公开(公告)号：US20240376243A1

公开(公告)日：2024-11-14

申请号：US18685865

申请日：2022-08-05

Applicant: Mitsubishi Gas Chemical Company, Inc

Inventor： Yuji NAKASHIMA ,  Takashi KOBAYASHI ,  Shunsuke HIRANO ,  Keiichi HASEBE

IPC: C08F257/02 ,  C08J5/24 ,  C08K5/315 ,  C08L51/00 ,  H05K1/03

Abstract: Provided are a resin composition having low dielectric constants and low dielectric loss tangents before moisture absorption (initial state) and after moisture absorption with high metal foil peel strength; and a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board in which the resin composition is used. The resin composition contains a compound (A) represented by Formula (M1) and a polymer (B) having a structural unit represented by Formula (V).

公开(公告)号：US20180051168A1

公开(公告)日：2018-02-22

申请号：US15556761

申请日：2016-04-15

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takashi KOBAYASHI ,  Kentaro TAKANO

IPC: C08L63/04 ,  C08G59/08 ,  C08K5/205 ,  C08K5/3415

Abstract: A resin composition comprising a cyanate compound (A); and an epoxy resin (B) having a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2).

公开(公告)号：US20180009935A1

公开(公告)日：2018-01-11

申请号：US15545419

申请日：2016-02-04

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takashi KOBAYASHI ,  Kentaro TAKANO ,  Sotaro HIRAMATSU

IPC: C08G59/26 ,  B32B15/092 ,  C08K3/36 ,  C08J5/24 ,  B32B27/38 ,  H05K1/03

CPC classification number: C08G59/26 ,  B32B15/08 ,  B32B15/092 ,  B32B27/38 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/36 ,  H05K1/0346 ,  H05K1/0373 ,  Y10T428/24917

Abstract: The present invention provides a resin composition comprising a cyanate compound (A); and an epoxy resin (B) represented by general formula (1): wherein a plurality of R each independently represent any of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms.

公开(公告)号：US20170238418A1

公开(公告)日：2017-08-17

申请号：US15501995

申请日：2016-02-19

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takashi KOBAYASHI ,  Kentaro TAKANO

IPC: H05K1/03 ,  B32B15/20 ,  B32B37/06 ,  B32B37/10 ,  C08L63/00 ,  H05K3/00 ,  C08J5/24 ,  C08G61/02 ,  C08L65/00 ,  B32B15/14 ,  D06M15/55

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B37/06 ,  B32B37/10 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2363/00 ,  B32B2457/08 ,  C08G14/12 ,  C08G59/40 ,  C08G61/02 ,  C08G2261/3424 ,  C08G2261/592 ,  C08G2261/65 ,  C08G2261/74 ,  C08G2261/76 ,  C08J5/24 ,  C08J2361/14 ,  C08J2361/34 ,  C08J2363/00 ,  C08J2365/00 ,  C08J2461/14 ,  C08J2461/34 ,  C08J2463/00 ,  C08J2465/00 ,  C08K3/36 ,  C08L61/14 ,  C08L61/34 ,  C08L63/00 ,  C08L65/00 ,  C08L2201/02 ,  C08L2201/08 ,  D06M15/55 ,  D06M2101/00 ,  H05K1/0366 ,  H05K3/007 ,  H05K2201/0209

Abstract: The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

公开(公告)号：US20170231090A1

公开(公告)日：2017-08-10

申请号：US15501654

申请日：2016-01-27

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takashi KOBAYASHI ,  Kentaro TAKANO ,  Sotaro HIRAMATSU

IPC: H05K1/03 ,  C08J5/24 ,  C08G71/04 ,  D06M15/564 ,  C08K5/098 ,  B32B15/14 ,  B32B5/02 ,  B32B15/20 ,  C08G8/28 ,  C08K3/36

CPC classification number: H05K1/0373 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  C08G8/28 ,  C08G71/04 ,  C08J5/24 ,  C08J2375/12 ,  C08K3/36 ,  C08K5/098 ,  C08K5/3415 ,  C08K5/3477 ,  C08L61/14 ,  C08L61/34 ,  D06M15/564 ,  D06M2101/00 ,  H05K1/0346

Abstract: A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1): wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.

公开(公告)号：US20160345433A1

公开(公告)日：2016-11-24

申请号：US15112251

申请日：2015-02-03

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Kenji ARII ,  Takashi KOBAYASHI ,  Masanobu SOGAME ,  Yoshinori MABUCHI ,  Sotaro HIRAMATSU

IPC: H05K1/03 ,  C08K3/36 ,  C08J5/24 ,  C08K5/315

CPC classification number: H05K1/0373 ,  B32B15/092 ,  B32B27/20 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/726 ,  B32B2457/08 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/36 ,  C08K5/315 ,  H05K1/0366 ,  H05K3/022

Abstract: A resin composition for a printed wiring board including:a cyanate compound represented by the following general formula (1); and an epoxy resin,

Abstract translation: 一种印刷线路板用树脂组合物，其特征在于，含有下述通式（1）表示的氰酸酯化合物（A）。 和环氧树脂（B），其中Ar 1表示芳基，Ar 2各自独立地表示选自亚苯基，亚萘基和亚联苯基的二价取代基，Ar 3各自独立地表示p + 1价取代基，选自p + 1价苯基，p + 1价萘基和p + 1价联苯基，R 1各自独立地表示选自 由氢原子，烷基和芳基组成的基团，R 2各自独立地表示选自氢原子，烷基，芳基和氰基的一价取代基，n表示数 的与Ar 1键合的氰基，为1〜3的整数，m表示与Ar 1键合的R 1的数，n + m + 2等于或小于对Ar 1的可能键数，p表示 R 2与Ar 3键合，为1〜9的整数，x和y 表示重复单元的比例，x为1，y为0.25〜2.0，x和y的重复单元可以各自连续排列，也可以交替地或随机地排列。

