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公开(公告)号：US6132852A
公开(公告)日：2000-10-17
申请号：US267166
申请日：1999-03-12
CPC分类号： H05K3/4626 , C08G73/0627 , Y10T428/12493 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： A multilayer wiring substrate using a resin composition comprising polyquinoline compound and bismaleimide compound as essential ingredients between wiring-carrying resin layers as insulating layers forms no void at the time of lamination, has an excellent adhesive property at various interfaces, has a heat stability after lamination and is high in reliability, so that, it is applicable to many fields not only including the multilayer wiring substrates capable of mounting LSI or tip carrier directly but also including multilayer wiring substrate for work station, mounting substrates for small-sized electronic devices such as camera and video for people's use, and high frequency multitip module multilayer substrate.
摘要翻译： 使用包含聚喹啉化合物和双马来酰亚胺化合物的树脂组合物作为绝缘层的布线承载树脂层之间的必要成分的多层布线基板在层压时不会形成空隙，在各界面具有优异的粘合性，层压后具有热稳定性 并且可靠性高，因此可以应用于不仅包括能够直接安装LSI或尖端载体的多层布线基板的许多领域，而且包括用于工作站的多层布线基板，用于小型电子设备的安装基板 相机和视频供人们使用，以及高频多点模块多层基板。
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公开(公告)号：US5958600A
公开(公告)日：1999-09-28
申请号：US981835
申请日：1998-01-09
申请人： Hideo Sotokawa , Akira Yabushita , Takashi Inoue , Hidetaka Shigi , Mamoru Ogihara , Haruhiko Matsuyama , Minoru Tanaka , Yasunori Narizuka
发明人： Hideo Sotokawa , Akira Yabushita , Takashi Inoue , Hidetaka Shigi , Mamoru Ogihara , Haruhiko Matsuyama , Minoru Tanaka , Yasunori Narizuka
IPC分类号： H01L23/498 , H01L23/538 , B32B15/08 , G03C3/00 , H05K1/09
CPC分类号： H01L23/5384 , H01L23/49866 , H01L23/49894 , H01L23/5385 , H01L2224/16225 , H01L2924/09701 , H01L2924/15312 , Y10S428/901 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： Disclosed are a highly reliable circuit board and a method of stably manufacturing the circuit board, wherein an insulator made from a specific organic insulating material is provided under a highly stressed conductor for preventing occurrence of cracks in the insulator. In addition, a method of correcting a wiring of a ceramic board is additionally adopted. The circuit board includes a thick film wiring board 1 having a first conductor pattern 2 and a thin film layer laminated on the first conductor pattern 2. The thin film layer includes a first insulator 5 on the first conductor pattern 2; a second insulator 10 on the first insulator 5; a second conductor pattern 8 formed on the first insulator 5 in such a manner as to partially pass through the first insulator 5 and to be electrically connected to the first conductor pattern 2; a wiring pattern 9 for circuit correction formed on the first insulator 5; and a third conductor pattern 11 passing through the first insulator 5 and the second insulator 10 and electrically connected to the second conductor pattern 8.
摘要翻译： PCT No.PCT / JP96 / 01909 Sec。 371日期1998年1月9日 102（e）1998年1月9日PCT PCT 1996年7月10日PCT公布。 出版物WO97 / 03542 日期1997年1月30日公开是一种高度可靠的电路板和稳定制造电路板的方法，其中由特定有机绝缘材料制成的绝缘体设置在高应力导体下面，以防止在绝缘体中发生裂纹。 此外，另外采用校正陶瓷板的布线的方法。 电路板包括具有层叠在第一导体图案2上的第一导体图案2和薄膜层的厚膜布线板1.薄膜层包括在第一导体图案2上的第一绝缘体5; 第一绝缘体5上的第二绝缘体10; 形成在第一绝缘体5上的部分地通过第一绝缘体5并与第一导体图案2电连接的第二导体图案8; 在第一绝缘体5上形成用于电路校正的布线图案9; 以及穿过第一绝缘体5和第二绝缘体10并电连接到第二导体图案8的第三导体图案11。
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公开(公告)号：US5868949A
公开(公告)日：1999-02-09
申请号：US557320
申请日：1995-11-14
申请人： Hideo Sotokawa , Masashi Nishiki , Eiji Matsuzaki , Hidetaka Shigi , Toshio Terouchi , Mamoru Ogihara , Haruhiko Matsuyama , Minoru Tanaka
发明人： Hideo Sotokawa , Masashi Nishiki , Eiji Matsuzaki , Hidetaka Shigi , Toshio Terouchi , Mamoru Ogihara , Haruhiko Matsuyama , Minoru Tanaka
CPC分类号： H05K1/112 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/0154 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/10674 , H05K3/4605 , Y10T428/24917
摘要： A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a polyimide insulative film of low thermal expansion coefficient is present between at least an end of a pattern of the second conductor layer and the first conductor layer, for stably obtaining a metalization structure of high reliability and free from the worry of peeling of the conductor portion from a substrate or occurrence of cracking to the underlying layer.
