公开(公告)号：US20120111610A1

公开(公告)日：2012-05-10

申请号：US13013736

申请日：2011-01-25

申请人： Kwang Soo KIM ,  Sang Hyun SHIN ,  Jung Eun KANG ,  Chang Hyun LIM ,  Seog Moon CHOI ,  Sung Keun PARK

发明人： Kwang Soo KIM ,  Sang Hyun SHIN ,  Jung Eun KANG ,  Chang Hyun LIM ,  Seog Moon CHOI ,  Sung Keun PARK

IPC分类号： H05K1/02 ,  C23C28/00

CPC分类号： H01L23/3735 ,  H01L23/142 ,  H01L23/4334 ,  H01L23/49531 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：阳极氧化基板，其具有形成在金属基板上的阳极氧化膜; 形成在所述阳极氧化基板的一个表面上的电路图案; 以及形成在阳极氧化基板的另一表面上的金属层。 形成在阳极氧化基板的另一个表面上的金属层具有与在其一个表面上形成的电路图案相同的面积，并且形成在阳极氧化基板的边缘内。 添加金属层，使得可以使基板的翘曲问题最小化。 此外，散热板与阳极化基板直接接触，从而可以解决散热基板和发热元件的性能劣化问题，并提高散热性能。

公开(公告)号：US20120073863A1

公开(公告)日：2012-03-29

申请号：US13007464

申请日：2011-01-14

申请人： Jung Eun KANG ,  Kwang Soo KIM ,  Seog Moon CHOI ,  Sung Keun PARK ,  Chang Hyun LIM

发明人： Jung Eun KANG ,  Kwang Soo KIM ,  Seog Moon CHOI ,  Sung Keun PARK ,  Chang Hyun LIM

IPC分类号： H05K1/00 ,  H05K3/44

CPC分类号： H05K1/053 ,  H05K3/445 ,  Y10T29/49147

摘要： Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member.

摘要翻译： 本文公开了一种阳极氧化散热基板。 阳极氧化的散热基板的优点在于它具有良好的辐射特性，因为在金属层的整个表面上形成阳极氧化的氧化物层。 并且，阳极氧化散热基板的优点在于它具有高密度/高的积聚特性，因为它通过使用连接件形成多层结构。

公开(公告)号：US20120067623A1

公开(公告)日：2012-03-22

申请号：US13007414

申请日：2011-01-14

申请人： Sung Keun PARK ,  Chang Hyun LIM ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Jung Eun KANG

发明人： Sung Keun PARK ,  Chang Hyun LIM ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Jung Eun KANG

IPC分类号： H05K1/00 ,  H05K3/02

CPC分类号： H01L23/142 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15156 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-radiating element is mounted on a first pad of the first circuit layer or a second pad of the second circuit layer, or is directly mounted on the exposed side of the copper substrate after forming an opening on the alumina layer.

摘要翻译： 本发明公开了一种散热基板，包括：铜基板; 形成在铜基板一侧的氧化铝层; 形成在氧化铝层上的第一电路层; 以及形成在第一电路层上的第二电路层，其中散热元件安装在第一电路层的第一焊盘或第二电路层的第二焊盘上，或者直接安装在铜的暴露侧 在氧化铝层上形成开口后的基板。

公开(公告)号：US20110303437A1

公开(公告)日：2011-12-15

申请号：US12911620

申请日：2010-10-25

申请人： Chang Hyun LIM ,  Jung Eun KANG ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

发明人： Chang Hyun LIM ,  Jung Eun KANG ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

IPC分类号： H05K1/00 ,  H05B3/00

CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K2201/049 ,  H05K2201/062 ,  H05K2201/10166 ,  H05K2203/0315 ,  Y10T29/49083

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; and a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by the heat generated from the heat generating element.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括芯层，芯层包括芯金属层和形成在芯金属层上的芯绝缘层，并分成第一区域和第二区域; 形成在芯层的第一区域中的电路层; 以及形成在芯层的第二区域中并包括积聚绝缘层和积聚电路层的堆积层。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱元件被发热元件产生的热量损坏。

公开(公告)号：US20110303440A1

公开(公告)日：2011-12-15

申请号：US12900226

申请日：2010-10-07

申请人： Chang Hyun LIM ,  Jung Eun KANG ,  Heung Soo PARK ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

发明人： Chang Hyun LIM ,  Jung Eun KANG ,  Heung Soo PARK ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

IPC分类号： H05K1/03 ,  H05K3/44 ,  C23C28/00

CPC分类号： H05K3/10 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/108 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2203/0315 ,  Y10T29/4913

摘要： Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

摘要翻译： 本文公开了包括金属芯层的混合散热基板; 氧化物绝缘芯层，其形成在所述金属芯层的厚度方向上，以形成所述氧化物绝缘芯层与所述金属芯层一体形成的形状;氧化物绝缘层，其形成在所述金属芯层的一个表面或两个表面上 金属芯层，以及被配置为包括形成在氧化物绝缘芯层上的第一电路图案和形成在氧化物绝缘层上的第二电路图案的电路层及其制造方法。

公开(公告)号：US20130009291A1

公开(公告)日：2013-01-10

申请号：US13281285

申请日：2011-10-25

申请人： Kwang Soo KIM ,  Young Ki LEE ,  Sung Keun PARK ,  Seog Moon CHOI ,  Chang Hyun LIM

发明人： Kwang Soo KIM ,  Young Ki LEE ,  Sung Keun PARK ,  Seog Moon CHOI ,  Chang Hyun LIM

