公开(公告)号：US20120186863A1

公开(公告)日：2012-07-26

申请号：US13355916

申请日：2012-01-23

申请人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Takuya HANDO ,  Hidetoshi WADA

发明人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Takuya HANDO ,  Hidetoshi WADA

IPC分类号： H05K1/02

CPC分类号： H05K1/111 ,  H01L23/12 ,  H01L23/32 ,  H01L24/00 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H05K1/113 ,  H05K3/0097 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/09745 ,  Y02P70/611

摘要： A multilayer wiring board including a build-up layer comprising a conductor layer and a resin insulation layer that are alternately layered, conductive pads formed on a surface of a resin insulation layer so as to project from the surface, and a solder layer formed over an upper surface of each of the conductive pads is provided. The upper surface of the conductive pads may have a recess, and the entire surface of the solder layer may be situated at an elevated position with respect to an outer periphery portion of the upper surface. Embodiments make it possible to feed and hold a sufficient amount of solder paste on the upper surface of conductive pads, thereby minimizing or eliminating the occurrence of defective connections to a semiconductor element and damage to the solder layer caused by an insufficient thickness of the solder layer.

摘要翻译： 一种多层布线基板，包括：交替层叠导体层和树脂绝缘层的堆积层，形成在表面突出的树脂绝缘层的表面的导电性焊盘，以及形成在 提供每个导电焊盘的上表面。 导电焊盘的上表面可以具有凹部，并且焊料层的整个表面可以相对于上表面的外周部分位于升高位置。 实施例使得可以在导电焊盘的上表面上馈送和保持足够量的焊膏，从而最小化或消除与半导体元件的不良连接的发生以及由焊料层的厚度不足引起的焊料层的损坏 。

公开(公告)号：US20120211271A1

公开(公告)日：2012-08-23

申请号：US13399547

申请日：2012-02-17

申请人： Takuya HANDO ,  Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Hidetoshi WADA

发明人： Takuya HANDO ,  Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO ,  Hidetoshi WADA

IPC分类号： H05K1/02

CPC分类号： H05K3/4007 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/01084 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/0367

摘要： A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.

摘要翻译： 一种多层布线基板，包括由一层或多层导体和树脂绝缘层形成的堆积层，所述导体和树脂绝缘层层叠在另一层之上，具有形成在至少一层树脂绝缘层的表面上的导电焊盘，以便从 提供表面。 导电垫可以各自包括位于其下部的柱状部分和位于其较高部分的凸部，其中凸部的表面可以呈现连续的弯曲形状。 可以在导电焊盘的上表面上形成焊料层。 某些实施例使得可以最小化或消除导电焊盘上的应力集中，并且可以抑制对半导体元件的不良连接的发生以及对导电焊盘的损坏。

公开(公告)号：US20120186864A1

公开(公告)日：2012-07-26

申请号：US13354043

申请日：2012-01-19

申请人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO

发明人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO

IPC分类号： H05K1/02 ,  H05K3/46

CPC分类号： B23K1/00 ,  B23K35/22 ,  B23K35/26 ,  C22C11/06 ,  C22C13/00 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68386 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2924/15174 ,  H01L2924/15312 ,  H05K3/4682 ,  H05K2201/10318 ,  H01L2924/014

摘要： A wiring board and a method for manufacturing the wiring board reinforced by means of a resin is provided. Embodiments of the wiring board allow for reliable attachment of a connection member, like a socket, to a terminal member. For example, a base of terminal pins is put on pin grid array (PGA) terminal pads, and a bonding material paste including solder and an electric insulation material made of a resin is placed on each of the PGA terminal pads. The bonding material paste is then heated to fuse the solder and soften the electric insulation material. Subsequently, the bonding material paste is cooled to solidify the solder and bond each of the bases to a corresponding PGA terminal pad and form an electric insulation surface layer on an exposed surface of each of solder junctions to which the respective bases are bonded.