摘要翻译： 一种金属化结构，其具有在下层的表面上的第一导体层，并且还具有与第一导体层导电连接的第二导体层，其中热膨胀系数低的聚酰亚胺绝缘膜存在于第一导体层的至少一端 第二导体层和第一导体层的图案，用于稳定地获得高可靠性的金属化结构，并且不会导致导体部分从基板剥离或者发生开裂到下层。
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公开(公告)号：US5208656A
公开(公告)日：1993-05-04
申请号：US674605
申请日：1991-03-25
申请人： Haruhiko Matsuyama , Mitsuo Yoshimoto , Jun Tanaka , Fusaji Shoji , Hitoshi Yokono , Takashi Inoue , Tetsuya Yamazaki , Minoru Tanaka , Hidetaka Shigi
发明人： Haruhiko Matsuyama , Mitsuo Yoshimoto , Jun Tanaka , Fusaji Shoji , Hitoshi Yokono , Takashi Inoue , Tetsuya Yamazaki , Minoru Tanaka , Hidetaka Shigi
IPC分类号： H05K3/46 , H01L21/60 , H01L23/498
CPC分类号： H01L23/49827 , H01L23/49822 , H01L2924/0002 , H01L2924/09701
摘要： A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.
摘要翻译： 通过使金属布线层通过金属如Cr，Mo等在表面上进行稳定化处理或水玻璃水溶液，可以以良好的生产率制造具有高可靠性的多层布线基板，以防止产生小丘或 晶须并改善耐化学性。
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公开(公告)号：US08513235B2
公开(公告)日：2013-08-20
申请号：US12937187
申请日：2009-04-10
申请人： Akira Nakao , Hiroko Suzuki , Ryo Tatsumi , Maki Seki , Minoru Tanaka , Tomofumi Setsuta , Hiroshi Iwasaki
发明人： Akira Nakao , Hiroko Suzuki , Ryo Tatsumi , Maki Seki , Minoru Tanaka , Tomofumi Setsuta , Hiroshi Iwasaki
IPC分类号： C07C237/10 , C07C237/12 , C07C255/60 , C07D209/44 , C07D271/06 , C07D295/22 , C07D295/32 , C07D401/12 , C07D403/12 , C07D405/12 , C07D409/12 , C07D413/12 , C07D413/14 , C07D487/04 , A61K31/55 , A61K31/4035 , A61K31/165 , A61K31/495 , A61K31/4245 , A61K31/454 , A61K31/4196 , A61K31/422 , A61K31/427 , A61K31/416 , A61K31/501 , A61P9/10
CPC分类号： C07D209/44 , C07C237/10 , C07C255/60 , C07C2602/08 , C07D271/06 , C07D295/22 , C07D401/12 , C07D403/12 , C07D405/12 , C07D409/12 , C07D413/12 , C07D417/12
摘要： The invention provides a homocysteine synthase inhibitor useful for the prophylaxis or treatment of diseases involving homocysteine synthase. The homocysteine synthase inhibitor is a compound of the formula (I) wherein each symbol is as defined herein, or a pharmacologically acceptable salt thereof, or a solvate thereof.
摘要翻译： 本发明提供了可用于预防或治疗涉及同型半胱氨酸合酶的疾病的同型半胱氨酸合成酶抑制剂。 同型半胱氨酸合成酶抑制剂是式（I）的化合物，其中每个符号如本文所定义，或其药理学上可接受的盐或其溶剂合物。
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公开(公告)号：US08147753B2
公开(公告)日：2012-04-03
申请号：US12593707
申请日：2008-03-28
CPC分类号： A61M1/1698 , A61M1/1625 , B01D53/22 , B01D63/02 , B01D2313/38 , B01D2325/38
摘要： A heat exchanger includes a plurality of tubes 2 through an inner cavity of which a heat-transfer medium liquid flows, a sealing member 6 that seals the plurality of tubes 2 while exposing both ends thereof, with a blood channel passing outside each of the tubes 2 being formed in a central portion in the axial direction of the tubes, and a housing 5 that accommodates the tubes 2 sealed with the sealing member 6. The heat exchanger further includes a hollow fiber membrane 3 that is formed of a plurality of hydrophobic and gas permeable hollow fibers 4 and that is disposed on at least one of an entrance side and an exit side of the blood channel in the housing 5 so that a liquid flowing through the blood channel passes through the hollow fiber membrane 3. The housing 5 includes openings 10 for exposing open ends of each of the hollow fibers 4 forming the hollow fiber membrane 3 to the outside, and gaps between an inner side of the openings and the hollow fibers 4 are sealed. Air can be removed while suppressing a reduction in the heat exchange efficiency.
