HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    加热基板及其制造方法

    公开(公告)号:US20120111610A1

    公开(公告)日:2012-05-10

    申请号:US13013736

    申请日:2011-01-25

    IPC分类号: H05K1/02 C23C28/00

    摘要: Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance.

    摘要翻译: 这里公开了散热基板及其制造方法。 散热基板包括:阳极氧化基板,其具有形成在金属基板上的阳极氧化膜; 形成在所述阳极氧化基板的一个表面上的电路图案; 以及形成在阳极氧化基板的另一表面上的金属层。 形成在阳极氧化基板的另一个表面上的金属层具有与在其一个表面上形成的电路图案相同的面积,并且形成在阳极氧化基板的边缘内。 添加金属层,使得可以使基板的翘曲问题最小化。 此外,散热板与阳极化基板直接接触,从而可以解决散热基板和发热元件的性能劣化问题,并提高散热性能。

    HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    加热基板及其制造方法

    公开(公告)号:US20110303437A1

    公开(公告)日:2011-12-15

    申请号:US12911620

    申请日:2010-10-25

    IPC分类号: H05K1/00 H05B3/00

    摘要: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; and a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by the heat generated from the heat generating element.

    摘要翻译: 这里公开了散热基板及其制造方法。 散热基板包括芯层,芯层包括芯金属层和形成在芯金属层上的芯绝缘层,并分成第一区域和第二区域; 形成在芯层的第一区域中的电路层; 以及形成在芯层的第二区域中并包括积聚绝缘层和积聚电路层的堆积层。 发热元件安装在电路层上,并且热增强元件安装在积层上,从而防止热弱元件被发热元件产生的热量损坏。

    HEAT-DISSIPATING SUBSTRATE
    7.
    发明申请
    HEAT-DISSIPATING SUBSTRATE 审中-公开
    散热基板

    公开(公告)号:US20120103588A1

    公开(公告)日:2012-05-03

    申请号:US13030976

    申请日:2011-02-18

    IPC分类号: F28F7/00

    摘要: Disclosed herein is a heat-dissipating substrate in order to improve heat-dissipating characteristics. The heat-dissipating substrate, comprising: a copper layer having a predetermined thickness; anodized insulating layers formed on upper and lower surfaces of the copper layer; and aluminum (Al) layers formed between the copper layer and the anodized insulating layer. Therefore, a heat-dissipating function of the base made of the aluminum (Al) layer and the copper (Cu) layer is improved, thereby making it possible to provide a high-output metal substrate appropriate for high-integration/high capacity electronic components.

    摘要翻译: 这里公开了散热基板,以提高散热特性。 散热基板,包括:具有预定厚度的铜层; 形成在铜层的上表面和下表面上的阳极氧化绝缘层; 以及形成在铜层和阳极氧化绝缘层之间的铝(Al)层。 因此,提高了由铝(Al)层和铜(Cu)层构成的基底的散热功能,从而可以提供适合于高集成度/高容量电子部件的高输出金属基板 。

    HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF
    8.
    发明申请
    HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF 有权
    散热基板及其制造方法

    公开(公告)号:US20110061901A1

    公开(公告)日:2011-03-17

    申请号:US12614407

    申请日:2009-11-07

    IPC分类号: H05K1/00 H05K3/00

    摘要: Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

    摘要翻译: 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上,并且在对应于分割区域的位置处填充有第二绝缘体,阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。