘层的上表面被布置在 相同的高度
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公开(公告)号：US20080245549A1
公开(公告)日：2008-10-09
申请号：US12098583
申请日：2008-04-07
申请人： Kotaro Kodani , Junichi Nakamura , Kentaro Kaneko
发明人： Kotaro Kodani , Junichi Nakamura , Kentaro Kaneko
CPC分类号： H05K3/205 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H05K1/0269 , H05K1/113 , H05K3/382 , H05K3/4679 , H05K3/4682 , H05K2201/09781 , H05K2201/09918 , H05K2203/0346 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49224 , H01L2924/00 , H01L2224/0401
摘要： In a method of manufacturing a wiring board, the method includes: (i) forming a plurality of conductive patterns to come into contact with a support plate; (ii) forming a resin layer to cover the plurality of conductive patterns and to come into contact with the support plate; (iii) forming another conductive pattern connected to at least one of the plurality of conductive patterns; and (iv) removing the support plate. A first area of the support plate coming into contact with at least one of the plurality of conductive patterns in step (i) is different in surface roughness from a second area of the support plate coming into contact with the resin layer in step (ii).
摘要翻译： 在制造布线板的方法中，该方法包括：（i）形成与支撑板接触的多个导电图案; （ii）形成树脂层以覆盖多个导电图案并与支撑板接触; （iii）形成连接到所述多个导电图案中的至少一个的另一个导电图案; 和（iv）移除支撑板。 在步骤（i）中与多个导电图案中的至少一个接触的支撑板的第一区域在与步骤（ii）中与树脂层接触的支撑板的第二区域的表面粗糙度不同， 。
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公开(公告)号：US20120006591A1
公开(公告)日：2012-01-12
申请号：US13176876
申请日：2011-07-06
CPC分类号： H05K3/205 , H01L21/4857 , H01L21/6835 , H01L24/81 , H01L2221/68345 , H01L2224/81192 , H01L2224/81801 , H01L2924/14 , H01L2924/1517 , H01L2924/15174 , H05K1/113 , H05K3/244 , H05K2201/09736 , H05K2201/09827 , Y10T29/49124 , H01L2924/00
摘要： A wiring substrate that prevents the occurrence of delamination near an interface between an insulation layer and an electrode pad, which is formed in a recess of the insulation layer. An adjustment layer is formed in an opening in a resist, which is applied to a support body, to adjust the shape of the electrode pad. The adjustment layer includes a flat surface, which is substantially parallel to the support body, and an inclined surface, which extends from a rim of the flat surface toward the support body and to the side wall of the opening. A pad body of the electrode pad and an insulation layer including a wire is formed on the adjustment layer. The support body and adjustment layer are etched to expose the pad body.
摘要翻译： 一种布线基板，其防止在绝缘层的凹部中形成的绝缘层和电极焊盘之间的界面附近发生分层。 在抗蚀剂的开口中形成调整层，其被施加到支撑体上，以调节电极垫的形状。 调整层包括基本上平行于支撑体的平坦表面和从平坦表面的边缘朝向支撑体延伸到开口的侧壁的倾斜表面。 在调整层上形成有电极焊盘的焊盘主体和包括导线的绝缘层。 蚀刻支撑体和调整层以露出垫体。
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公开(公告)号：US08760883B2
公开(公告)日：2014-06-24
申请号：US13344864
申请日：2012-01-06
摘要： A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings.
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公开(公告)号：US09210808B2
公开(公告)日：2015-12-08
申请号：US13616348
申请日：2012-09-14
IPC分类号： H05K1/11 , H05K3/46 , H01L23/00 , H01L23/544 , H01L21/683 , H01L23/13 , H01L23/498 , H01L21/48
CPC分类号： H05K3/188 , C25D5/022 , H01L21/4857 , H01L21/6835 , H01L23/13 , H01L23/49822 , H01L23/544 , H01L24/16 , H01L24/81 , H01L2221/68345 , H01L2221/68381 , H01L2223/54426 , H01L2223/54486 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/92125 , H01L2924/12042 , H01L2924/15311 , H05K1/113 , H05K3/0017 , H05K3/46 , H05K3/4682 , H05K2201/0376 , H05K2201/09036 , H05K2203/0369 , H05K2203/0376 , H05K2203/06 , Y10T29/49155 , H01L2924/00
摘要： A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.
摘要翻译： 布线基板包括绝缘层，埋置在绝缘层中的连接焊盘，该连接焊盘处于连接焊盘的上表面从绝缘层的上表面露出的状态以及下表面和侧表面的至少一部分 所述连接焊盘与所述绝缘层接触，以及形成在所述绝缘层中的所述连接焊盘的外周部分的凹陷高度差部分，其中所述连接焊盘的上表面和所述绝缘层的上表面被布置在 相同的高度
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公开(公告)号：US08797757B2
公开(公告)日：2014-08-05
申请号：US13344864
申请日：2012-01-06
CPC分类号： H05K1/113 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15174 , H05K3/4682 , H05K2203/0152 , H05K2203/016 , Y10T29/49165 , H01L2924/00
摘要： A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings.