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：具有形成在多个半导体器件安装区域之间的沟槽的基底基板; 安装在基底基板的半导体器件安装区域上的半导体器件; 以及形成在基底基板上和凹槽的内部中的模制件。

公开(公告)号：US20120103588A1

公开(公告)日：2012-05-03

申请号：US13030976

申请日：2011-02-18

申请人： Kwang Soo KIM ,  Chang Hyun LIM ,  Seog Moon CHOI ,  Mok Soon KIM ,  Sung Keun PARK

发明人： Kwang Soo KIM ,  Chang Hyun LIM ,  Seog Moon CHOI ,  Mok Soon KIM ,  Sung Keun PARK

IPC分类号： F28F7/00

CPC分类号： H05K1/053 ,  H05K2201/0338 ,  H05K2203/0315

摘要： Disclosed herein is a heat-dissipating substrate in order to improve heat-dissipating characteristics. The heat-dissipating substrate, comprising: a copper layer having a predetermined thickness; anodized insulating layers formed on upper and lower surfaces of the copper layer; and aluminum (Al) layers formed between the copper layer and the anodized insulating layer. Therefore, a heat-dissipating function of the base made of the aluminum (Al) layer and the copper (Cu) layer is improved, thereby making it possible to provide a high-output metal substrate appropriate for high-integration/high capacity electronic components.

摘要翻译： 这里公开了散热基板，以提高散热特性。 散热基板，包括：具有预定厚度的铜层; 形成在铜层的上表面和下表面上的阳极氧化绝缘层; 以及形成在铜层和阳极氧化绝缘层之间的铝（Al）层。 因此，提高了由铝（Al）层和铜（Cu）层构成的基底的散热功能，从而可以提供适合于高集成度/高容量电子部件的高输出金属基板 。

公开(公告)号：US20130083492A1

公开(公告)日：2013-04-04

申请号：US13603722

申请日：2012-09-05

申请人： Kwang Soo KIM ,  Young Ki LEE ,  Sung Keun PARK ,  Seog Moon CHOI

发明人： Kwang Soo KIM ,  Young Ki LEE ,  Sung Keun PARK ,  Seog Moon CHOI

IPC分类号： H05K7/00 ,  H05K3/10

CPC分类号： H01L23/142 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49866 ,  H01L24/32 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48229 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power module package includes: a substrate having a stepped portion and a non-stepped portion; a power circuit unit electrically connected to a circuit wiring provided in the stepped portion; a control circuit unit electrically connected to a circuit wiring provided in the non-stepped portion; and a molding unit molded on the substrate to seal the power circuit unit while exposing the circuit wiring of the non-stepped portion. Therefore, it is possible to improve thermal characteristics of the power module package, implement high reliability between the power circuit unit and the control circuit unit, improve design freedom of the power module package, and implement miniaturization of products.

摘要翻译： 功率模块封装包括：具有阶梯部分和非阶梯部分的衬底; 电连接单元，电连接到设置在台阶部的电路布线; 控制电路单元，电连接到设置在非阶梯部分中的电路布线; 以及模制在基板上以在暴露非阶梯部分的电路布线的同时密封电力电路单元的模制单元。 因此，可以提高功率模块封装的热特性，在电源电路单元和控制电路单元之间实现高可靠性，提高功率模块封装的设计自由度，实现产品的小型化。

公开(公告)号：US20130010425A1

公开(公告)日：2013-01-10

申请号：US13280866

申请日：2011-10-25

申请人： Jin Suk SON ,  Kwang Soo KIM ,  Young Ki LEE ,  Sun Woo YUN ,  Sung Keun PARK

发明人： Jin Suk SON ,  Kwang Soo KIM ,  Young Ki LEE ,  Sun Woo YUN ,  Sung Keun PARK

IPC分类号： H05K7/20 ,  B32B37/14

CPC分类号： H01L23/473 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：由金属材料制成的基底; 形成为允许冷却材料在基底基板的内部部分流动的冷却通道; 阳极化层，形成在所述基底基板的外表面上; 金属层，其形成在具有阳极氧化层的基底基板的第一表面上，并且包括电路和连接焊盘; 以及安装在金属层上的半导体器件。

公开(公告)号：US20130270689A1

公开(公告)日：2013-10-17

申请号：US13550067

申请日：2012-07-16

申请人： Kwang Soo KIM ,  Young Ki LEE ,  Bum Seok SUH ,  Kee Ju UM ,  Suk Ho LEE ,  Young Hoon KWAK

发明人： Kwang Soo KIM ,  Young Ki LEE ,  Bum Seok SUH ,  Kee Ju UM ,  Suk Ho LEE ,  Young Hoon KWAK

IPC分类号： H01L23/36

CPC分类号： H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49562 ,  H01L23/49575 ,  H01L25/043 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/4141 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2224/37099

摘要： Provided are a semiconductor package capable of packaging and modularizing power semiconductor devices which are difficult to integrate due to heat generation, a semiconductor package module using the same, and a mounting structure thereof. The semiconductor package includes: a common connection terminal formed to have a flat plate shape; first and second electronic devices respectively bonded to both surfaces of the common connection terminals; first and second connection terminals having a flat plate shape and bonded to the first electronic device; and a third connection terminal having a flat plate shape and bonded to the second electronic device.

摘要翻译： 提供了能够封装和模块化由于发热而难以集成的功率半导体器件的半导体封装，使用其的半导体封装模块及其安装结构。 半导体封装包括：形成为具有平板形状的公共连接端子; 第一和第二电子设备分别接合到公共连接端子的两个表面; 第一和第二连接端子具有平板形状并且结合到第一电子设备; 以及具有平板形状并结合到第二电子设备的第三连接端子。