摘要翻译： 热交换器包括通过其中传热介质液体流动的内腔的多个管2，密封件6，其密封多个管2，同时暴露其两端，通过每个管外的血液通道 2形成在管的轴向的中心部分和容纳用密封构件6密封的管2的壳体5.热交换器还包括中空纤维膜3，该中空纤维膜3由多个疏水性和 透气性中空纤维4，其设置在壳体5中的血液通道的入口侧和出口侧的至少一方，使得流过血液通道的液体通过中空纤维膜3.壳体5包括 用于将形成中空纤维膜3的每个中空纤维4的开口端暴露于外部的开口10，并且开口的内侧和中空纤维4之间的间隙被密封。 可以在抑制热交换效率的降低的同时除去空气。
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公开(公告)号：US08115106B2
公开(公告)日：2012-02-14
申请号：US12323468
申请日：2008-11-25
申请人： Minoru Tanaka , Seishi Watanabe
发明人： Minoru Tanaka , Seishi Watanabe
IPC分类号： H05K1/18
CPC分类号： H01L33/62 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05599 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48997 , H01L2224/49429 , H01L2224/73265 , H01L2224/85399 , H01L2224/85951 , H01L2924/00014 , H01L2924/07802 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H01L2924/19107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/48455
摘要： The disclosed subject matter includes a surface mount electronic device with high reliability and favorable optical characteristics. The surface mount electronic device can include a circuit board with at least one conductor pattern formed on an insulating board and an electronic component that is mounted on a die bonding pad located on the at least one conductor pattern with an adhesive material. The die bonding pad can include a plurality of cutout sections that expose the insulating board and extend towards a center from a circumference thereof. Therefore, the adhesive material can adhere to both the die bonding pad and the insulating board exposed in the plurality of cutout sections along with the electronic component. In this case, the plurality of cutout sections can be formed so as not to drag the adhesive material upwards on each of the side surfaces of the electronic component. Thus, the surface mount electronic device can improve reliability thereof while maintaining predetermined optical characteristics.
摘要翻译： 所公开的主题包括具有高可靠性和良好光学特性的表面贴装电子器件。 表面贴装电子器件可以包括具有形成在绝缘板上的至少一个导体图案的电路板和安装在位于至少一个导体图案上的芯片接合焊盘上的电子部件，该粘合垫具有粘合材料。 芯片接合焊盘可以包括多个切口部分，其暴露绝缘板并从其圆周向中心延伸。 因此，粘合剂材料可以与电子部件一起粘附到裸露接合焊盘和暴露在多个切除部分中的绝缘板。 在这种情况下，可以形成多个切口部，以便在电子部件的每个侧表面上不向上拖动粘合材料。 因此，表面贴装电子器件可以在保持预定的光学特性的同时提高其可靠性。
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公开(公告)号：US07830107B2
公开(公告)日：2010-11-09
申请号：US11988227
申请日：2006-07-03
申请人： Satoshi Inoue , Masayuki Kato , Kazushi Hirose , Takao Koba , Yoshihiro Fujimura , Minoru Tanaka , Hiroki Nishida , Takashi Inoue
发明人： Satoshi Inoue , Masayuki Kato , Kazushi Hirose , Takao Koba , Yoshihiro Fujimura , Minoru Tanaka , Hiroki Nishida , Takashi Inoue
IPC分类号： G05B5/00
CPC分类号： H02H7/0851 , E05F11/445 , E05F15/41 , E05F15/695 , E05Y2400/554 , E05Y2400/58 , E05Y2900/55 , H02H3/44 , H02H7/093
摘要： A safety device for power window comprises a storage unit for storing the pulse width change rate of continuous pulses detected by a pulse width detector during a window glass raising operation at a reference timing, a calculation unit for calculating the pulse width change rate of continuous pulses detected by the pulse width detector during a window glass raising operation at an operational timing and a control unit for comparing the stored value of a pulse width change rate with the calculated value of a pulse width change rate and driving a motor for raising/lowering window glass in a window opening direction when a total of differences between the both pulse change rates exceeds an allowable value.
