摘要:
A process for the currentless metallization of electrically non-conductive substrates, includes providing a substrate which is electrically non-conductive; depositing on the substrate a positive lacquer comprising at least one polymer which is UV hardenable, at least one organo-metalllic compound, and a substance which is light-active to provide a positive lacquer coated substrate; irradiating the positive lacquer coated substrate with UV radiation to provide an irradiated coated substrate; and precipitating a metal layer onto the irradiated coated substrate by currentless metallization in a bath effective therefore.
摘要:
An electrochemical measuring sensor having a solid electrolyte, a first electrode exposed to a gas to be measured and a second electrode exposed to a reference gas, with the electrodes preferably being arranged on opposite sides of the solid electrolyte. At least one of the electrodes (16, 20) is provided with a contouring (24) on its side (22) that is exposed to the gas to be measured or to the reference gas, with the contouring being a trench-shaped groove (26) embossed into the surface of the electrode such that the electrode is pressed into the adjacent solid electrolyte in the region of the groove. According to the method, the embossing is done while the electrode and the solid electrolyte are in the non-sintered state, and the sensor is subsequently sintered.
摘要:
An electrical device includes two housing parts that may be joined to form one closed housing, the housing parts in the joined state enclosing a housing interior space, as well as an electrical/electronic circuit element arranged in the housing inner space, and a sealing material for protecting the circuit element. The two housing parts may be configured as half-shells and the interior area of the half-shells, in each case, may be subdivided by interior walls into at least two chambers, of which, in each case, a first chamber is filled with the sealing material and has spatial dimensions which are greater than the dimensions of the circuit element, the interior walls of the second half-shell, in the joined state of the two half-shells, overlapping the interior walls of the first half-shell with clearance, the interior walls of the first half-shell penetrating somewhat into the first chamber of the second half-shell, and the circuit element between the two half-shells being enveloped by the sealing material contained in the two first chambers, up to its electrical connections.
摘要:
A process for producing an electrically conductive connection between opposite arranged contact areas of two elements that are to be connected, by means of a hot-melt type adhesive formed of electrically conductive particles, which are dispersed in a thermoplastic base material. The hot-melt type adhesive (22) is applied purposely only to the contact areas (16) of at least one of the elements (10, 28, 42, 50) and that these elements are joined under the effects of heat.
摘要:
Risk mitigation and management is provided through an executive management application for the active management of operational risks, derived from exposure to factors that threaten strategic objectives related to operations, strategy, regulation and recording priorities. This system is based on a architecture that automates the Committee Of Sponsoring Organizations (COSO) framework for enterprise risk management, using the objective, risk, control and actions (ORCA) methodology to actively manage risk at the business unit level. This business process and feedback mechanism actively isolates, evaluates and escalates risks and controls in an interactive, proactive and dynamic manor. Workflow, alerts, messaging and roles and permission profiles route risk information to all relevant entities to ensure enterprise-wide visibility of, for example, a companies overall risk exposure.
摘要:
In a method for producing a multilayer circuit, it is possible to produce capacitor structures including electrodes and a dielectric arranged in between. By pressing the capacitor structures into a ceramic layer, it is possible to produce a high-quality capacitor inside the multilayer circuit.
摘要:
A workpiece processing plant comprises several machine tools which are arranged in opposite rows. The rows define a free space between each other. A loading and unloading device is provided which comprises a girder above the machine tools and above the free space. Rails are provided on the upper side of the girder. A loading and unloading unit configured as a multiple-axis robot is displaceable along the rails, the loading and unloading unit comprising several arms which are articulated to one another.
摘要:
A workpiece processing plant comprises several machine tools which are arranged in opposite rows. The rows define a free space between each other. A loading and unloading device is provided which comprises a girder above the machine tools and above the free space. Rails are provided on the upper side of the girder. A loading and unloading unit configured as a multiple-axis robot is displaceable along the rails, the loading and unloading unit comprising several arms which are articulated to one another.
摘要:
An anisotropically conducting adhesive includes an adhesive base material; and conductive particles which are dispersed in the adhesive base material and which have provided on the surface of the conductive particles a separating agent comprised of at least one ligand which is selected from the group consisting of triphenylphosphine and propionic acid, which decomposes during use of the anisotropically conducting adhesive in an adhesion process and which is non-polymeric. A method for producing a bonded, electrically conductive connection between a plurality of strip connectors includes (a) providing the foregoing anisotropically conducting adhesive; (b) positioning strip connectors on opposite surfaces of the anisotropically conducting adhesive; (c) applying pressure to the anisotropically conducting adhesive and the strip connectors; and (d) decomposing the at least one ligand of the anisotropically conducting adhesive.
摘要:
An anisotropically conducting adhesive includes a thermoplastic base material; and particles which include metal particles and metal ions, which are electrically conductive, and which are finely distributed within the thermoplastic base material below a percolation threshold, wherein the particles are enriched in certain regions under the influence of exposure to at least one of light and heat. A process for producing an anisotropically conducting adhesive includes providing a material comprised of thermoplastic base material in which electrically conductive particles including metal particles and metal ions are dispersed; and exposing the material to at least one of light and heat in predetermined regions in a targeted manner so that a targeted local heating occurs in the exposed regions and an increased mobility of the metal particles and metal ions occurs which is effective to provide a plurality of anisotropically electrically conductive paths having an enriched amount of the electrically conductive particles compared to that of adjacent regions, wherein the metal ions contribute to the formation of the plurality of anisotropically electrically conductive paths by undergoing reduction from the metal ion to the metal.