摘要翻译： 布线基板包括包括最外绝缘层的多个绝缘层; 以及多个布线层，交替层叠在绝缘层之间，并且包括从最外层绝缘层露出的最外面的布线层，并且穿过在通孔布线的端部上穿过最外层绝缘层的电极焊盘的布线，其中， 通过布线从最外侧绝缘层露出，并且最外面的布线层的一部分与贯通配线的端部重叠，并与贯通布线连接。
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公开(公告)号：US08476536B2
公开(公告)日：2013-07-02
申请号：US11987617
申请日：2007-12-03
IPC分类号： H05K1/11
CPC分类号： H05K1/113 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L2221/68345 , H01L2924/0002 , H05K3/108 , H05K3/205 , H05K3/4644 , H05K2201/0341 , H05K2201/09563 , H05K2201/096 , Y10T29/49155 , H01L2924/00
摘要： A wiring substrate has pads formed from a plurality of metal layers and vias connected to the pads. The plurality of metal layers have a metal layer exposed through the wiring substrate, and a first metal layer which is interposed between the metal layer and the vias and which prevents diffusion of metal included in the vias into the metal layer. A second metal layer which is less subject to oxidation than the first metal layer is provided between the vias and the first metal layer, and the vias are connected to the second metal layer.
摘要翻译： 布线基板具有由多个金属层形成的焊盘和连接到焊盘的通孔。 多个金属层具有通过布线基板露出的金属层，以及介于金属层和通孔之间的第一金属层，并且防止通孔中包含的金属扩散到金属层中。 在通孔和第一金属层之间设置有比第一金属层更少受到氧化的第二金属层，并且通孔连接到第二金属层。
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公开(公告)号：US07954234B2
公开(公告)日：2011-06-07
申请号：US12098583
申请日：2008-04-07
申请人： Kotaro Kodani , Junichi Nakamura , Kentaro Kaneko
发明人： Kotaro Kodani , Junichi Nakamura , Kentaro Kaneko
IPC分类号： H01K3/30
CPC分类号： H05K3/205 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15174 , H05K1/0269 , H05K1/113 , H05K3/382 , H05K3/4679 , H05K3/4682 , H05K2201/09781 , H05K2201/09918 , H05K2203/0346 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49224 , H01L2924/00 , H01L2224/0401
摘要： In a method of manufacturing a wiring board, the method includes: (i) forming a plurality of conductive patterns to come into contact with a support plate; (ii) forming a resin layer to cover the plurality of conductive patterns and to come into contact with the support plate; (iii) forming another conductive pattern connected to at least one of the plurality of conductive patterns; and (iv) removing the support plate. A first area of the support plate coming into contact with at least one of the plurality of conductive patterns in step (i) is different in surface roughness from a second area of the support plate coming into contact with the resin layer in step (ii).
摘要翻译： 在制造布线板的方法中，该方法包括：（i）形成与支撑板接触的多个导电图案; （ii）形成树脂层以覆盖多个导电图案并与支撑板接触; （iii）形成连接到所述多个导电图案中的至少一个的另一个导电图案; 和（iv）移除支撑板。 在步骤（i）中与多个导电图案中的至少一个接触的支撑板的第一区域在与步骤（ii）中与树脂层接触的支撑板的第二区域的表面粗糙度不同， 。
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公开(公告)号：US20080149383A1
公开(公告)日：2008-06-26
申请号：US11987617
申请日：2007-12-03
CPC分类号： H05K1/113 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L2221/68345 , H01L2924/0002 , H05K3/108 , H05K3/205 , H05K3/4644 , H05K2201/0341 , H05K2201/09563 , H05K2201/096 , Y10T29/49155 , H01L2924/00
摘要： A wiring substrate has pads formed from a plurality of metal layers and vias connected to the pads. The plurality of metal layers have a metal layer exposed through the wiring substrate, and a first metal layer which is interposed between the metal layer and the vias and which prevents diffusion of metal included in the vias into the metal layer. A second metal layer which is less subject to oxidation than the first metal layer is provided between the vias and the first metal layer, and the vias are connected to the second metal layer.
摘要翻译： 布线基板具有由多个金属层形成的焊盘和连接到焊盘的通孔。 多个金属层具有通过布线基板露出的金属层，以及介于金属层和通孔之间的第一金属层，并且防止通孔中包含的金属扩散到金属层中。 在通孔和第一金属层之间设置有比第一金属层更少受到氧化的第二金属层，并且通孔连接到第二金属层。
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公开(公告)号：US08686298B2
公开(公告)日：2014-04-01
申请号：US13403155
申请日：2012-02-23
申请人： Junichi Nakamura , Kotaro Kodani , Michiro Ogawa
发明人： Junichi Nakamura , Kotaro Kodani , Michiro Ogawa
IPC分类号： H05K1/03
CPC分类号： H01L23/49544 , H01L23/49822 , H01L24/97 , H01L2224/16 , H01L2224/16235 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H05K1/0271 , H05K3/0052 , H05K3/284 , H05K3/4682 , H05K2201/09136 , H05K2201/09681 , H05K2201/09781 , H05K2201/2009 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective.
摘要翻译： 布线基板包括布线形成区域，其中堆叠多个布线层，同时夹着绝缘层;外周区域布置在布线形成区域周围，并且其中加强图案形成在与每个布线形成区域相同的层中 接线层。 增强图案与外周区域的面积比和布线层与布线形成区域的面积比在各层中基本相同，并且当外围区域中没有间隙时，增强图案在外周区域中不存在间隙 接线板以平面视角观看。
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