摘要翻译： 一种用于电动窗的安全装置，包括存储单元，用于存储在参考定时的窗玻璃提升操作期间由脉冲宽度检测器检测到的连续脉冲的脉宽变化率;计算单元，用于计算连续脉冲的脉宽变化率 在操作定时的窗玻璃提升操作期间由脉冲宽度检测器检测的脉冲宽度变化率的存储值与计算出的脉冲宽度变化率的值进行比较，并且驱动用于升高/降低窗口的电动机 当两个脉冲变化率之间的总差异超过允许值时，窗口打开方向上的玻璃。
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公开(公告)号：US20100114004A1
公开(公告)日：2010-05-06
申请号：US12593707
申请日：2008-03-28
CPC分类号： A61M1/1698 , A61M1/1625 , B01D53/22 , B01D63/02 , B01D2313/38 , B01D2325/38
摘要： A heat exchanger includes a plurality of tubes 2 through an inner cavity of which a heat-transfer medium liquid flows, a sealing member 6 that seals the plurality of tubes 2 while exposing both ends thereof, with a blood channel passing outside each of the tubes 2 being formed in a central portion in the axial direction of the tubes, and a housing 5 that accommodates the tubes 2 sealed with the sealing member 6. The heat exchanger further includes a hollow fiber membrane 3 that is formed of a plurality of hydrophobic and gas permeable hollow fibers 4 and that is disposed on at least one of an entrance side and an exit side of the blood channel in the housing 5 so that a liquid flowing through the blood channel passes through the hollow fiber membrane 3. The housing 5 includes openings 10 for exposing open ends of each of the hollow fibers 4 forming the hollow fiber membrane 3 to the outside, and gaps between an inner side of the openings and the hollow fibers 4 are sealed. Air can be removed while suppressing a reduction in the heat exchange efficiency.
摘要翻译： 热交换器包括通过其中传热介质液体流动的内腔的多个管2，密封件6，其密封多个管2，同时暴露其两端，通过每个管外的血液通道 2形成在管的轴向的中心部分和容纳用密封构件6密封的管2的壳体5.热交换器还包括中空纤维膜3，该中空纤维膜3由多个疏水性和 透气性中空纤维4，其设置在壳体5中的血液通道的入口侧和出口侧的至少一方，使得流过血液通道的液体通过中空纤维膜3.壳体5包括 用于将形成中空纤维膜3的每个中空纤维4的开口端暴露于外部的开口10，并且开口的内侧和中空纤维4之间的间隙被密封。 可以在抑制热交换效率的降低的同时除去空气。
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公开(公告)号：US20090176925A1
公开(公告)日：2009-07-09
申请号：US12299822
申请日：2007-05-17
申请人： Morikatsu Matsunaga , Yoshio Mori , Minoru Tanaka
发明人： Morikatsu Matsunaga , Yoshio Mori , Minoru Tanaka
IPC分类号： C08K3/20
CPC分类号： C09D17/00 , B01F17/0028 , C04B24/2647 , C04B28/02 , C09D7/45 , C09D11/03 , C09D11/326 , C09D17/002 , C04B14/10
摘要： To provide a dispersing agent that contains a water-soluble polymer that has excellent dispersibility and stability over time even for a high concentration of a dispersoid such as a pigment and can give a pigment slurry having stable viscosity characteristics and redispersibility due to a large dispersion stabilization effect.A dispersing agent containing a water-soluble polymer and/or an alkali metal salt or an ammonium salt of the water-soluble polymer, the water-soluble polymer containing (A) an ethylenically unsaturated monocarboxylic acid monomer or an anhydride thereof, or an ethylenically unsaturated dicarboxylic acid monomer or an anhydride thereof, and (B) a polyether compound, a ratio [(B)/(A)] of the number of moles of alkylene oxide added in component (B) relative to the number of moles of carboxyl group in component (A) being no greater than 0.6, and component (B) being less than 25 wt % relative to the total amount.
摘要翻译： 为了提供含有水溶性聚合物的分散剂，即使对于颜料等分散质的高浓度也具有优异的分散性和稳定性，并且可以得到由于大的分散稳定性而具有稳定的粘度特性和再分散性的颜料浆料 影响。 含有水溶性聚合物和/或水溶性聚合物的碱金属盐或铵盐的分散剂，含有（A）烯属不饱和一元羧酸单体或其酸酐的水溶性聚合物或烯键式 不饱和二羧酸单体或其酸酐，和（B）聚醚化合物，组分（B）中加入的环氧烷烃的摩尔数相对于羧基摩尔数的比例[（B）/（A）] 组分（A）中的基团不大于0.6，组分（B）相对于总量小于25重量％。
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