摘要翻译： 提供了一种通过树脂加强的布线板和制造布线板的方法。 布线板的实施例允许将连接构件（如插座）可靠地附接到端子构件。 例如，将端子引脚的基座放置在引脚格栅阵列（PGA）端子焊盘上，并且将包含焊料的接合材料浆料和由树脂制成的电绝缘材料放置在每个PGA端子焊盘上。 然后将接合材料浆料加热以熔化焊料并软化电绝缘材料。 随后，将接合材料浆料冷却以固化焊料，并将每个基底结合到相应的PGA端子焊盘上，并在各个基底所接合的每个焊接点的暴露表面上形成电绝缘表面层。

公开(公告)号：US20120186857A1

公开(公告)日：2012-07-26

申请号：US13353965

申请日：2012-01-19

申请人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO

发明人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO

IPC分类号： H05K1/02 ,  H05K13/04

CPC分类号： H05K3/3478 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/16225 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H01L2924/00

摘要： A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted wiring board are provided. A bonding material paste, which can include solder and an electric insulation material made of a resin, can be placed on chip mount terminal pads and heated to fuse the solder and soften the electric insulation material. Subsequently, the solder is solidified to form solder bumps. Further, the electric insulation material is cured on a surface of each of the solder bumps and a surface of a multilayer board around each of the solder bumps to form an electric insulation surface layer. Accordingly, when a chip is mounted to such wiring boards, the electric insulation surface layer minimizes or eliminates the connection between adjacent solder bumps during re-fusing of the solder.

摘要翻译： 本发明提供一种电子部件安装用布线基板的制造方法，电子部件的安装用布线基板以及电子元件搭载布线基板的制造方法。 可以将包括焊料和由树脂制成的电绝缘材料的接合材料糊料放置在芯片安装端子焊盘上并加热以熔化焊料并软化电绝缘材料。 随后，焊料固化形成焊料凸块。 此外，电绝缘材料在每个焊料凸块的表面和每个焊料凸块周围的多层板的表面上固化，以形成电绝缘表面层。 因此，当芯片安装到这种布线板时，电绝缘表面层在焊料的再熔合期间使相邻焊料凸块之间的连接最小化或消除。

公开(公告)号：US20120111616A1

公开(公告)日：2012-05-10

申请号：US13290737

申请日：2011-11-07

申请人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO

发明人： Masahiro INOUE ,  Hajime SAIKI ,  Atsuhiko SUGIMOTO

IPC分类号： H05K1/09 ,  B23K31/02 ,  B23K1/00

CPC分类号： H05K3/4007 ,  B23K1/0016 ,  B23K26/384 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/172 ,  B23K2103/50 ,  H01L2224/16225 ,  H05K1/141 ,  H05K3/244 ,  H05K3/3442 ,  H05K3/3484 ,  Y02P70/613

摘要： An electronic-component-mounted wiring substrate provides enhanced joining reliability when an electronic component is joined to terminal pads of the wiring substrate, has sufficient strength, and can prevent generation of warpage and formation of a short circuit, which would otherwise occur as a result of re-melting of solder. Solder completely covers an entire surface of each of the terminal pads provided on a laminated substrate such that they project therefrom, and also joins to terminals of the electronic component. Therefore, each of the terminal pads and the solder are joined together reliably, and sufficient electrical continuity is secured therebetween. That is, the reliability of a joint between the solder and each terminal pad is extremely high, and the reliability of joint between the terminal pads and the electronic component is extremely high.

摘要翻译： 电子元件安装的布线基板当将电子元件接合到布线基板的端子焊盘时提供增强的连接可靠性，具有足够的强度，并且可以防止产生翘曲和形成短路，否则会发生这种情况。 的焊料再熔化。 焊料完全覆盖设置在层叠基板上的每个端子焊盘的整个表面，使得它们从其突出，并且还连接到电子部件的端子。 因此，端子焊盘和焊料中的每一个可靠地接合在一起，并且在它们之间确保了足够的电连续性。 也就是说，焊料和每个端子焊盘之间的接头的可靠性非常高，并且端子焊盘和电子部件之间的接合的可靠性非常高。

公开(公告)号：US20120048914A1

公开(公告)日：2012-03-01

申请号：US13217002

申请日：2011-08-24

申请人： Takahiro HAYASHI ,  Satoru WATANABE ,  Hajime SAIKI ,  Koji SAKUMA

发明人： Takahiro HAYASHI ,  Satoru WATANABE ,  Hajime SAIKI ,  Koji SAKUMA

IPC分类号： B23K1/20

CPC分类号： B23K1/0016 ,  B23K1/203 ,  B23K1/206 ,  B23K3/0623 ,  B23K2101/42 ,  H05K3/244 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/0959 ,  H05K2203/041 ,  H05K2203/1105

摘要： A wiring substrate manufacturing method includes: preparing a wiring substrate including a core layer having a principal surface, a resin insulating layer and a conductor layer alternately laminated to form at least one laminated layer on the one principal surface of the core layer, a solder resist layer including opening portions and formed on an outermost surface of the at least one laminated layer such that respective portions of an outermost conductor layer are exposed from the opening portions; forming a Sn-containing underlying layer on the respective portions of the outermost conductor layer by a plating process; and fusing the Sn-containing underlying layer to the respective portions of the outermost conductor layer by a heating process, then mounting solder balls directly on respective portions of the Sn-containing underlying layer, and then connecting the solder balls to the respective portions of the Sn-containing underlying layers.

