Resin composition
    2.
    发明授权

    公开(公告)号:US10988656B2

    公开(公告)日:2021-04-27

    申请号:US16470415

    申请日:2018-05-15

    Applicant: LG Chem, Ltd.

    Abstract: A thermally conductive resin composition is disclosed herein. The thermally conductive resin composition exhibits high thermal conductivity while having excellent handling properties. In an embodiment, a resin composition includes a resin component and 600 parts by weight or more of a thermally conductive filler relative to 100 parts by weight of the resin component. The thermally conductive filler comprise 30 to 50 wt % of a first thermally conductive filler having a D50 particle diameter of 35 μm or more, 25 to 45 wt % of a second thermally conductive filler having a D50 particle diameter in a range of 15 μm to 30 μm, and 15 to 35 wt % of a third thermally conductive filler having a D50 particle diameter of 1 to 4 μm, based on the total weight of the thermally conductive filler.

    Method For Producing Super Absorbent Polymer And Super Absorbent Polymer

    公开(公告)号:US20190176125A1

    公开(公告)日:2019-06-13

    申请号:US16093333

    申请日:2017-06-15

    Applicant: LG Chem, Ltd.

    Abstract: The present invention relates to a super absorbent polymer having a controlled degree of internal crosslinking and thereby having simultaneously improved basic absorption capacity and absorbency under pressure, and a method for producing the same. The super absorbent polymer may comprise a base polymer powder including a cross-linked polymer of a monomer containing a water-soluble ethylenically unsaturated compound or its salt; and a surface cross-linked layer that is formed on the base polymer powder and is further cross-linked from the cross-linked polymer, wherein a glass hollow particle having a micron-scale particle size is included in the cross-linked structure of the cross-linked polymer of the base polymer powder.

    Heating element having communication window

    公开(公告)号:US10165627B2

    公开(公告)日:2018-12-25

    申请号:US14767750

    申请日:2014-10-15

    Applicant: LG CHEM, LTD.

    Inventor: Hyeon Choi

    Abstract: Disclosed is a heating element, including: a substrate; a first bus bar provided on the substrate; a second bus bar which is provided on the substrate so as to be opposite to the first bus bar; and a heating pattern which is provided to electrically connect the first bus bar and the second bus bar, wherein the heating pattern includes a first pattern region which is in contact with the first bus bar and a second pattern region which is in contact with each of the second bus bar and the first pattern region and the first pattern region has an opening region which serves as a communication window.

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