公开(公告)号：US20160237246A1

公开(公告)日：2016-08-18

申请号：US15023879

申请日：2014-10-20

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Kenji ARII ,  Takashi KOBAYASHI ,  Masanobu SOGAME ,  Yoshinori MABUCHI ,  Hiroyuki MISHIMA

IPC: C08K5/315 ,  H05K1/03 ,  H05K1/05

CPC classification number: C08K5/315 ,  B32B15/08 ,  B32B27/20 ,  B32B27/42 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G73/0655 ,  C08J5/24 ,  C08J2379/04 ,  C08J2463/00 ,  C08K3/013 ,  C08L63/00 ,  C08L65/00 ,  C08L79/04 ,  H05K1/0353 ,  H05K1/056 ,  C08L79/085

Abstract: It is an object of the present invention to provide a resin composition which can realize a printed wired board having not only low water-absorbing property but also excellent heat resistance after moisture absorption, flame retardancy, and solvent solubility. It is another object of the present invention to provide a prepreg and a monolayer or laminate which use the resin composition, and a metal foil clad laminate and a printed wired board which use the prepreg. A resin composition of the present invention contains one or two or more cyanate ester compounds (A) represented by the following formula (1) and an epoxy resin (B): wherein R1, R2, R3, and R4 represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and may be the same or different from each other; and n represents an integer of 1 to 50.

Abstract translation: 本发明的目的是提供一种树脂组合物，其可以实现不仅具有低吸水性，而且在吸湿性，阻燃性和溶剂溶解度之后的耐热性优异的印刷线路板。 本发明的另一个目的是提供一种使用该树脂组合物的预浸料坯和单层或层压板，以及使用该预浸料的金属箔覆层压板和印刷线路板。 本发明的树脂组合物含有一种或两种以上由下式（1）表示的氰酸酯化合物（A）和环氧树脂（B）：其中R1，R2，R3和R4表示氢原子或 具有1-10个碳原子的烷基，可以相同或不同; n表示1〜50的整数。

公开(公告)号：US20160125972A1

公开(公告)日：2016-05-05

申请号：US14893295

申请日：2014-06-16

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Kenji ARII ,  Takashi KOBAYASHI ,  Masanobu SOGAME ,  Yoshinori MABUCHI ,  Hiroyuki MISHIMA

IPC: H01B3/40 ,  C08L61/18 ,  C08L63/00 ,  H05K1/03 ,  C09D163/00 ,  C08K3/36 ,  B32B15/092 ,  H01B3/30 ,  C09D161/18

CPC classification number: H01B3/40 ,  B32B15/092 ,  B32B15/14 ,  B32B27/12 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2457/08 ,  C08G10/04 ,  C08G14/12 ,  C08G73/0655 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/36 ,  C08L61/18 ,  C08L61/34 ,  C08L63/00 ,  C08L79/04 ,  C09D161/18 ,  C09D161/34 ,  C09D163/00 ,  C09D179/04 ,  C09J161/34 ,  C09J179/04 ,  H01B3/307 ,  H01B3/36 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012

Abstract: The resin composition of the present invention comprises a cyanate ester compound (A) obtained by cyanating a modified naphthalene formaldehyde resin, and an epoxy resin (B).

Abstract translation: 本发明的树脂组合物包含通过氰化改性萘甲醛树脂得到的氰酸酯化合物（A）和环氧树脂（B）。

公开(公告)号：US20180099484A1

公开(公告)日：2018-04-12

申请号：US15564889

申请日：2016-04-12

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takashi KOBAYASHI ,  Kentaro TAKANO

IPC: B32B15/092 ,  B32B27/20 ,  C08G59/40 ,  C08G61/02 ,  C08L63/00 ,  C08G73/06 ,  C08J5/24 ,  H05K1/03

CPC classification number: B32B15/092 ,  B32B27/20 ,  C08G59/40 ,  C08G61/02 ,  C08G73/06 ,  C08J5/24 ,  C08L63/00 ,  H05K1/03

Abstract: A resin composition comprising a cyanate compound (A) having a structure represented by the following formula (1): wherein Ar each independently represents an aromatic ring, R1 each independently represents a hydrogen atom, an alkyl group, or an aryl group, n represents 1.1 to 20 as an average value, l each independently represents number of bonded cyanato groups and is an integer of 1 to 3, m represents number of bonded R1 and represents number obtained by subtracting l from number of replaceable groups on Ar, and R2 each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and an epoxy resin (B).

公开(公告)号：US20180092218A1

公开(公告)日：2018-03-29

申请号：US15564073

申请日：2016-04-20

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takashi KOBAYASHI ,  Kentaro TAKANO

IPC: H05K3/00 ,  C08L63/00 ,  C08G59/22

CPC classification number: H05K3/0017 ,  B32B15/08 ,  C08G59/22 ,  C08G59/40 ,  C08J5/24 ,  C08K5/315 ,  C08L63/00 ,  C08L101/00 ,  C08L2203/206 ,  H05K1/03

Abstract: The present invention provides a resin composition comprising a cyanate compound (A); and an epoxy resin (B) represented by following general formula (1): wherein m and n each independently represent an integer of 1 or more; and the epoxy resin (B) represented by general formula (1) may be a mixture of compounds in which m and n each independently represent a different integer.