摘要翻译： 布线基板的制造方法包括：准备布线基板，该布线基板包括具有主表面的芯层，树脂绝缘层和导体层，交替层叠以在芯层的一个主表面上形成至少一层叠层，阻焊层 层，其包括开口部，并且形成在所述至少一层叠层的最外表面上，使得最外导体层的各个部分从所述开口部露出; 通过电镀工艺在最外层导体层的各部分上形成含Sn的底层; 并通过加热处理将含Sn的底层与最外层导体层的各部分熔合，然后将焊球直接安装在含Sn底层的相应部分上，然后将焊球连接到 含Sn的底层。

公开(公告)号：US20120312590A1

公开(公告)日：2012-12-13

申请号：US13490850

申请日：2012-06-07

申请人： Shinnosuke MAEDA ,  Hajime SAIKI ,  Satoshi HIRANO

发明人： Shinnosuke MAEDA ,  Hajime SAIKI ,  Satoshi HIRANO

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/4007 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/544 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0269 ,  H05K1/113 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/09781 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49155

摘要： Disclosed is a method of manufacturing a multilayer wiring substrate having a principal plane of the substrate and a rear plane thereof, having a structure such that a plurality of resin insulating layers and a plurality of conductor layers are laminated, and a plurality of chip component connecting terminals to which chip components are connectable are disposed on the principal plane of the substrate. This method has a feature including a plating layer forming process in which product plating layers which provide the plurality of chip component connecting terminals and a dummy plating layer on the surrounding of the product plating layers are formed on the surface of an exposed outermost resin insulating layer at the principal plane of the substrate. This method permits a thickness dispersion of the chip component connecting terminals to be suppressed and permits a connection reliability thereof to the chip components to be increased.

摘要翻译： 公开了一种多层布线基板的制造方法，该多层布线基板具有基板的主面及其背面，具有层叠多个树脂绝缘层和多个导体层的结构，并且多个芯片部件连接 芯片部件可连接的端子设置在基板的主平面上。 该方法具有包括镀层形成工艺的特征，其中在露出的最外层树脂绝缘层的表面上形成了在产品镀层周围形成有多个芯片部件连接端子和虚拟镀层的产品镀层 在基板的主平面上。 该方法能够抑制芯片部件连接端子的厚度分散，并且能够提高芯片部件的连接可靠性。

公开(公告)号：US20120043371A1

公开(公告)日：2012-02-23

申请号：US13215661

申请日：2011-08-23

申请人： Takahiro HAYASHI ,  Satoru WATANABE ,  Hajime SAIKI ,  Koji SAKUMA

发明人： Takahiro HAYASHI ,  Satoru WATANABE ,  Hajime SAIKI ,  Koji SAKUMA

IPC分类号： B23K1/20

CPC分类号： B23K1/0016 ,  B23K1/206 ,  B23K35/3613 ,  B23K2101/42 ,  H05K3/244 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/0959 ,  H05K2203/041

摘要： A wiring substrate includes a conductor layer and a resin insulating layer stacked alternately, solder resist layers formed on outermost surfaces on a first principal surface side and an opposing second principal surface side respectively, and outermost conductor layers exposed from opening portions formed in the respective solder resist layers. A method of manufacturing the wiring substrate includes: forming a first underlying layer and a second underlying layer on the respective outermost conductor layers; supplying a first solder onto the first underlying layer, and a second solder onto the second underlying layer; and connecting the first solder to the first underlying layer and the second solder to the second underlying layer respectively, by heating the first solder and the second solder simultaneously.

摘要翻译： 布线基板包括交替堆叠的导体层和树脂绝缘层，分别形成在第一主表面侧和相对的第二主表面侧的最表面上的阻焊层，以及从形成在各个焊料中的开口部露出的最外面的导体层 抗蚀剂层。 制造布线基板的方法包括：在各个最外层导体层上形成第一下层和第二下层; 将第一焊料供应到所述第一下层上，将第二焊料提供到所述第二下层上; 以及通过同时加热所述第一焊料和所述第二焊料，将所述第一焊料与所述第一下层和所述第二焊料分别连接到所述第二下层。